The posting
Key Responsibilities
- Lead the development and scaling of next-generation advanced packaging technologies, leveraging expertise in thin film deposition processes including Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), and/or Atomic Layer Deposition (ALD) to enable customer roadmaps and address critical technology challenges.
- Drive process and technology roadmap development for advanced packaging, 3D integration, and related semiconductor applications through collaboration with customers, research organizations, and cross-functional engineering teams.
- Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on extremely complex systems for entire range of products for division
- Interact with key customers to resolve extremely complex process engineering issues to address customers High Value Problems (HVP) for an entire range of products for the division
- Ensures effective product/technology demonstrations
- Leads collaboration efforts with executive managers and junior managers to ensure strategic execution
- Leads market share improvement efforts
Functional Knowledge
- Demonstrates comprehensive understanding of concepts and principles within own job family and knowledge of other related job families
- Possesses deep technical expertise in semiconductor thin-film deposition technologies, including PVD, CVD, and/or ALD, and a strong understanding of materials engineering, process integration, and advanced packaging applications.
- Demonstrates knowledge of advanced packaging technologies, TSV, hybrid bonding, wafer-level packaging, and related semiconductor manufacturing processes.
- Demonstrated experiences in supervisory or management capacity.
- Outstanding communication and interpersonal skills with the ability to influence internally and externally, including senior management
- Problem-solver attitude with determination and quality-mindset management
Work Location
- Science Park II (Moving to Tampines from Apr 2027)



