The posting
Job Description & Requirements
This position is to provide technical support for Bonding Wire and Assembly Material products which are used for Semiconductor Electronic Module application in order to ensure centralized internal and external customer window for technical support, improve process stability and engineering capability.
Job Responsibilities:
- Lead Process Engineering team overseeing processes of all production lines to establish and realize all site targets and priorities. Support Maintenance team to implement production reliability programs including TPM, Preventive Maintenance (PM) and PDM ( Predictive Maintenance).
- Execute continuous improvement initiatives using Sig Sigma, Gemba, Kaizen or similar methodologies to improve efficiency of existing processes and procedures, optimize processes and improve yield, Cpk, quality, cycle time and cost of existing processes to achieve all cost, quality & service goals. Lead actively in new machine qualification and new materials evaluation/ qualification.
- Establish and implement comprehensive process specification, troubleshooting and control procedures using SPC, SIPOC and other methodologies. Maintain routing, BOM, control plans, standard operating procedures, FMEA documents, work instructions, OCAP documents and all process related control documents.
- Support new product development and scale-up of new products to customer or industry specification activity, including identifying, modifying, designing or leading the decision making process for the acquisition of new equipment and systems. Participate in project reviews in order to assess new product manufacturability to ensure effective new product launch. Manage development projects, participate in technical discussions and provide critical advice to management to maintain focus on excellence.
- Analyze/identify/solve problems or customer complaints regarding existing products and originate/manage process changes for new applications. Communicate with customer, vendors, management, internal departments and other production sites to resolve escalated issues. Lead in troubleshooting of process problems and apply Root Cause Analysis and Systematic Problem Solving techniques to failure investigations.
- Remains abreast of technical developments in the field; obtain information through literature and patents. Actively participate in aligning on best practices across various manufacturing sites as well as lead benchmarking activities to ensure current processes and methodologies are ahead of competitors offering similar products or services.
- Provide technical advice, expertise and troubleshooting training & consultation to engineers and to current and potential customers regarding product usage, flexibility and applications.
- Provide regular coaching, performance management, training and development for engineering team to build an effective and competent team.
Job Requirement:
- Minimum degree in Chemical, Industrial, Mechanical or Materials Engineering
- More than 10 years experience in semiconductor and electronic-related industry.
- Incumbent should also have held a leadership position for at least 8 years.
- Strong knowledge in Process Engineering Management and Lean Manufacturing
- Proficient in utilizing statistical and problem-solving tools for trouble-shooting reporting and process improvements recommendations
- Able to collaborate with cross-functional and global teams and work in a matrix reporting environment
- Able to effectively lead teams and subordinates to meet tight deadlines and achieve deliverables
Work Location Pioneer / Ang Mo Kio



