The posting
Associate/Senior Engineer | Equipment (Semicon) – 6 openings Basic Up to $4,800
Our client is a global leader in the design and manufacture of semiconductor assembly equipment, offering strategic acquisitions, adding die bonding, wedge bonding and a broader range of expendable tools to its core ball bonding packaging solutions of assembling semiconductor devices.
We are seeking highly committed and motivated individuals to join us.
1st week work 5 days, next week work 6 days, then 5 days then 6 days.
Shift 2 : 2.45pm– 11:15pm ($15 /Shift)
Shift 3 :10:45pm – 7:15am ($25 /Shift)
Job Description:
·To perform machine performance validation on semiconductor packaging equipment through machine calibration, setup and testing based on defined work procedures.
·To provide level 1support to identify, diagnose and resolve assembly process related problems to achieve defined first pass yield and manufacturing cycle-time.
·To support Process Engineer to develop and qualify manufacturing inspection protocols (metrology equipment qualification or integrity test definition) to ascertain machine performance and integrity.
·To support Process Engineer in development and enhancement of process recipes, process tooling or manufacturing processes; inclusive of updating and enhancing of work procedures.
·To ensure and validate all necessary fixtures, jigs, drawings, and work instruction are available for manufacturing processes.
·To ensure timely input of manufacturing test data and support report output on machine quality.
·Perform other duties as assigned.
Qualifications:
·Diploma/ degree in automation or electronic qualification, or relevant discipline.
·2 to 5 years experience in semiconductor industry with equipment maintenance or testing engineering in a manufacturing facility, preferably in Electrical Wafer Sorting(EWS), Final Testing and Burn in testing of back-end operations.
·Possess strong interest in statistical analysis skill set with demonstrated ability to conduct design-of-experiment. Proficient in JMP or Minitab would be a plus
·Excellent systematic problem solving in areas of containment and counter-measures
·Experience in handling semiconductor capital equipment GUI and hands-on experience in process development of advanced packaging processes (die attach, TCB, FOWL or FC) will be advantageous
·Demonstrate flair in handling data analyzer, data processing tool (excel etc.) and words processing tools will be advantageous
·Ability to work on shift timing (2nd and 3rd).
Please make sure the below "Reason for leaving" is updated on your CV (Doc Words) before submitting to Lynn_Lim(a)mci.com.sg
Please Highlight yellow for related skills in your CV if you can.
By submitting your personal data and/or resume, you give consent to collection, use and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.
https://www.mci.com.sg/wp-content/uploads/2025/09/MCI-Job-Applicant-Data-Protection-Notice.pdf
**We regret to inform that only shortlisted candidates would be notified.
Lim Siew Thuay(Lynn) Registration Number: R1442808 EA Licence No: 06C2859 (MCI Career Services Pte Ltd)



