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Packaging Module Development Engineer

Intel701 open roles

Where
US, Arizona, Phoenix
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Your applicationOpen nowPackaging Module Development EngineerIntel · US, Arizona, Phoenix

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The clock on this job

Early applications get read.

11.4% of postings close within 7 days. Measured by our own scanner across the market. Intel postings stay open a median of 26 days.

Share of postings closed within
  1. 2.0%1 day
  2. 4.2%3 days
  3. 11.4%7 days
  4. 17.5%14 days
  5. 34.2%30 days
  6. 43.5%60 days
This job: posted today

Intel median: 26 days open

The posting

Job Details:

Job Description:

At Intel, we create world-changing technology that improves the life of every person on the planet. This position is part of Intel's Advanced Packaging Technology Manufacturing (APTM) organization, which develops and commercializes advanced semiconductor packaging solutions. APTM delivers scalable, data-driven processes and integrated hardware and software tools that support Intel's technology leadership in high-performance computing applications.

We are seeking a Packaging Module Development Engineer to join our team in Chandler, Arizona. This unique hybrid position sits at the intersection of metrology engineering, data analytics, and engineering software development. In this role, you will develop and optimize advanced metrology inspection recipes, design bespoke desktop software applications to interface with precision hardware and create automated analysis tools to transform complex equipment data streams into actionable manufacturing insights.

Key Responsibilities:

  • Desktop Application Development: Design, code, test, deploy, and maintain lightweight desktop applications and automated engineering scripts using Python frameworks (PyQt, Tkinter) or C#/.NET.
  • Full Software Lifecycle Management: Own the full software development lifecycle, including requirements gathering, architecture, code development, testing, version control, technical documentation, and long-term maintenance.
  • Advanced Metrology Recipe Development: Develop, qualify, and optimize advanced packaging inspection recipes, equipment parameters, and processes to meet yield, quality, and throughput targets.
  • Data Science & Pipeline Engineering: Create robust data pipelines to parse raw equipment outputs, perform statistical analysis on multi-dimensional datasets (sensor logs, image stacks, metrology outputs), and write structured results to SQL databases.
  • Process Control & Hardware Characterization: Execute structured Design of Experiments (DOE), Measurement System Analysis (MSA), and Statistical Process Control (SPC) to isolate hardware variation and define process windows.
  • Systems Troubleshooting: Perform hands-on troubleshooting of software applications, equipment interfaces, communications protocols, drivers, sensors, and metrology subsystems.
  • Supplier & Partner Collaboration: Collaborate with external equipment suppliers and cross-functional engineering teams to resolve technical tool faults, improve system reliability, and implement corrective actions.

As a Successful Candidate, You Will Bring:

  • Multi-Disciplinary Problem Solving: A passion for resolving highly complex, unstructured issues at the intersection of physical hardware, software code, and manufacturing data.
  • Collaborative & Technical Leadership: Highly effective at partnering across diverse matrixed teams, global engineering groups, and external technical suppliers.
  • Strong Project Management: Strong organizational skills to drive complex, time-sensitive technical projects with minimal supervision.
  • Proactive & Outcome-Driven: Self-motivated learner who takes pride in building internal tools, improving operational efficiency, and driving high-quality standards.

Apply today to join Intel Chandler's Advanced Packaging Technology Manufacturing team. Take ownership of cutting-edge technology, merge your passions for software and hardware, and grow your career alongside global pioneers.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.

Minimum Qualifications:

An applicant must meet one of the following educational and experience criteria:

  • A Bachelor’s degree in Engineering, Computer Science, Physics, Materials Science, or a related STEM field with 4+ years of relevant industry experience.
  • OR a Master’s degree in a matching STEM discipline with 3+ years of relevant industry experience.
  • OR a PhD in a matching STEM discipline with no prior professional experience.
  • Relevant experience can be any of the below:Full software development lifecycle (requirements, architecture, coding, testing, deployment, version control, and documentation). Utilizing Python or C#/.NET to build desktop applications, engineering automation, or scientific software. Applying data science skills (data preparation, statistical analysis, SQL, visualization, SPC, and DOE). Integrating and troubleshooting software, communication interfaces, sensors, or metrology/inspection equipment. Developing or qualifying semiconductor packaging processes, inspection recipes, or manufacturing equipment.

Preferred Qualifications:

  • 1+ years of experience:
  • Utilizing PyQt, Tkinter, scientific Python libraries (such as NumPy or Pandas), computer vision, or multi-dimensional image datasets.
  • Working with advanced packaging flows, metrology systems, or high-volume semiconductor manufacturing environments.
  • Managing equipment setups, tool calibrations, recipe optimization, and performance evaluations.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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