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Open nowPosted today

ATE Test Development Engineer

AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED

Pay
SGD 7,500 – SGD 15,000 a month
Where
North, Singapore
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Your applicationOpen nowATE Test Development EngineerAVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED · North, Singapore

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Share of postings closed within
  1. 2.1%1 day
  2. 4.5%3 days
  3. 12.3%7 days
  4. 19.7%14 days
  5. 35.6%30 days
  6. 58.0%60 days
This job: posted today

The posting

Join Broadcom’s Global Operations team supporting the Core Switching Group as an ATE Test Development Engineer! In this high-impact role, you will shape the future of next-generation networking switches powering Scale-Up, Scale-Out, and Scale-Across architectures for AI and traditional cloud data centers. Based at our R&D innovation hubs in Irvine, CA or San Jose, CA, you will tackle groundbreaking engineering milestones, working hands-on with state-of-the-art Teradyne UltraFlex test platforms and cutting-edge silicon technology.

Responsibilities

  • Next-Gen Test Development: Architect and bring up advanced ATE test programs for flagship networking switch ICs featuring high-speed SERDES (>100G) and cutting-edge multi-die CoWoS advanced packaging.
  • Advanced Hardware Engineering: Lead the hardware strategy for final test and wafer probe, partnering with top-tier PCB designers, socket vendors, and probe card suppliers to push performance limits.
  • Hands-On Silicon Debug: Drive direct, hands-on debug on ATE, conquering complex electrical, mechanical, and extreme thermal challenges as chip power approaches unprecedented 10,000W thresholds.
  • Advanced Packaging & Thermal Innovation: Solve novel mechanical and structural test challenges introduced by massive die sizes and multi-die CoWoS package integration.
  • Program Optimization & Yield Enhancement: Optimize test flows and reduce test time to improve yield and manufacturing efficiency while ensuring uncompromising quality.
  • Cross-Functional Collaboration: Partner closely with world-class Product, Design, and Packaging Engineers to bring complex silicon from concept to high-volume production.
  • Global Production Deployment: Collaborate seamlessly with manufacturing teams across Asia to release and support robust production test programs.

Skills/Experiences

  • Hands-on experience with Teradyne UltraFlex tester platforms
  • Must be able to independently develop test programs, including complex test flows to support chip specifications around performance and power consumption
  • Must be able to support debugging/troubleshooting of various failure mechanisms with the part by working with cross-functional teams
  • Ability to perform volume data analysis, Correlate failures with system failures, Proficiency with Data analysis softwares/languages
  • Programming experience required for test method development
  • Ability to work with test hardware development teams, able to understand chip performance at ATE and contributions from the test hardware on chip behavior
  • Experienced with extreme temperature testing of ASICs at ATE
  • Experience with AI tools for quick script development is a plus

Preferred

  • Hands on experience with Prober, Handler, ATC
  • Skills working with AI tools/models
  • Usage of AI tools for test program development

Education:

● Bachelor's Degree and 8+ years of related experience, or Master's Degree and 6+ years of related experience

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