The posting
As a Senior or Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will be primarily responsible for developing and optimizing next generation, first of a kind (FAOK) wafer and die equipment (Post probe wafer and die development) to improve capability, productivity and cost of such equipment. You will take ideas from conception, through equipment and sub-component development, all the way to implementation in APTD and manufacturing facilities. You will also be required to identify, diagnose, and resolve equipment related problems by applying failure analysis, FMEA, 8D or FDC/Data Science methodology. Additional responsibilities include coordinating and carrying out equipment evaluation/optimization to implement changes, leading and participating in equipment maturity and availability improvement and cost reduction activities.
You will be working in a highly collaborative atmosphere, interacting with various groups such as process development, manufacturing, and equipment vendors, to ensure robust processes that meet the detailed physical requirements for Micron products. You will grow into an expert engineer, driving post probe wafer and assembly technology roadmaps, which have a direct influence on Micron’s global leadership in semiconductor manufacturing.
Job Description
Key responsibilities and duties include:
- Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking
- Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity
- Establish and improve equipment management projects to deliver tech node requirements
- Evaluate and promote new equipment and materials to enhance process capabilities
- Establish hardware strategic roadmaps for 5+ years in post probe wafer and die processing
- Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products. cost, availability, and improve hardware and process capability
- Ensure defense coverage through process, measurement, inspection, and testing
- Establish correlations between defense mechanisms to identify improvement opportunities
- Conduct continuous data analysis to establish advanced controls and identify improvement opportunities with SMAI team
- Good knowledge of Wafer Fab Manufacturing system, eg: MES, ETO, Autoshell and E3 FDC is preferred
- Develop hardware roadmaps for 5+ years in post probe wafer and die processing process area
- Collaborating with process development teams to develop innovative new solutions.
- Performing fundamental research to drive innovative solutions for next-generation equipment products.
- Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives
- Lead the equipment team to work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
- Lead and ensure smooth transition from new product development, qualification, small volume production to high volume production
- Constructs forecasts, proposals and strategic/tactical plans based on business data and market intelligence
- Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
- Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.
Education and Experience.
- B.S/M.S./Ph. D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields.
- 5 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field stacking process equipment TC bonder/ Hybrid Bonder
- Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred
- Experience with Visual Basic for automation and tool integration.
- Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
- Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding
- Experience in equipment development with fundamental understanding to execute to improve equipment maturity for First of a Kind (FOAK) hardware
- Experience in wafer bonding, plating, warpage control and packaging process development and understanding of related inline/electrical/probe failure
- Knowledge of semiconductor processing, solid-state device physics desirable
- Consistent track record to solve problems and address root causes
- Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes
