The posting
Regional technical authority for next-generation AI and HPC infrastructure, owning technical strategy, solution architecture, customer engagement, and ecosystem development for advanced liquid cooling technologies across hyperscale, enterprise AI, and HPC deployments. Recognized as a trusted technical advisor to consultants, hyperscalers, Specialized Datacentre EPCs, engineering firms, and strategic customers covering full project technical lifecycle – from specification and technology selection to tendering, value engineering, Ecosystem upskilling and award. 2.1 Technical Leadership ▪ Act as regional technical authority for AI-ready DC infrastructure and liquid cooling; lead technical development of AI/HPC projects requiring high-density environments. ▪ Define/ Deploy reference architectures and best practices; establish technical governance for liquid cooling deployment; support executive leadership on technology strategy and competitive positioning. 2.2 AI & Liquid Cooling Expertise ▪ Direct-to-Chip (D2C), Rear Door Heat Exchangers (RDHx), Immersion Cooling, TCS and Secondary Network Heat (SFN) loops, CDU architecture & facility heat exchanger FWS design . ▪ Glycol/water loop engineering, hydraulic balancing, pumping systems, thermal management, heat rejection, water/ Mix Liquid quality management, facility hydraulic integration. ▪ Optimize air/liquid capture ratio, air-to-hybrid transition strategies, AI rack thermal management, high-density racks (>80–150+ kW/rack), thermal resilience, redundancy and energy efficiency. 2.3 AI Infrastructure Design ▪ Lead design for AI Pods, GPU clusters, NVIDIA HGX/MGX, NVL platforms, large GPU clusters, HPC and AI Factory architectures, high-density white space. ▪ Rack architecture, containment, high-performance airflow, power distribution integration, 800VDC-ready infrastructure, busbar systems, AI-ready POD compute topology, mechanical-electrical integration. 2.4 Presales & Specification Leadership ▪ Support Sales, coach BD teams, enable Presales, influence consultants, engineering firms, EPC / DCS contractors, hyperscalers and AI ecosystem partners. ▪ Lead specification development, design reviews, technology positioning, competitive differentiation, customer workshops, executive presentations and design validation. 2.5 Tendering & Value Engineering ▪ Own the full technical tendering process: qualification, architecture validation, risk assessment, design optimization, compliance review, value/cost engineering, technical negotiations, bid defense, customer clarifications and final technical approvals through to award. 2.6 Customer & Ecosystem Engagement ▪ Build trusted relationships with hyperscalers, enterprise customers, AI infrastructure providers, consultants, design institutes, EPC/mechanical contractors and channel partners. ▪ Represent the organization at executive workshops, industry conferences, technical seminars, customer advisory sessions and AI technology forums. 3. Required Competencies & Technical Expertise AI Infrastructure: GPU infrastructure, HPC architecture, AI Factory design, large-scale AI clusters, rack density optimization, thermal management, AI-ready electrical infrastructure. Critical DC Infrastructure Tier III/IV architectures, white space & containment, precision cooling, chilled water, CRAH/CRAC, in-row cooling, RDHx, high-availability mechanical systems, mission-critical redundancy. DC infrastructure Digital Twin, Desing simulation, DCS Software stack Liquid Cooling Direct Liquid Cooling & Immersion Cooling, TCS/SFN, CDU technologies, heat exchangers, hydraulic systems, pumping stations, thermal modeling/CFD, heat recovery concepts. Electrical Distribution 800VDC technologies, High density Power train architecture, integrated Compute critical infrastructure AI POD Skid . Industry knowledge: Vertiv, ABB, Schneider Electric, Carrier, Johnson Controls, STULZ, Munters, LiquidStack, CoolIT Systems, Motivair, Boyd, Submer, GRC, nVent, Delta Electronics, Huawei Digital Power, Equinix reference architectures, NVIDIA AI Infrastructure ecosystem. ▪ 12–15+ years in mission-critical data center infrastructure; minimum 7 years dedicated to high-density cooling technologies. ▪ Demonstrated experience on AI/HPC infrastructure projects and proven expertise in liquid cooling architecture and deployment. ▪ Extensive experience leading technical tendering and value engineering; strong customer-facing experience with hyperscalers, enterprise accounts, EPCs and consulting firms. ▪ Demonstrated success influencing technical specifications and securing major infrastructure projects. ▪ Recognized technical authority for AI cooling technologies; mentor regional presales/engineering organizations; build technical competency and drive innovation and technology adoption across the region. ▪ Deliver: regional AI/liquid cooling technical strategy, standardized AI reference architectures, technical enablement of sales/BD/presales, consultant and specification engagement plans, and technical ownership of strategic AI opportunities. ▪ Deliver: end-to-end tendering and value engineering leadership, regional design guidelines and enginee Rewards designed for you Our Total Rewards is our way of saying: We see you and we value you. 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