Product Reliability Engineer – HTOL/Burn-In Development (MCC/C-Breez)

ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career. THE ROLE: Join a global product reliability team that drives product qualifications for the next generation Datacenters and Servers, leveraging advanced silicon and packaging technologies. This position is a highly visible role within the AMD engineering team and is responsible for developing end-to-end Hardware and Software solutions for High Temperature Operating Life (HTOL) and Burn-in test to characterize silicon reliability behavior for new products to align with AMD product and customer requirements. The position provides influence that mandates strong technical and analytical skills. THE PERSON: This role is well suited to a self-motivated and collaborative semiconductor reliability engineer with hands-on experience developing HTOL and Burn-In hardware and stress-test programs. The ideal candidate brings direct experience with Micro Control Company (MCC) Burn-In platforms and the C-Breez software environment. Direct Burn-In development and MCC/C-Breez experience are central to the scope of this position. While broader semiconductor reliability, qualification, or ATE experience is valuable, this position is especially focused on direct Burn-In development and MCC/C-Breez experience. You take end-to-end ownership of BIB hardware design, test-pattern integration, hardware bring-up, and program debug while collaborating effectively with design, product engineering, suppliers, and global reliability laboratories. You are a team-oriented contributor focused on collaboration, knowledge sharing, and expanding overall team success. KEY RESPONSIBILITIES: Starting in early product development cycle, collaborating with cross-functional teams to design custom High-Power Burn-In Boards (BIBs) for CPU and GPUs. Interface with PCB fabrication and socket manufacturers to guide board development. Establish HTOL/BI pattern requirements for development of stress programs and work with design validation and product engineering teams to bring-up burn-in DFT patterns. Integrate patterns into stress programs, debug, and maintain reliability test code, utilizing the native MCC C-Breez environment or associated platform software. Lead hardware validation of First Article boards for HTOL and Burn-in, debug hardware and PNP software issues. Communicate with offshore factories and reliability labs during HTOL/BI hardware and test program brin-up. Conduct test data analysis Pre/Post Burn-in experiments to identify opportunities for test program optimization. Create data-logging scripts to capture parametric drift, test logs, and qualification metrics. Expanded role to support ESD and Latch-up hardware and stress program development. PREFERRED EXPERIENCE: Knowledge of HTOL/BI board schematics, layout and PCB development to define requirements. Knowledge of HTOL/BI DFT pattern architecture, pattern vector timing. Hands-on experience of programming such as Python/C++/SQL and scripting language. Knowledge of test pattern architecture, vector translation, vector timing diagrams and developing programs to enable HTOL/BI stress testing. Experience in Product Reliability Engineering, with exposure to Product Engineering, Test, HTOL/BI environment and test methodology. Experience with oscilloscope and logic analyzer equipment to debug Burn-in-Boards. Knowledge of Computer and processor Architecture concepts, a plus. Knowledge of modeling techniques to develop DOE experiments for Burn-in optimization, a plus. Knowledge of device degradation models for production guardbands, a plus. Strong communication skills including data presentation. ACADEMIC CREDENTIALS: BS or MS in Electrical Engineering, Computer Engineering or equivalent. This role is not eligible for visa sponsorship. #LI-CJ2 Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.

THE ROLE: Join a global product reliability team that drives product qualifications for the next generation Datacenters and Servers, leveraging advanced silicon and packaging technologies. This position is a highly visible role within the AMD engineering team and is responsible for developing end-to-end Hardware and Software solutions for High Temperature Operating Life (HTOL) and Burn-in test to characterize silicon reliability behavior for new products to align with AMD product and customer requirements. The position provides influence that mandates strong technical and analytical skills. THE PERSON: This role is well suited to a self-motivated and collaborative semiconductor reliability engineer with hands-on experience developing HTOL and Burn-In hardware and stress-test programs. The ideal candidate brings direct experience with Micro Control Company (MCC) Burn-In platforms and the C-Breez software environment. Direct Burn-In development and MCC/C-Breez experience are central to the scope of this position. While broader semiconductor reliability, qualification, or ATE experience is valuable, this position is especially focused on direct Burn-In development and MCC/C-Breez experience. You take end-to-end ownership of BIB hardware design, test-pattern integration, hardware bring-up, and program debug while collaborating effectively with design, product engineering, suppliers, and global reliability laboratories. You are a team-oriented contributor focused on collaboration, knowledge sharing, and expanding overall team success. KEY RESPONSIBILITIES: Starting in early product development cycle, collaborating with cross-functional teams to design custom High-Power Burn-In Boards (BIBs) for CPU and GPUs. Interface with PCB fabrication and socket manufacturers to guide board development. Establish HTOL/BI pattern requirements for development of stress programs and work with design validation and product engineering teams to bring-up burn-in DFT patterns. Integrate patterns into stress programs, debug, and maintain reliability test code, utilizing the native MCC C-Breez environment or associated platform software. Lead hardware validation of First Article boards for HTOL and Burn-in, debug hardware and PNP software issues. Communicate with offshore factories and reliability labs during HTOL/BI hardware and test program brin-up. Conduct test data analysis Pre/Post Burn-in experiments to identify opportunities for test program optimization. Create data-logging scripts to capture parametric drift, test logs, and qualification metrics. Expanded role to support ESD and Latch-up hardware and stress program development. PREFERRED EXPERIENCE: Knowledge of HTOL/BI board schematics, layout and PCB development to define requirements. Knowledge of HTOL/BI DFT pattern architecture, pattern vector timing. Hands-on experience of programming such as Python/C++/SQL and scripting language. Knowledge of test pattern architecture, vector translation, vector timing diagrams and developing programs to enable HTOL/BI stress testing. Experience in Product Reliability Engineering, with exposure to Product Engineering, Test, HTOL/BI environment and test methodology. Experience with oscilloscope and logic analyzer equipment to debug Burn-in-Boards. Knowledge of Computer and processor Architecture concepts, a plus. Knowledge of modeling techniques to develop DOE experiments for Burn-in optimization, a plus. Knowledge of device degradation models for production guardbands, a plus. Strong communication skills including data presentation. ACADEMIC CREDENTIALS: BS or MS in Electrical Engineering, Computer Engineering or equivalent. This role is not eligible for visa sponsorship. #LI-CJ2

Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.