Skip to content
CV Rocket
Get started
How it worksThe enginePricingBlogContactSign in

Open nowPosted 4 hours agoWe saw it 63 min after it went up

Silicon Design Engineer

AMD1,295 open roles

Where
Hsinchu, Taiwan
Get the CV for this job

From $25 per CV, paid once. No subscription.

Your applicationOpen nowSilicon Design EngineerAMD · Hsinchu, Taiwan

  1. YouYes, apply to this one.

  2. CV RocketCV written for this posting.

  3. 25 readersRecruiter, hiring manager, skeptic. Round after round.

  4. CV RocketApplied on AMD's own form.

The reply lands in your private mailbox

3×more interviews than doing it yourself with ChatGPT.

The clock on this job

Early applications get read.

8.2% of postings close within 7 days. Measured by our own scanner across the market. AMD postings stay open a median of 38 days.

Share of postings closed within
  1. 1.8%1 day
  2. 3.6%3 days
  3. 8.2%7 days
  4. 15.2%14 days
  5. 34.0%30 days
This job: posted 4 hours ago

AMD median: 38 days open

The posting

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.

THE ROLE:

We are looking for a hands-on automation engineer to drive the development and deployment of next-generation packaging design automation and AI-driven workflows. You will focus on accelerating the design of advanced heterogeneous integration technologies—specifically substrates, organic interposers, and bridge interconnects. AMD's environment is fast-paced, results-oriented, and built upon a legion of innovators with a passion for winning technology.

THE PERSON:

The successful candidate is a hands-on technical contributor who can bridge the gap between physical design requirements and software automation to build AI-driven workflows. He or she must have a drive for solutions and an aptitude to thrive in a multi-tasking environment, translating complex design challenges into scriptable, scalable workflows. They should possess good cross-functional collaboration skills to work across Design, EDA, and AI teams, with clear technical communication and documentation skills. Able to work effectively with minimal supervision and motivated to grow along the technical ladder.

KEY RESPONSIBILITIES:

  • Develop, deploy, and maintain AI workflows for Substrate, Interposer, and Silicon Bridge design methodologies.
  • Apply AI/ML methodologies to optimize critical design stages, including auto-routing, component placement, and signal integrity optimization.
  • Work with EDA vendors and internal stakeholders to evaluate and implement next-generation features for 2.5D and 3D packaging.
  • Contribute to the transition from manual design practices to "Agentic" and algorithmic design workflows.
  • Collaborate with electrical and mechanical analysis teams to build closed-loop optimization systems that feed simulation results back into design construction.
  • Document and report automation efficiency gains, ROI, and tool-capability improvements.
  • Collaborate with cross-functional teams to support critical design tape-outs and methodology milestones.
  • Share coding best practices and packaging knowledge with peers.

PREFERRED EXPERIENCE:

  • Strong knowledge of EDA packaging design tools (Cadence APD/SiP, Siemens Xpedition, or Synopsys 3DIC/Compiler).
  • Hands-on track record of developing automation using Python, Tcl, SKILL, or C++.
  • Experience applying AI/ML frameworks (PyTorch, TensorFlow, etc.) to engineering or design problems.
  • Familiarity with advanced packaging architectures (2.5D/3D, Chiplets, Fan-Out, Hybrid Bonding).
  • Familiarity with design verification flows (DRC/LVS) and electrical extraction concepts.
  • Experience automating Cadence Allegro package databases (SKILL) and/or SI/PI data workflows (e.g., PowerSI) is a plus.
  • Good teamwork and interpersonal skills.

ACADEMIC CREDENTIALS:

  • Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, with relevant packaging or CAD-automation experience.

#LI-SH1

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

THE ROLE:

We are looking for a hands-on automation engineer to drive the development and deployment of next-generation packaging design automation and AI-driven workflows. You will focus on accelerating the design of advanced heterogeneous integration technologies—specifically substrates, organic interposers, and bridge interconnects. AMD's environment is fast-paced, results-oriented, and built upon a legion of innovators with a passion for winning technology.

THE PERSON:

The successful candidate is a hands-on technical contributor who can bridge the gap between physical design requirements and software automation to build AI-driven workflows. He or she must have a drive for solutions and an aptitude to thrive in a multi-tasking environment, translating complex design challenges into scriptable, scalable workflows. They should possess good cross-functional collaboration skills to work across Design, EDA, and AI teams, with clear technical communication and documentation skills. Able to work effectively with minimal supervision and motivated to grow along the technical ladder.

KEY RESPONSIBILITIES:

  • Develop, deploy, and maintain AI workflows for Substrate, Interposer, and Silicon Bridge design methodologies.
  • Apply AI/ML methodologies to optimize critical design stages, including auto-routing, component placement, and signal integrity optimization.
  • Work with EDA vendors and internal stakeholders to evaluate and implement next-generation features for 2.5D and 3D packaging.
  • Contribute to the transition from manual design practices to "Agentic" and algorithmic design workflows.
  • Collaborate with electrical and mechanical analysis teams to build closed-loop optimization systems that feed simulation results back into design construction.
  • Document and report automation efficiency gains, ROI, and tool-capability improvements.
  • Collaborate with cross-functional teams to support critical design tape-outs and methodology milestones.
  • Share coding best practices and packaging knowledge with peers.

PREFERRED EXPERIENCE:

  • Strong knowledge of EDA packaging design tools (Cadence APD/SiP, Siemens Xpedition, or Synopsys 3DIC/Compiler).
  • Hands-on track record of developing automation using Python, Tcl, SKILL, or C++.
  • Experience applying AI/ML frameworks (PyTorch, TensorFlow, etc.) to engineering or design problems.
  • Familiarity with advanced packaging architectures (2.5D/3D, Chiplets, Fan-Out, Hybrid Bonding).
  • Familiarity with design verification flows (DRC/LVS) and electrical extraction concepts.
  • Experience automating Cadence Allegro package databases (SKILL) and/or SI/PI data workflows (e.g., PowerSI) is a plus.
  • Good teamwork and interpersonal skills.

ACADEMIC CREDENTIALS:

  • Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, with relevant packaging or CAD-automation experience.

#LI-SH1

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

From $25, paid onceGet the CV for this job

What happens when you press

One press. We do the rest.

  1. A CV for this posting

    Written against AMD's own wording, from every piece of relevant proof in your profile.

  2. 25 readers review it

    Recruiter, hiring manager, skeptic and more read every draft, round after round. You get the best round.

    The review screen in CV Rocket: how each CV was read, round by round.

  3. We apply on AMD's form

    Our application engine gets through the hardest forms there are. Where a question needs you, AI suggests the best answer. Don't want us applying from our IP addresses? Use our Chrome extension: we apply straight from your own browser.

    An application in CV Rocket: every answer filled in on the employer's form.

  4. Every reply, sorted

    AMD's answer lands in your private mailbox, and we classify it on arrival: interview, question, rejection.

    The CV Rocket inbox: each employer reply classified as an interview, an action or a rejection.

  5. Reply with AI

    AI helps you write the email, checks it and sends it. We show you whether the recruiter read it.

  6. The interview in your calendar

    Full integration with your calendar. The invitation goes straight in.

    An interview invitation in the CV Rocket inbox, added to the candidate's calendar.
Get the CV for this job

From $25 per CV, paid once. No subscription.

Why it works

3×

more interviews than doing it yourself with ChatGPT.

ChatGPT writes a CV and never learns what happened to it. We see every reply. For each CV we know:

  • How it was written, and how the review scored it
  • When we applied, and how long after the posting went up
  • Which posting, which company, which city
  • Who got the interview, and who heard nothing

That is how we know which CVs get called.

Get the CV for this job

From $25 per CV, paid once. No subscription.

The numbers game

More applications. More interviews.

Every application goes out with its own CV, written for that posting and paid once. Send enough of them and the law of large numbers finds you the job.

Get the CV for this job
By hand5–10
With CV Rocket100
applications a day

Nearby

Live postings like this one

Same employer first, then the same role elsewhere.

Before you press

Straight answers

Get the CV for this job

From $25 per CV, paid once. No subscription.

What if my background isn't good enough?

We make the most of the background you have. The CV uses every piece of relevant proof your profile holds, and one of the 25 readers reads your whole profile and flags what the CV left out.

Do you really apply for me?

Yes, on the employer's own form, the hardest ones included. Where a question needs you, you answer it right there and AI suggests the best answer. Don't want us applying from our IP addresses? Use our Chrome extension: we apply straight from your own browser.

Is it a subscription?

No. You pay once per CV, from $25. Every application goes out with its own CV, written for that posting.

One job. One CV.
Paid once.

Pick the posting you want. We write for it, apply for you and catch the reply.

Get the CV for this job

From $25 per CV, paid once. No subscription.