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Open nowPosted yesterday

Senior Product Manager

nxp801 open roles

Where
Shanghai (JingAn)
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Your applicationOpen nowSenior Product Managernxp · Shanghai (JingAn)

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The clock on this job

Early applications get read.

13.6% of postings close within 7 days. Measured by our own scanner across the market. nxp postings stay open a median of 17 days.

Share of postings closed within
  1. 2.3%1 day
  2. 4.7%3 days
  3. 13.6%7 days
  4. 21.9%14 days
  5. 36.9%30 days
  6. 59.0%60 days
This job: posted yesterday

nxp median: 17 days open

The posting

Product Manager

Multi-Die Package / System-in-Package Products

Job Description

1. Market Insight and Analysis

· Closely monitor market dynamics and technology trends for highly integrated semiconductor products, including multi-die packages and system-in-package solutions that combine MCUs, gate drivers, power devices, power-management devices, and memory devices.

· Analyze target applications, customer needs, competitor portfolios, supply-chain conditions, cost structures, and packaging technology roadmaps; regularly deliver market research, opportunity assessments, and product strategy recommendations.

· Work closely with sales, field application, engineering, operations, and key customers to identify system-level pain points and translate them into differentiated integration opportunities and product concepts.

2. Product Definition and Management

· Develop product roadmaps and portfolio plans for multi-die package products; define product positioning, target markets, application scenarios, competitive value propositions, and business priorities.

· Lead system-level product definition across MCU, gate-driver, power-device, power-management, and memory functions, balancing electrical performance, thermal performance, reliability, package size, cost, manufacturability, and supply continuity.

· Define package architecture, die partitioning, interconnection approach, pinout, power and signal integrity requirements, thermal design targets, test strategy, quality and reliability goals, and hardware/software ecosystem requirements in collaboration with R&D and packaging teams.

· Draft and maintain MRDs, PRDs, product specifications, business plans, and project requirements, ensuring clear alignment across design, packaging, test, quality, operations, marketing, and sales teams.

· Lead feasibility assessment, business-case development, project initiation, development reviews, risk management, product validation, qualification, and new product introduction to ensure on-time and high-quality delivery.

· Take ownership of the full product lifecycle from concept and definition through mass production, portfolio optimization, change management, and end-of-life planning.

4. Partner and Supply-Chain Management

· Coordinate internal and external resources across wafer suppliers, OSAT partners, substrate and lead-frame suppliers, test houses, and ecosystem partners to support product development and scalable production.

· Participate in partner evaluation and selection, technical and commercial alignment, capacity planning, quality improvement, cost optimization, and supply-risk mitigation.

5. Data Analysis and Decision Support

· Track product performance, design wins, revenue, gross margin, forecast, yield, quality, customer feedback, and competitive developments to evaluate business health and product competitiveness.

· Use market and operational data to recommend roadmap adjustments, cost-reduction priorities, package or process improvements, and investment decisions to management.

Qualifications

1. Education Background

· Bachelor’s degree or above in Electronic Engineering, Microelectronics, Semiconductor Engineering, Materials Science, Automation, or a related discipline. A master’s degree or MBA is preferred.

2. Work Experience

· Minimum 8 years of experience in semiconductor product management, product definition, system architecture, packaging engineering, application engineering, or related roles.

· Proven hands-on experience with multi-die packaging or system-in-package products integrating two or more of the following device categories: MCU, gate driver, power device, power-management device, and memory device.

· Demonstrated experience leading cross-functional semiconductor products from market opportunity and definition through development, qualification, mass production, and market launch.

3. Professional Skills

· Product and System Expertise: Strong understanding of MCU architecture, gate-driver functions, power semiconductors, power-management devices, and memory technologies, including their system interactions and application trade-offs.

· Packaging and Process Expertise: In-depth knowledge of semiconductor packaging architecture, die attach, interconnect, substrates or lead frames, thermal management, signal and power integrity, assembly, test, reliability, qualification, yield, and cost drivers.

· Market Insight: Deep understanding of markets and applications where integration creates measurable value, with the ability to assess customer requirements, competitive alternatives, pricing, supply-chain factors, and business potential.

· Documentation Skills: Proficient in developing MRDs, PRDs, product specifications, business plans, product roadmaps, competitive analyses, and executive decision materials.

4. Comprehensive Competencies

· Communication & Collaboration: Strong cross-functional leadership and stakeholder-management skills, with the ability to align design, packaging, test, quality, operations, suppliers, sales, and customers around complex product decisions.

· Commercial Acumen: Strong business-case, pricing, cost, margin, and portfolio-management capabilities, with sound judgment in balancing technical differentiation and commercial return.

· English Proficiency: Fluent professional English, with the ability to read international technical documentation and participate effectively in cross-border technical and business discussions.

More information about NXP in Greater China...

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