The posting
About GlobalFoundries:
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visitwww.gf.com.
Summary of Role: The CMOS product team is seeking a Singapore-based Senior Advanced Packaging 3DHi and2.5D Integration Lead to join GlobalFoundries’ local technology development organization. Based at our Singapore site, this lead integrator will define and drive advanced packaging technology development from architecture and early process demonstration through qualification, manufacturing transfer, and production readiness. The successful candidate will bring deep, hands-on expertise in 3D heterogeneous integration (3DHi) and 2.5D solutions, including chiplet integration, silicon interposers and bridges, through-silicon vias(TSVs), die-to-wafer and wafer-to-wafer bonding, hybrid bonding, redistribution layers, and package-level integration. The role requires ownership of integration architecture, test-site and qualification-vehicle definition, module and process-flow alignment, and electrical, thermal, mechanical, reliability, yield, and manufacturability validation. The candidate will collaborate closely with engineering, manufacturing, reliability, test, supply-chain, and business teams in Singapore, while coordinating with GlobalFoundries’ sites and partners worldwide to deliver critical technology milestones for customer product requirements and the company’s advanced packaging strategy.
Essential Responsibilities:
• Serve as the lead integrator for complex 3DHi and 2.5D technology development programs, translating customer product requirements into integration architectures, qualification strategies, and executable technology roadmaps.
• Define and integrate end-to-end process flows for chiplet-based 2.5D and 3DHi solutions, including silicon interposers or bridges, TSVs, redistribution layers, wafer thinning and handling, micro-bump or hybrid-bond interfaces, die-to-wafer and wafer-to-wafer assembly, and package integration.
• Own integration trade-off analysis across electrical performance, power delivery, signal integrity, thermal management, mechanical stress, warpage, reliability, yield, cost, and manufacturability.
• Define test-site requirements and lead development of test structures, interposer and package vehicles, daisy chains, reliability structures, and electrical test methodologies needed to validate module and system-level performance.
• Establish process-control, in line inspection, metrology, defectivity, known-good-die, assembly, and qualification strategies that enable robust technology development and high-volume manufacturing readiness.
• Identify integration gaps and failure mechanisms; develop structured DOEs and data-driven problem-solving plans to determine root cause, optimize process windows, and accelerate technology maturity.
• Analyze electrical, physical, thermal, mechanical, defectivity, reliability, and yield data to identify trends, define corrective actions, and enable rapid technical decisions.
• Lead cross-functional execution through concept definition, architecture and design-rule alignment, DOE planning, milestone reviews, qualification readiness, process freeze, supply-chain alignment, and manufacturing transfer.
• Provide technical leadership and clearly communicate program status, risks, trade-offs, and recommendations to management, customers, ecosystem partners, and global engineering teams.
• Build strong working relationships across the Singapore organization and GlobalFoundries’ world wide technology development, manufacturing, reliability, test, design enablement, supply-chain, and business teams.
Other Responsibilities:
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety &Security requirements and programmes.
• This role is based in Singapore and requires regular on-site engagement with local technology development and manufacturing teams.
• Travel of up to 15% to other GlobalFoundries sites, suppliers, ecosystem partners, or customer locations maybe required.
Required Qualifications:
• Bachelor’s degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field from a recognized institution.
• Relevant experience in advanced semiconductor packaging technology development, process integration, assembly, or heterogeneous integration, including one of the following:
o B.S. with a minimum of 10 years of relevant experience
o M.S. with a minimum of 7 years of relevant experience
o Ph.D. with a minimum of 5 years of relevant experience
• Demonstrated hands-on expertise leading integration of 3DHi and/or 2.5D solutions, with experience in several of the following: chiplet architectures, silicon interposers or bridges, TSV integration, redistribution layers, micro-bump or Cu-Cu hybrid bonding, die-to-wafer or wafer-to-wafer bonding, wafer thinning and temporary bonding, underfill, assembly, and package qualification.
• Experience defining and executing test vehicles, DOEs, process windows, metrology and inspection plans, electrical test, reliability qualification, failure analysis, yield improvement, and manufacturing transfer.
• Demonstrated technical leadership, programme ownership, and ability to drive execution across cross-functional teams, global sites, suppliers, and external ecosystem partners.
• Strong written and verbal communication skills in English, with the ability to work effectively across cultures and time zones.
• Currently based in Singapore or willing to relocate to Singapore and work on site.
Preferred Qualifications:
• Advanced degree in a relevant engineering or science discipline.
• Experience in Singapore’s semiconductor ecosystem, including technology development or manufacturing within a wafer fab, foundry, OSAT, equipment or materials supplier, or research institute.
• Established working relationships with Singapore-based research institutes, universities, OSATs, equipment suppliers, materials vendors, or other advanced packaging partners.
• Working knowledge of 2.5D/3Ddesign enablement and co-design considerations, including interconnect density, signal integrity, power integrity, thermal and mechanical modelling, design rules, assembly tolerances, and product-level qualification.
• Proven leadership in complex technology programmes, including milestone-based execution, risk retirement, qualification readiness, and manufacturing hand-off in a high-volume environment.
• Ability to translate complex technical issues into clear recommendations, decisions, and action plans for technical, executive, and customer audiences.
All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.
No Recruitment Fee Policy: GlobalFoundries is committed to ethical and transparent hiring practices. Candidates will not be charged any fees at any stage of the recruitment process. Any request for payment related to a GlobalFoundries employment opportunity is unauthorized and should be reported immediately. All legitimate recruitment communications are conducted exclusively through official GlobalFoundries channels. To report concerns or suspected recruitment fraud, please contact our Ethics & Compliance Office at [email protected] or visit our official website.
Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia
