Staff Structural Simulation Engineer

About Rivian Rivian is on a mission to keep the world adventurous forever. This goes for the emissions-free Electric Adventure Vehicles we build, and the curious, courageous souls we seek to attract. As a company, we constantly challenge what’s possible, never simply accepting what has always been done. We reframe old problems, seek new solutions and operate comfortably in areas that are unknown. Our backgrounds are diverse, but our team shares a love of the outdoors and a desire to protect it for future generations. Role Summary As a Staff Structural Simulation Engineer, you will lead structural and thermo-mechanical risk management for advanced vehicle electronics through high-fidelity numerical simulations. You will define critical design requirements for integrated PCB layouts, enclosures, and cooling architectures to ensure aggressive hardware reliability targets are met. Your role involves establishing material characterization protocols and sophisticated model correlation to maintain world-class simulation fidelity. You will serve as a technical authority, driving strategic cross-functional decisions and leading complex root-cause analysis for pioneering electrical hardware to guide multidisciplinary teams toward engineering excellence. Responsibilities Risk Management & Strategy: Spearhead structural and thermo-mechanical design risk management for low-voltage electronics assemblies within pioneering vehicle electrical hardware. Numerical Simulation & Analysis: Execute multi-scale numerical simulations (e.g., random vibrations, shock, thermal-cycling) for electronics assemblies to establish and meet aggressive functional performance and reliability targets. Haptic Switches & Tactile Interfaces: Conduct structural stiffness assessments and actuation mechanics simulations for haptic switches and touch surfaces to define baseline tactile feel, deformation limits, and long-term switch response. Human Comfort & Aggressive Ergonomic Loading: Perform non-linear structural evaluations under human comfort loading and aggressive abuse scenarios (such as localized over-actuation, high-impact press forces, and mishandling) to prevent plastic deformation or fatigue failure. Sensor & Low-Voltage Electronics Packages: Direct multi-physics simulations for critical low-voltage electronic modules and sensing hardware (e.g., radar, ultrasonic, optical, and positional sensors) to minimize thermal/mechanical distortion and structural deflection under operational and environmental stress. PCB & Component Optimization: Define structural risk margins, dictate component selection, and optimize component layout on heterogeneously integrated printed circuit boards, driving significant performance gains. Design Guidance & Architecture: Deliver comprehensive design guidance, including setting enclosure stiffness requirements, defining thermal stack-up, optimizing cooling architecture, and specifying material systems to electronics assembly design teams. Material Characterization & Database Management: Establish material characterization protocols and manage the centralized simulation material database for critical electronics components, polymers, and elastomers, ensuring simulation fidelity. Benchmarking & Model Correlation: Direct, manage, and validate structural benchmarking activities, including sophisticated model correlation through advanced techniques like sine-sweep testing and high-fidelity strain gauge measurements. Validation & Root-Cause Analysis: Provide simulation expertise and strategic support to reliability engineering teams for complex root-cause analysis during rigorous testing and validation cycles. Cross-Functional Technical Leadership: Drive critical, cross-functional program decisions and consensus across multidisciplinary engineering teams, serving as a technical authority to ensure unparalleled product and engineering excellence. Qualifications Master's Degree in Mechanical or Aerospace Engineering or equivalent; Ph.D. preferred. 3-5 years (Ph.D) / 5-7 years (M.S.) of relevant industry experience working on problems in Structural Mechanics for electronics assemblies. Solid understanding of theoretical and experimental structural mechanics with excellent domain knowledge in Non-Linear analysis, Explicit Analysis, Linear Dynamics and Vibrations, and Coupled Thermal-Structural analysis. Demonstrated expertise in IC package (electronics package) design, materials, and common Chip-Package Interaction (CPI) failure modes across diverse applications, including high-power semiconductors and high-performance compute (e.g., AI and ADAS chips). Expertise in material testing, tensile testing, designing customized test fixtures, and calibrating FEA models for versatile material types (adhesives, foams, elastomers, plastics, metals, brittles, etc.). Broad understanding of structural composition and manufacturing of diverse package types, including Ball Grid Arrays (BGAs), System-on-Chip (SoC), and System-in-Package (SiP). Strong foundation in FEA solvers, particularly Ansys, Abaqus, Optistruct, and SimLab/SimSolid, with proven ability to independently set up, execute, and troubleshoot analysis convergence issues. Proficient in pre/post-processing tools such as Hypermesh, ANSA/Meta, SimLab, etc. Excellent understanding of constitutive models and failure modes in metals, plastics, and elastomers. Proficient with using Python/Matlab for running analysis and post-analysis data processing. Experience developing and leading other multidisciplinary engineers. Excellent communication skills across all functions and levels. Excellent documentation practices. Fluent written and spoken English. Pay Disclosure The salary range for this role is $137,000 - $172,000 for Irvine, CA based applicants. This is the lowest to highest salary we in good faith believe we would pay for this role at the time of this posting. An employee’s position within the salary range will be based on several factors including, but not limited to, specific competencies, relevant education, qualifications, certifications, experience, skills, geographic location, shift, and organizational needs. The successful candidate may be eligible for annual performance bonus and equity awards. We offer a comprehensive package of benefits for full-time and part-time employees, their spouse or domestic partner, and children up to age 26, including but not limited to paid vacation, paid sick leave, and a competitive portfolio of insurance benefits including life, medical, dental, vision, short-term disability insurance, and long-term disability insurance to eligible employees. You may also have the opportunity to participate in Rivian’s 401(k) Plan and Employee Stock Purchase Program if you meet certain eligibility requirements. Full-time employee coverage is effective on their first day of employment. Part-time employee coverage is effective the first of the month following 90 days of employment. More information about benefits is available at rivianbenefits.com. You can apply for this role through careers.rivian.com (or through internal-careers-rivian.icims.com if you are a current employee). This job is not expected to be closed any sooner than September 15th, 2026. Equal Opportunity Rivian is an equal opportunity employer and complies with all applicable federal, state, and local fair employment practices laws. All qualified applicants will receive consideration for employment without regard to race, color, religion, national origin, ancestry, sex, sexual orientation, gender, gender expression, gender identity, genetic information or characteristics, physical or mental disability, marital/domestic partner status, age, military/veteran status, medical condition, or any other characteristic protected by law. Rivian is committed to ensuring that our hiring process is accessible for persons with disabilities. If you have a disability or limitation, such as those covered by the Americans with Disabilities Act, that requires accommodations to assist you in the search and application process, please email us at [email protected]. Candidate Data Privacy and Technology Rivian may collect, use and disclose your personal information or personal data (within the meaning of the applicable data protection laws) when you apply for employment and/or participate in our recruitment processes (“Candidate Personal Data”). This data includes contact, demographic, communications, educational, professional, employment, social media/website, network/device, recruiting system usage/interaction, security and preference information. Rivian may use your Candidate Personal Data for the purposes of (i) tracking interactions with our recruiting system; (ii) carrying out, analyzing and improving our application and recruitment process, including assessing you and your application and conducting employment, background and reference checks; (iii) establishing an employment relationship or entering into an employment contract with you; (iv) complying with our legal, regulatory and corporate governance obligations; (v) recordkeeping; (vi) ensuring network and information security and preventing fraud; and (vii) as otherwise required or permitted by applicable law. Rivian may share your Candidate Personal Data with (i) internal personnel who have a need to know such information in order to perform their duties, including individuals on our People Team, Finance, Legal, and the team(s) with the position(s) for which you are applying; (ii) Rivian affiliates; and (iii) Rivian’s service providers, including providers of background checks, staffing services, and cloud services. Rivian may transfer or store internationally your Candidate Personal Data, including to or in the United States, Canada, the United Kingdom, and the European Union and in the cloud, and this data may be subject to the laws and accessible to the courts, law enforcement and national security authorities of such jurisdictions. How We Use AI in Our Hiring Process: To ensure transparency, we want candidates to know that Rivian uses iCIMS Talent Cloud Artificial Intelligence (TCAI) and AI-enabled tools to assist with screening, reviewing, organizing and highlighting profiles and applications that match the key requirements for each role. AI does not make hiring decisions: Qualified candidate applications are reviewed by a member of our team, and all decisions throughout the process are made by humans. We use AI to support efficiency and consistency, not to replace human judgment. We are committed to a fair, thoughtful, and equitable experience for every candidate. Participation in AI profile matching is entirely voluntary. If you prefer that your profile not be used in this process, you can opt out at any time. Opting out means your profile will be excluded from automated matching and will not be surfaced for additional roles through this system. Your current application remains active and will not be affected in any way. Please note that we are currently not accepting applications from third party application services.

Risk Management & Strategy: Spearhead structural and thermo-mechanical design risk management for low-voltage electronics assemblies within pioneering vehicle electrical hardware. Numerical Simulation & Analysis: Execute multi-scale numerical simulations (e.g., random vibrations, shock, thermal-cycling) for electronics assemblies to establish and meet aggressive functional performance and reliability targets. Haptic Switches & Tactile Interfaces: Conduct structural stiffness assessments and actuation mechanics simulations for haptic switches and touch surfaces to define baseline tactile feel, deformation limits, and long-term switch response. Human Comfort & Aggressive Ergonomic Loading: Perform non-linear structural evaluations under human comfort loading and aggressive abuse scenarios (such as localized over-actuation, high-impact press forces, and mishandling) to prevent plastic deformation or fatigue failure. Sensor & Low-Voltage Electronics Packages: Direct multi-physics simulations for critical low-voltage electronic modules and sensing hardware (e.g., radar, ultrasonic, optical, and positional sensors) to minimize thermal/mechanical distortion and structural deflection under operational and environmental stress. PCB & Component Optimization: Define structural risk margins, dictate component selection, and optimize component layout on heterogeneously integrated printed circuit boards, driving significant performance gains. Design Guidance & Architecture: Deliver comprehensive design guidance, including setting enclosure stiffness requirements, defining thermal stack-up, optimizing cooling architecture, and specifying material systems to electronics assembly design teams. Material Characterization & Database Management: Establish material characterization protocols and manage the centralized simulation material database for critical electronics components, polymers, and elastomers, ensuring simulation fidelity. Benchmarking & Model Correlation: Direct, manage, and validate structural benchmarking activities, including sophisticated model correlation through advanced techniques like sine-sweep testing and high-fidelity strain gauge measurements. Validation & Root-Cause Analysis: Provide simulation expertise and strategic support to reliability engineering teams for complex root-cause analysis during rigorous testing and validation cycles. Cross-Functional Technical Leadership: Drive critical, cross-functional program decisions and consensus across multidisciplinary engineering teams, serving as a technical authority to ensure unparalleled product and engineering excellence.

Master's Degree in Mechanical or Aerospace Engineering or equivalent; Ph.D. preferred. 3-5 years (Ph.D) / 5-7 years (M.S.) of relevant industry experience working on problems in Structural Mechanics for electronics assemblies. Solid understanding of theoretical and experimental structural mechanics with excellent domain knowledge in Non-Linear analysis, Explicit Analysis, Linear Dynamics and Vibrations, and Coupled Thermal-Structural analysis. Demonstrated expertise in IC package (electronics package) design, materials, and common Chip-Package Interaction (CPI) failure modes across diverse applications, including high-power semiconductors and high-performance compute (e.g., AI and ADAS chips). Expertise in material testing, tensile testing, designing customized test fixtures, and calibrating FEA models for versatile material types (adhesives, foams, elastomers, plastics, metals, brittles, etc.). Broad understanding of structural composition and manufacturing of diverse package types, including Ball Grid Arrays (BGAs), System-on-Chip (SoC), and System-in-Package (SiP). Strong foundation in FEA solvers, particularly Ansys, Abaqus, Optistruct, and SimLab/SimSolid, with proven ability to independently set up, execute, and troubleshoot analysis convergence issues. Proficient in pre/post-processing tools such as Hypermesh, ANSA/Meta, SimLab, etc. Excellent understanding of constitutive models and failure modes in metals, plastics, and elastomers. Proficient with using Python/Matlab for running analysis and post-analysis data processing. Experience developing and leading other multidisciplinary engineers. Excellent communication skills across all functions and levels. Excellent documentation practices. Fluent written and spoken English.