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Open nowPosted 22 days ago

Assembly Support Engineer

EURES job mobility portal275,566 open roles

Where
Leuven, Belgium
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Your applicationOpen nowAssembly Support EngineerEURES job mobility portal · Leuven, Belgium
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  2. 3.4%3 days
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  4. 14.3%14 days
  5. 33.7%30 days
This job: posted 22 days ago

The posting

What you will do

Assembly Engineering Support

  • Manage and support engineering builds activities of IC package assembly projects from concept to completion.
  • Define project scope, timelines, and deliverables in alignment with assembly engineering activities.
  • Track progress, identify risks, and implement mitigation strategies to ensure timely execution.

Supplier Coordination

  • Serve as the primary technical liaison between internal teams and OSAT partners.
  • Coordinate and monitor assembly activities, ensuring compliance with quality, cost, and schedule requirements.
  • Facilitate communication and alignment across global manufacturing sites and vendors.

Issue Resolution & Technical Support

  • Investigate and resolve assembly-related issues including yield loss, material defects, and process deviations.
  • Support root cause analysis and drive corrective actions in collaboration with quality and process engineering teams.
  • Support failure analysis and reliability testing as needed.

Documentation & Reporting

  • Maintain detailed documentation of build processes, test results, and lessons learned.
  • Gather required documents from Assembly House like POD, substrate drawing, bonding diagram, etc.
  • Generate technical reports and present findings to stakeholders and leadership.
  • Support DFM & DFA review process.

Continuous Improvement

  • Identify opportunities for process optimization and cost reduction in packaging and assembly.
  • Contribute to the development of new packaging technologies and methodologies.

Who you are

  • Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
  • 5+ years of experience in semiconductor packaging or IC assembly engineering.
  • Strong understanding of packaging technologies (e.g., wire bonding, flip chip, molding, underfill & SMT).
  • Experience working with OSATs and managing external suppliers.
  • Knowledgeable in data analysis tools and statistical process control (SPC).
  • Excellent problem-solving, communication, and organizational skills.

Preferred Skills

  • Familiarity with industry standards (JEDEC, IPC).
  • Experience with advanced packaging (e.g., 2.5D/3D IC, fan-out, wafer-level packaging, BGA, etc) assembly processes.
  • Knowledge on reliability testing and failure analysis techniques.
  • Ability to work in a fast-paced, cross-functional environment.
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