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Open nowPosted today

Senior Associate Engineer (Semiconductor Machine Equipment)

MCI CAREER SERVICES PTE. LTD.

Pay
SGD 3,000 – SGD 4,200 a month
Where
Singapore
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Your applicationOpen nowSenior Associate Engineer (Semiconductor Machine Equipment)MCI CAREER SERVICES PTE. LTD. · Singapore

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The clock on this job

Early applications get read.

12.9% of postings close within 7 days. Measured by our own scanner across the market.

Share of postings closed within
  1. 2.2%1 day
  2. 4.7%3 days
  3. 12.9%7 days
  4. 21.0%14 days
  5. 35.6%30 days
  6. 58.5%60 days
This job: posted today

The posting

Job Highlights

  • Located at Serangoon North, Singapore
  • Up to S$4,200
  • Working Days: 5 or 6 days per week (based on shift arrangement)
  • Benefits: AWS, Performance Bonus & Shift Allowances

Working Hours

Initial Training Period (Approximately 1–3 Months):

  • Normal Shift: 8:30 AM – 5:30 PM

After Training (Based on Operational Requirements):

  • Shift 2: 2:45 PM – 11:15 PM
  • Shift 3: 10:45 PM – 7:15 AM

Shift allowances are provided according to the assigned shift.

Responsibilities

  • Perform machine calibration, setup, testing and performance validation on semiconductor packaging equipment to ensure compliance with manufacturing specifications and quality standards.
  • Diagnose and troubleshoot assembly and manufacturing process issues, implementing corrective actions to improve first-pass yield, equipment performance and production cycle time.
  • Support Process Engineers in developing and qualifying inspection protocols, process recipes, tooling and manufacturing processes, including updating work instructions and procedures.
  • Verify the availability of manufacturing fixtures, jigs and technical documentation while ensuring accurate test data recording, quality reporting and continuous process improvement.

Skills/Experience Required

  • Diploma or Degree in Materials Science, Electrical, Mechanical Engineering or a related engineering discipline.
  • At least 3 years of relevant experience in semiconductor manufacturing, equipment engineering, process engineering or a related technical environment.
  • Strong analytical and systematic problem-solving skills, with knowledge of statistical analysis, Design of Experiments (DOE), JMP or Minitab being advantageous.
  • Experience with semiconductor equipment interfaces, machine calibration, process development or advanced packaging technologies such as Die Attach, Thermocompression Bonding (TCB), Fan-Out Wafer Level (FOWL) or Flip Chip (FC) is an advantage.
  • Proficiency in Microsoft Excel and technical data analysis, with the ability to work during normal training hours and subsequently on assigned afternoon or night shifts.

Applicants who possess relevant experience for the above responsibilities are most welcome to apply. If you do not possess the above experience, your application will still be considered on individual merits and you may be contacted for other opportunities.

Please submit your updated resume in MS Words format by using the APPLY NOW BUTTON or email the updated resume to [email protected]

By submitting your personal data and/or resume, you give consent to collection, use and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

https://www.mci.com.sg/wp-content/uploads/2025/09/MCI-Job-Applicant-Data-Protection-Notice.pdf

Kuan Mei Yang

Registration Number: R24124509

EA License No: 06C2859 (MCI Career Services Pte Ltd)

Posting text belongs to the employer. Removal requests: contact us.

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