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Open nowFirst seen 67 days ago

Staff Applications Scientst II

Axcelis Technologies73 open roles

Where
Hsinchu, Taiwan
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Your applicationOpen nowStaff Applications Scientst IIAxcelis Technologies · Hsinchu, Taiwan

  1. YouYes, apply to this one.

  2. CV RocketCV written for this posting.

  3. 25 readersRecruiter, hiring manager, skeptic. Round after round.

  4. CV RocketApplied on Axcelis Technologies's own form.

The reply lands in your private mailbox

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The clock on this job

Early applications get read.

12.1% of postings close within 7 days. Measured by our own scanner across the market. Axcelis Technologies postings stay open a median of 15 days.

Share of postings closed within
  1. 2.1%1 day
  2. 4.5%3 days
  3. 12.1%7 days
  4. 19.1%14 days
  5. 35.6%30 days
  6. 52.7%60 days
This job: first seen 67 days ago

Axcelis Technologies median: 15 days open

The posting

Overview

  • This key role is focused onstrengthening Axcelis’ working relationships with customers’ research and development organizations
  • Increasing our level of understanding of emerging integrated circuit fabrication challenges as they relate to device performance and yield
  • Identification and development of unique and enabling implant solutions that address customers’ emerging transistor fabrication challenges

Responsibilities

  • Strategic DevelopmentIdentifies inflections, threats and opportunities for share and TAM growth Determines market segmentation & requirements Delivers a detailed competitive analysis Develops a winning product/ business strategy Work with product marketing on device performance related proof statements that support or build product differentiation
  • Device TechnologyProvides leadership and direction through managers for providing perspective of customer process and device roadmaps (N to N+ 2) for a broad function area Recognized as a technology expert for current and future roadmaps: N, N+ 1, N+2 Participate as subject level experts in device matching and troubleshooting
  • Technical MarketingOwns and manages technical roadmap meetings (TRM) and technical engagement programs with customer(s) Protects customer(s) IP, protects Axcelis IP, understands competitive performance and positioning Manages local technical resources and works closely with factory teams to ensure high installed base performance and customer(s) satisfaction
  • Process IntegrationDiscovers customer(s) HVP (High Value Problem), understands options and influences the customer’s technical choices Designs alternative technology solutions and improves customer(s) preference to engage Axcelis on technical problems TD Process Integration: Drive all technical collaborations with consortia or possible partner companies

Skills, Knowledge and Ability

  • Ability to: Interface, negotiate, and coach customers on technical problems in both proactive and reactive mode. Apply scientific method to difficult problems. Logically analyze data and technical information. Design experiments and statistical process control techniques. Research information. Prepare technical written reports. Make corrective plans. Recommend changes in design standards and polices. Apply technical troubleshooting to customers. Demonstrate integrity and trust. Demonstrate creativity on the job. Organize work. Learn on the fly.
  • Knowledge of: Multiple aspects of semiconductor device physics and process integration. Semiconductor physics, Material processing and analysis. Semiconductor fabrication and device operations principle. Clean room protocols and wafer processing. Wafer methodology. Basic business, accounting & financial practices. Basic management techniques. Supervising others.
  • Skilled at: Using PC. Guiding others through technical issues. Personal communications. Delivering formal training & presentations. Interpreting engineering standards and forms. Applying knowledge to the solution of difficult problems. Written communication. Time management. Technical learning. Problem solving. Priority setting.

Education and Experiences

Bachelors and 10+ years, Masters and 6+ years, or Doctorate and 4-6 years in leading edge logic device fabrication and/or research and/or equipment manufacturing environment.

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