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Open nowPosted today

Senior/Staff Quality and Reliability Assurance Engineer - High Bandwidth Memory (Open)

MyCareersFuture97,045 open roles

Pay
SGD 6,000 – SGD 12,000 a month
Where
North, Singapore
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Your applicationOpen nowSenior/Staff Quality and Reliability Assurance Engineer - High Bandwidth Memory (Open)MyCareersFuture · North, Singapore

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The clock on this job

Early applications get read.

8.1% of postings close within 7 days. Measured by our own scanner across the market. MyCareersFuture postings stay open a median of 3 days.

Share of postings closed within
  1. 1.7%1 day
  2. 3.6%3 days
  3. 8.1%7 days
  4. 15.0%14 days
  5. 33.9%30 days
This job: posted today

MyCareersFuture median: 3 days open

The posting

As a Senior/Staff Product Quality and Reliability Assurance Engineer (PQRA), you will support reliability qualification and quality monitoring of High Bandwidth Memory products (HBM), help develop product reliability methodologies, and respond to product deviations as they pertain to quality and reliability. You will establish and implement requirements, specifications and metrics such as Defects per Million (DPM), Failure in Time (FIT), and Lifetime. In this role, you will work with multi-functional Engineering teams to ensure product reliability methods are established and followed, perform risk assessments, and provide support for manufacturing teams regarding reliability issues. In this dynamic role, you will have opportunities to gain new product knowledge on an ongoing basis!

You will:

Conduct New Product Qualifications

  • Define High Bandwidth Memory (HBM) qualification requirements
  • Comprehend failures and failure rate within the scope of the qualification
  • Perform risk assessment at all decision points within the qualification cycle
  • Review qualification data and sign off that qualification requirements have been met
  • Issue internal product release notifications for Qualification

Develop Product Reliability Methodology, Monitors, Metrics, and Specifications

  • Cooperatively develop and establish reliability targets and standards with technology development and product engineering teams
  • Comprehend new wafer fab and packaging technologies to identify and mitigate product reliability issues
  • Develop and improve product reliability tests to assess new HBM failure mechanisms
  • Coordinate and drive vital specification improvements for existing products
  • Review internal quality metric and drive customer DPM to BIC.

Establish and Implement Quality Requirements

  • Establish and review ongoing product Quality Metrics
  • Assess deviations for product quality and reliability risks
  • Data mining and correlation of all inline test data. Root cause finding and drive CA/PA.
  • Define evaluation necessary to mitigate risks
  • Review and support process Excursion Analysis
  • Communicate violations to defined release/acceptance criteria
  • Communicate issues and corrective actions across all Micron products

Provide Internal Technical Support for Customer Support Teams

  • Assist RMA Team with detailed analysis of returned material
  • Investigate manufacturing history and identify issues related to customer failure signature
  • Perform additional data collection as needed and per customer request
  • Develop Reliability Process Monitor (RPM) plans
  • Assist with necessary corrective actions at the manufacturing level
  • Comprehend field failure rates relative to internal failure rates
  • Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
  • Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Education:

  • Required: Bachelor’s degree in Electrical / Electronics/ Computer Engineering
  • Desired: Master’s Degree in Electrical / Electronics/ Computer Engineering

Required Qualifications:

  • 5+ years of experience in semiconductor field
  • Knowledge of DRAM operation, fabrication process and semiconductor device physics
  • Familiarity with advanced packaging, wafer testing, component testing and module testing concept and flow.
  • Strong troubleshooting skills
  • Good organizational skills and sharp attention to detail
  • Good written and oral communication skills
  • Ability to work independently or in a group environment
  • Knowledge of using statistical like JMP, Familiarity with Unix, DFII/Cadence, and/or ATE (Auto Test Equipment) preferred
  • Familiarity with Perl, C++, Python, HTML, CGI, or Java preferred
  • Engineering experience in one of the following areas preferred:
  • Product Engineering
  • Product Quality and Reliability
  • Process Integration
  • Product Yield Enhancement
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