The posting
Salary Range: $70,000 - $105,000 annually
The compensation range listed is a good-faith estimate of the salary we reasonably expect to pay for this position at the time of hire. Actual compensation may vary based on factors such as experience, skills, education, certifications, and geographic location.
The salary range listed is the expected compensation range for this position at the time of hire. Actual compensation may vary based on experience, skills, education, and other job-related factors.
A Sr Micro Electro Mechanical Systems (MEMS) Engineer assists in the development and production for wafer fabrication in an integrated circuit fabrication facility for MEMS devices. Involves operating silicon wafer processing and test equipment to produce silicon-based devices.
• Produces production wafers and devices.
• Leads the development of new processes and procedures.
• Produces experimental wafers and executes non-standard processes.
• Creates process descriptions and documentation.
• Documents the process steps and parameters applied to specific wafers.
• Processes and parts measurements, including flatness, layer thicknesses, and other performance parameters.
• Maintains data analysis and reporting.
• Identifies and communicates unsafe situations to the facility staff and management.
• Writes safety protocols for any tools that the company brings into the fab, including mechanical, electrical and material hazard that might occur, updating maintenance and operation instructions and training of the equipment.
• Follows procedures for bringing in any new materials into the fab.
• Additional duties as assigned.
Bachelor’s Degree in electrical or mechanical engineering or related field preferred
• 4+ years of previous experience with equipment and processing in an integrated circuit fabrication facility; or equivalent combination of education and experience
• Familiar with data capture for images, storage and archive or images and ability to share them via facility and company data bases, and with Outlook.
• Training in some or all of the following areas:
• Wet bench processing including cleans (sulfuric peroxide, RCA, and resist strips)
• Photolithographic tools, including coaters, aligners, and developers
• Depositions including metal (evaporation, sputter, plating) dielectric (Thermal, CVD, PECVD, ALD, sputter)
• Etch processing including plasma (fluorine and chlorine based processes) and wet etch (KOH, TMAH, BOE, phosphoric)
• Metrology including: profilometry (Dektak, P15), film thickness (Nanospec, F-15) film resistivity, SEM
• Assembly processes including wager saw, die attach, wire bond, encapsulation and test
• Wafer bonding
• Backside grind and CMP
• Wafer test, setting up and operating probe stations and electronic measurement equipment
• Microscope inspections/contact profiling optical profiling
• PZT deposition (spin coating/curling Sol Gel) and etching
• Occasional travel either locally, nationally, and/or internationally may be required.
• High degree of proficiency in MS Office Suite, Outlook & Internet applications.
• Strong analytical, prioritizing, interpersonal, problem-solving, presentation, budgeting, project management (from conception to completion), & planning skills.
• Strong verbal and written communication skills (including analysis, interpretation, & reasoning).
• Solid understanding and application of mathematical concepts.
• Ability to develop and maintain collaborative relationships with peers and colleagues across the organization, as well as, internal and external clients.
• Ability to work well autonomously and within a team in a fast-paced and deadline-oriented environment.
• Ability to work with and influence peers and management.
• Self-motivated with critical attention to detail, deadlines and reporting.
PHYSICAL ASPECTS / WORK ENVIRONMENT
Regularly required to stand; walk; sit; use hands to finger, handle, or feel; reach with hands and arms; stoop, kneel, crouch, or crawl; and talk, hear and see.
• Regularly lift and/or move up to 10 pounds. Occasionally lift and/or move up to 25 pounds.
• Specific vision abilities required by this job include close vision, distance vision, color vision, peripheral vision, depth perception, and ability to adjust focus.
• The noise level in the work environment is usually low/moderate.
* Reasonable accommodations may be made to enable individuals to perform the essential functions.
