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Open nowPosted 3 days ago

Advanced Packaging Process Integration Engineer - Principal

Sky Water116 open roles

Where
200 NeoCity Wy, Kissimmee, FL 34744, USA
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Your applicationOpen nowAdvanced Packaging Process Integration Engineer - PrincipalSky Water · 200 NeoCity Wy, Kissimmee, FL 34744, USA

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The clock on this job

Early applications get read.

11.9% of postings close within 7 days. Measured by our own scanner across the market. Sky Water postings stay open a median of 20 days.

Share of postings closed within
  1. 2.1%1 day
  2. 4.4%3 days
  3. 11.9%7 days
  4. 18.6%14 days
  5. 35.6%30 days
  6. 45.1%60 days
This job: posted 3 days ago

Sky Water median: 20 days open

The posting

Position Summary:

In the Advanced Packaging group at Skywater Florida, our team works hand in hand with customers to develop a wide range of exciting new, novel, and fully customized technologies - including Si interposers, FanOut and hybrid bonding. This is a unique opportunity to lead the development of new, novel technologies and leverage the advanced capabilities of our semiconductor fab to enable our customers to progress from idea/proof of concept through product qualification and transfer to volume manufacturing. We are looking for a hardworking, passionate and visionary Process Integration engineer to lead this effort. In this role, you will lead, develop, and improve an overall integrated Advanced Packaging process flow to deliver a qualified product to our foundry clients. Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.

Major Area of Accountablity:

Transfer a client’s package requests into a process flow that utilizes Si interposer, FanOut and hybrid bonding manufacturing process flows. Identify areas that require development and lead the process team to deliver on schedule and with high yield a qualifiable final product. When required, lead task forces to identify root causes, correct and maintain product deliverables. Gain / utilize knowledge of the capabilities and interdependencies of tool sets within the process flow to create recipes that utilize temporary and permanent bonding, electrolytic / PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflows, flip chip, wire bond tools. Process integration for a wide variety of clients that include MEMS / Photonics / High Performance Computing / CMOS / Memory / AI / Quantum devices Develop comprehensive process flows for wafer manufacturing, ensuring seamless execution. Collaborate with CAD engineers to validate incoming layout files, constructing frames with essential metrology boxes and electrical test structures. Integrate TSV first and / or TSV last process flows to enable Foundry client packages. Utilize metrology tools to characterize process conditions, identify root cause of any defects and document results. Investigate and drive integration changes for improved device performance and yield improvement. Work with process and tool engineers to find processing marginalities and make improvements. Liaise with the failure analysis lab to submit samples for cross-sectioning, contributing to continuous improvement. Routinely monitor selected in line and end of line SPC charts for trends or excursions that can be addressed by integration changes. Create quick turn cycles of learning to identify issues early and create a final product and process flow for Foundry clients. Incorporate, monitor and improve electrical test parametric to deliver an electrically good final package. Design and conduct experiments to validate and optimize process recipes. Monitor customer material and proactively address processing issues, ensuring a smooth workflow. Conduct regular meetings with customers, providing updates on project progress as materials move through the production line. Deliver process reviews with the goal of transitioning the device to full-scale production.

The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.

Required Qualifications: Education: BS Engineering, MS/PhD preferred Experience and Skills:

10+ years of Process Development & Integration Engineer experience in Advanced Packaging Fab or semiconductor fab environment related to FanOut wafer level assembly and Hybrid Bonding. Advanced Packaging Fab processing tools knowledge/experience. MEMS / Photonic / HPC / AI / ASIC / Quantum device and integration knowledge with relevant combination of years of experience and/or advanced degree. Knowledge of DOE, SPC, and 6-sigma concepts and applications. Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes. Exceptional oral and written communication skills. Ability to thrive in a large cross-functional program environment. Project Management skills and/or defined training a plus. Can work both independently and in cross-functional teams for problem solving. Strong organizational skills and work ethic.

US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.

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