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Open nowFirst seen 4 days ago

Senior Microelectronic Design Engineer

Global Talent Alliance, Canada47 open roles

Where
Ottawa, ON, Canada
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Your applicationOpen nowSenior Microelectronic Design EngineerGlobal Talent Alliance, Canada · Ottawa, ON, Canada

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  3. 25 readersRecruiter, hiring manager, skeptic. Round after round.

  4. CV RocketApplied on Global Talent Alliance, Canada's own form.

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The clock on this job

Early applications get read.

12.3% of postings close within 7 days. Measured by our own scanner across the market.

Share of postings closed within
  1. 2.1%1 day
  2. 4.5%3 days
  3. 12.3%7 days
  4. 19.3%14 days
  5. 35.6%30 days
  6. 58.1%60 days
This job: first seen 4 days ago

The posting

Job#81393

Job Purpose

The Microelectronic Design Engineering team, as part of our company's Global Design Engineering Team, represents one of the key strategic growth areas of the total engineering service offering. Our team provides engineering and design services in microelectronic, optical and semiconductor packaging and component design supported through its in depth background in materials technology, thermal, structural and reliability engineering.

We are seeking a Senior Microelectronic Design Engineer to join our team to support and lead both technology and product development programs, from initial technology selection and concept definition through detailed design, prototyping, qualification and volume manufacturing phases.

Nature of Duties/Responsibilities:

  • Product development lead in microelectronic design and engineering as part of a multidisciplinary product development team, including electrical/RF engineering, optical engineering, reliability engineering, layout, documentation, manufacturing/process engineering and test engineering, in line with customer requirements and specifications.
  • Industry assessment and selection microelectronic technologies and definition of design concepts, based on product applications, requirements and specifications.
  • Engineering and design of microelectronic packages & modules, including integrating elements of material selections, substrate layout and designs, mechanical, thermal as well as incorporating key aspects of reliability, electrical (RF), optical, test and process engineering for volume manufacturing.
  • Management of product documentation process including design specifications, drawings (piece parts, assembly, process) Bill of Materials, documentation release by engineering change order (ECO).
  • Define specifications/requirements and coordinate/interface with manufacturers/suppliers for outsourced custom components.
  • Oversee and support engineering product verification, ensuring compliance to product requirements.
  • Drive business development initiatives including interfacing with potential and existing customers, preparation of marketing materials, proposals and quotations.
  • Product management and lead of turnkey the product development process through to manufacturing implementation.

Education and Experience:

  • Bachelors Degree in Mechanical Engineering, Physics, or other relevant degree with experience in electronic hardware design and packaging including multi-chip modules and semiconductor packaging for RF/Microwave/Optical applications.
  • Minimum of 8 years of relevant industry experience.
  • Proficient in computer aided design software and tools (AutoCad®, SolidWorks®).
  • Experience with commercial FEA tools and supporting analysis.
  • Experience with packaging and substrate design software (Cadence® Allegro® Package Designer Plus).
  • Background or relevant experience in microelectronic technologies, materials, components, manufacturing methods.
  • Experience in end-to-end product development and manufacturing implementation.
  • Security clearance is an asset.
  • Customer focused with strong communication skills, and has the ability to work within a multidisciplinary product development team in a fast-paced and challenging environment.
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