The posting
At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.
Department: Product Development and Manufacturing
Location: Taiwan
Role Summary
The Principal Development Engineer owns the electrical and mechanical optimization of connector interfaces, cable-to-connector assemblies, and cable-to-PCB interfaces for Kandou's high-speed interconnect products. This individual drives interconnect architecture from early concept through electromagnetic simulation (HFSS), Proof-of-Life (PoL) validation, and lab measurement, partnering closely with silicon, systems, mechanical, and customer-facing teams to deliver signal-integrity-optimized, manufacturable interconnect solutions.
Responsibility and Authority
- Own the end-to-end optimization of connector, cable-to-connector, and cable-to-PCB interfaces for Kandou's interconnect products.
- Lead conceptual design and architecture definition for new connector and cable interconnect solutions, evaluating electrical, mechanical, and manufacturability trade-offs.
- Build and run HFSS simulation models to characterize and optimize connector and cable interface electrical performance.
- Define and execute Proof-of-Life (PoL) studies to validate design intent prior to full qualification.
- Perform and oversee lab measurement and characterization (VNA, TDR, oscilloscope) to validate simulation predictions and debug performance issues.
- Drive design reviews and provide technical recommendations to engineering leadership, product management, and customers on interconnect design decisions.
- Collaborate cross-functionally with signal integrity, mechanical, systems, manufacturing, and customer teams to align interconnect designs with overall product requirements.
- Interface with connector and cable suppliers on design-in, sampling, qualification, and manufacturability.
- Mentor junior engineers on simulation methodology, measurement techniques, and interconnect design best practices.
- Individual responsibilities for this role are defined by Kandou's executive team on a project-by-project basis and may vary from this job description.
Required Experience
- 10+ years of experience in high-speed interconnect, connector, or cable assembly development within the semiconductor, networking, or computing industry.
- Proven track record of optimizing connector, cable-to-connector, and cable-to-PCB interfaces for high-speed differential signaling (e.g., PCIe, SerDes, 112G+/224G electrical interfaces).
- Extensive hands-on experience with Ansys HFSS (or equivalent 3D electromagnetic field solvers) for connector, cable, and interconnect modeling.
- Demonstrated experience leading conceptual design and architecture definition of new connector and cable interconnect systems, from early feasibility through detailed design.
- Experience planning and executing Proof-of-Life (PoL) studies to validate first-pass electrical and mechanical performance of new interconnect designs.
- Strong lab measurement background, including VNA, TDR, and oscilloscope-based characterization of connectors, cables, and interconnect channels.
- Experience working cross-functionally with mechanical, signal integrity, package, systems, manufacturing, and customer-facing teams to align interconnect designs with product and manufacturing requirements.
- Experience engaging directly with connector and cable vendors/suppliers on design-in, qualification, and manufacturability trade-offs.
Required Skills
- Deep understanding of high-speed signal integrity fundamentals: S-parameters, transmission line theory, impedance control, crosstalk, and insertion/return loss.
- Expert-level proficiency in HFSS for 3D full-wave electromagnetic simulation of connectors, cables, and PCB launch structures.
- Strong analytical skills to correlate simulation results with lab measurement data and resolve discrepancies.
- Ability to translate system-level electrical requirements into conceptual connector/cable interface designs and specifications.
- Excellent cross-functional collaboration and communication skills, with the ability to influence design trade-offs across engineering disciplines.
- Strong documentation skills for design reviews, test reports, and specification development.
- Ability to manage multiple concurrent development programs and prioritize effectively under schedule pressure.
- Strong presentation skills, with the ability to clearly convey technical findings, trade-offs, and recommendations to engineering leadership, cross-functional teams, and customers.
- Working knowledge of Lean Product Development (Lean PD) principles, applying them to streamline design iteration, reduce waste, and accelerate time-to-market.
- Strong written and verbal English communication skills, required.
- Mandarin language proficiency is a nice-to-have, given engagement with suppliers and customers in Mandarin-speaking regions.
- Ability and willingness to travel internationally to support supplier reviews, lab bring-ups, and customer engagements.
Required Competencies – Education
- Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, or an equivalent field.
- Advanced coursework or demonstrated expertise in electromagnetics, RF/microwave engineering, or high-speed signal integrity is desired.
