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Open nowPosted 8 days ago

Substrate Engineer

Broadcom351 open roles

Where
Taiwan-Hsinchu-Puding Road
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Your applicationOpen nowSubstrate EngineerBroadcom · Taiwan-Hsinchu-Puding Road

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  2. CV RocketCV written for this posting.

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The clock on this job

Early applications get read.

11.9% of postings close within 7 days. Measured by our own scanner across the market. Broadcom postings stay open a median of 43 days.

Share of postings closed within
  1. 2.1%1 day
  2. 4.4%3 days
  3. 11.9%7 days
  4. 18.6%14 days
  5. 35.6%30 days
  6. 45.1%60 days
This job: posted 8 days ago

Broadcom median: 43 days open

The posting

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Job Description:

JD:

  • Responsible for working with Broadcom's IC substrate subcontractors to manage and resolve issues relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices.
  • Responsible for NPI activity, risk assessments, process improvement & development and production engineering support of high volume IC substrate manufacturing.
  • Work with Broadcom internal cross functional engineering teams resolve issues with interactive nature; work on newly developed packaging technology and drive towards high volume manufacturing maturity
  • Responsible for new product pre-production engineering activity and drive improvements in process and visual mechanical yields, cycle time.
  • Take on site to site standardizations in Best Known Methods, and verification on compliance towards Broadcom requirements
  • Drive capability enhancement and cost reduction projects
  • Qualification of new suppliers / new site and support moving to HVM

JR:

  • Bachelor Degree in an engineering discipline (Mechanical, Manufacturing, Material Science, Chemical or Electrical).
  • 8 years' experience in IC substrate manufacturing technologies and processes.
  • Direct process and operational experience in a substrate manufacturing operations line is required.
  • Expertise in ABF substrate interactions with Ball Grid Arrays, flipchip; laminate substrates interactions with die attach, wirebonding, molding, flipchip attach, singulation, packaging materials is required.
  • Track record of good achievements managing substrate technical specifications that impact the downstream margins of assembly processing.
  • Direct process and operational experience in manufacturing environment
  • Experience in component quality interactions with SMT processibility is not a pre-requisite, but will be favorable
  • Proven ability to manage and coordinate complex activities across multiple groups including operations, quality, business units, suppliers, marketing, customers.
  • Experience with managing activities with packaging subcontractors and driving resolution of manufacturing issues. Demonstrate leadership in working within different internal functional groups to manage issue containment and drive the best path forward.
  • Thorough knowledge of problem solving methodologies and failure analysis techniques. Must demonstrate the ability to quickly make assessments of risks and take the necessary steps in managing escalations. Demonstrate good communication skills in problem resolution.
  • Have a very good command on spoken and written English, Fluent in Mandarin
  • Willing to travel throughout Asia to support manufacturing locations.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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