Skip to content
CV Rocket
Get started
How it worksThe enginePricingBlogContactSign in

Open nowPosted 14 hours agoWe saw it 92 min after it went up

Packaging Engineer

AMD1,335 open roles

Where
Hsinchu, Taiwan
Get the CV for this job

From $25 per CV, paid once. No subscription.

Your applicationOpen nowPackaging EngineerAMD · Hsinchu, Taiwan

  1. YouYes, apply to this one.

  2. CV RocketCV written for this posting.

  3. 25 readersRecruiter, hiring manager, skeptic. Round after round.

  4. CV RocketApplied on AMD's own form.

The reply lands in your private mailbox

3×more interviews than doing it yourself with ChatGPT.

The clock on this job

Early applications get read.

13.7% of postings close within 7 days. Measured by our own scanner across the market. AMD postings stay open a median of 45 days.

Share of postings closed within
  1. 2.3%1 day
  2. 4.8%3 days
  3. 13.7%7 days
  4. 22.1%14 days
  5. 37.6%30 days
  6. 59.1%60 days
This job: posted 14 hours ago

AMD median: 45 days open

The posting

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.

THE ROLE:

We are seeking a highly skilled and motivated Package Engineer to lead NPI‑to‑HVM transitions and drive end‑to‑end DFM integration between the advanced package technology team and external manufacturing sites, ensuring manufacturable designs, stable ramp‑up, and high‑volume production readiness and sustaining across a complex external manufacturing ecosystem.

In this role, you will be responsible for IC package industrialization and high-volume manufacturing readiness for AMD product portfolios. You will partner with package design, substrate engineering, product engineering, reliability, test, quality, supply chain, and program management to enable stable, scalable processes, deliver seamless NPI-to-HVM transfers, and drive yield, quality, and delivery performance across multiple external manufacturing sites.

The ideal candidate combines advanced packaging process expertise with strong manufacturing and operations acumen and excels at cross-functional integration and supplier enablement. Applying DFM, DOE, SPC, FMEA, 8D, and Lean/Six Sigma, you will establish robust Processes of Record (POR), mitigate manufacturing risks, and accelerate ramp readiness for next-generation computing platforms, from enterprise server and client products to high-power AI accelerators.

THE PERSON & KEY RESPONSIBILITIES:

NPI to HVM Industrialization, Manufacturing Operations, and Sustaining

  • Lead end-to-end NPI-to-HVM industrialization of advanced packages across external OSAT and foundry partners, ensuring design, process, equipment, and quality readiness before ramp.
  • Coordinate ramp plans, risk mitigation, and readiness reviews to ensure stable yield and predictable scale-up.
  • Support ongoing manufacturing and operations, and lead sustaining engineering to maintain stable yield, quality, and delivery in high-volume production.

Design for Manufacturing (DFM) Integration

  • Serve as the primary interface between package design, technology development, and external partners to ensure manufacturable package architectures.
  • Drive end-to-end DFM integration, identifying and closing manufacturability and technology-to-manufacturing gaps early.
  • Advance manufacturing methodologies and best practices across the supply chain.

External Supplier Manufacturing Management

  • Partner with OSATs, foundries, and substrate suppliers to ensure capability, capacity, and process maturity.
  • Monitor and drive yield, cycle time, quality, and delivery performance across external sites.
  • Lead supplier process optimization and defect reduction through regular technical reviews, audits, and ramp readiness assessments.

Yield, Quality, and Process Control

  • Drive continuous improvement using DOE, SPC, FMEA, and data-driven root cause analysis.
  • Lead cross-functional investigations of yield excursions, reliability risks, and field quality issues, ensuring timely containment and corrective action (8D).
  • Develop process monitoring and early-detection frameworks aligned with corporate quality, reliability, and qualification standards.

Cross-Functional Program Execution

  • Collaborate with product development, design, technology, reliability, product, test, supply chain, and program teams to ensure aligned execution.
  • Drive readiness reviews, risk assessments, and ramp governance across product lines.
  • Support cost, schedule, capacity, and production targets for Enterprise, Client, and AI accelerator products.

PREFERRED EXPERIENCE:

  1. Years in semiconductor packaging, assembly manufacturing, or product engineering, preferably in high-volume manufacturing.
  2. Proven record driving NPI and manufacturing ramps, including process qualification, manufacturing readiness, and yield ramp monitoring for advanced packaging platforms.
  3. Experience with OSATs, foundries, and substrate suppliers in ramp enablement, yield improvement, and manufacturing readiness, including leading technical reviews and issue resolution.
  4. Demonstrated success in yield improvement, defect reduction, and process optimization in high-volume manufacturing.
  5. Solid background in advanced packaging, including 2.5D interposer (e.g., CoWoS), wafer-level fan-out (WLFO), and high-density flip-chip, with familiarity in RDL and TCB processes.
  6. Solid understanding of Design for Manufacturing (DFM) principles for package design and assembly.
  7. Proven problem solving and root cause analysis using DOE, SPC, FMEA, and 8D, with strong data-driven decision making to improve yield, quality, and processes.
  8. Proven cross-functional collaboration with package design, product engineering, reliability, quality, test, supply chain, and program management teams.
  9. Excellent communication and stakeholder management, translating complex engineering challenges into clear action plans for internal teams and suppliers.
  10. Fluent in English and Mandarin with strong written and verbal communication skills; Korean language capability is a plus.

ACADEMIC CREDENTIALS:

  • Bachelor’s or master’s degree in mechanical engineering, Materials Science, Electrical Engineering, Chemical Engineering, or a related engineering discipline.

LOCATION:

Hsinchu, Taiwan

#LI-SH1

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

From $25, paid onceGet the CV for this job

What happens when you press

One press. We do the rest.

  1. A CV for this posting

    Written against AMD's own wording, from every piece of relevant proof in your profile.

  2. 25 readers review it

    Recruiter, hiring manager, skeptic and more read every draft, round after round. You get the best round.

    The review screen in CV Rocket: how each CV was read, round by round.

  3. We apply on AMD's form

    Our application engine gets through the hardest forms there are. Where a question needs you, AI suggests the best answer. Don't want us applying from our IP addresses? Use our Chrome extension: we apply straight from your own browser.

    An application in CV Rocket: every answer filled in on the employer's form.

  4. Every reply, sorted

    AMD's answer lands in your private mailbox, and we classify it on arrival: interview, question, rejection.

    The CV Rocket inbox: each employer reply classified as an interview, an action or a rejection.

  5. Reply with AI

    AI helps you write the email, checks it and sends it. We show you whether the recruiter read it.

  6. The interview in your calendar

    Full integration with your calendar. The invitation goes straight in.

    An interview invitation in the CV Rocket inbox, added to the candidate's calendar.
Get the CV for this job

From $25 per CV, paid once. No subscription.

Why it works

3×

more interviews than doing it yourself with ChatGPT.

ChatGPT writes a CV and never learns what happened to it. We see every reply. For each CV we know:

  • How it was written, and how the review scored it
  • When we applied, and how long after the posting went up
  • Which posting, which company, which city
  • Who got the interview, and who heard nothing

That is how we know which CVs get called.

Get the CV for this job

From $25 per CV, paid once. No subscription.

The numbers game

More applications. More interviews.

Every application goes out with its own CV, written for that posting and paid once. Send enough of them and the law of large numbers finds you the job.

Get the CV for this job
By hand5–10
With CV Rocket100
applications a day

Nearby

Live postings like this one

Same employer first, then the same role elsewhere.

Before you press

Straight answers

Get the CV for this job

From $25 per CV, paid once. No subscription.

What if my background isn't good enough?

We make the most of the background you have. The CV uses every piece of relevant proof your profile holds, and one of the 25 readers reads your whole profile and flags what the CV left out.

Do you really apply for me?

Yes, on the employer's own form, the hardest ones included. Where a question needs you, you answer it right there and AI suggests the best answer. Don't want us applying from our IP addresses? Use our Chrome extension: we apply straight from your own browser.

Is it a subscription?

No. You pay once per CV, from $25. Every application goes out with its own CV, written for that posting.

One job. One CV.
Paid once.

Pick the posting you want. We write for it, apply for you and catch the reply.

Get the CV for this job

From $25 per CV, paid once. No subscription.