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Open nowPosted today

Failure Analysis Engineer

Broadcom395 open roles

Pay
$109,700 – $175,500 a year
Where
USA-Colorado-Fort Collins-4380 Ziegler Road
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Your applicationOpen nowFailure Analysis EngineerBroadcom · USA-Colorado-Fort Collins-4380 Ziegler Road

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The clock on this job

Early applications get read.

13.9% of postings close within 7 days. Measured by our own scanner across the market. Broadcom postings stay open a median of 43 days.

Share of postings closed within
  1. 2.2%1 day
  2. 4.7%3 days
  3. 13.9%7 days
  4. 22.4%14 days
  5. 38.1%30 days
  6. 59.0%60 days
This job: posted today

Broadcom median: 43 days open

The posting

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Job Description:

Broadcom is seeking a highly motivated and results-driven Failure Analysis Engineer to ensure successful deployment of Broadcom's most advanced products, including industry-leading AI accelerators and high-speed networking solutions. This hands-on, technical position requires ownership of the complete failure analysis lifecycle, from initial fault isolation to physical identification and nanoscale characterization, and findings are used to drive corrective action with design, process, product, and packaging teams across advanced silicon (e.g., FinFET, GAA) and cutting-edge packaging technologies (e.g., 2.5D, CoWoS-S/L, 3DIC, CoPoS, CPO).

Responsibilities:

  • Own full-flow FA on advanced-node logic and mixed-signal devices and advanced packages.
  • Engage in team-based culture through open communication, continuous improvement, and willingness to assist others.
  • Plan and execute individual FA plans through background data collection, ATE datalog interpretation, and non-destructive analysis (optical, CSAM, X-Ray, TDR, IV curve trace).
  • Apply fault isolation techniques, including photon emission (PEM/EMMI), laser-based (LADA/SDL/OBIRCH), thermal, and lock-in methods, to localize defects in front-side and backside configurations.
  • Perform nanoprobing (SEM-based) for BEOL and FEOL electrical characterization and defect isolation (EBAC, EBIRCH, EBIC).
  • Execute sample preparation and physical analysis: physical deprocessing of ICs and packages (mechanical, chemical, PFIB), backside thinning, cross-section SEM/TEM, elemental analysis (EDS).
  • Correlate design-based FA results (scan diagnosis, memory bitmapping) and ATPG/DFT results with physical localization to drive root cause on resistive and systematic defects.
  • Collaborate with global cross-functional teams to identify root causes of failures from various stages of the product lifecycle (e.g., design, prototype, reliability, RMA, yield).
  • Communicate complex FA findings effectively (written and verbal), enabling data-driven corrective actions to resolve critical quality issues.
  • Develop and implement new FA methodologies and procedures unique to advanced silicon & packaging technologies to enhance efficiency and effectiveness.

Required Qualifications:

Please apply only if you meet all of the following:

  • BS, MS, or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field.
  • 8+ years of hands-on semiconductor failure analysis experience, with a demonstrated history of root-causing failures at 16nm or below and/or in 2.5D packages.
  • Full-flow FA experience: electrical verification, non-destructive analysis, backside fault isolation on flip-chip and/or 3D devices, deprocessing, physical analysis, and technical report writing
  • Extensive hands-on expertise in fault isolation and/or nanoprobing, including tool operation, data interpretation, and the ability to choose appropriate EFA/PFA analysis techniques based on the failure signature.

Highly Desired Qualifications:

  • Strong understanding of semiconductor device physics, fabrication processes, and packaging technologies.
  • Experience with <5nm finFET or GAAFET technologies.
  • Experience with 3DICs, CoWoS-L, CoPoS, co-packaged optics/copper (CPO/CPC).
  • Experience with high-speed digital and mixed-signal failure analysis.
  • Expertise in design-based FA (scan and memory diagnostics).
  • FA-specific ATE test flow generation, pattern modification, and hardware.
  • Excellent problem-solving skills and a methodical approach to root cause analysis.
  • Ability to work independently and as part of a team.
  • Broad interests, self-driven, and a lifelong learner.
  • Manage multiple root cause projects in parallel in a fast-paced environment.

Compensation and Benefits

The annual base salary range for this position is USD 109,700.00 To USD 175,500.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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