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Open nowPosted 6 hours ago

Design For Manufacturing Senior Engineer

Stellantis349 open roles

Where
Auburn Hills, MI, USA
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Your applicationOpen nowDesign For Manufacturing Senior EngineerStellantis · Auburn Hills, MI, USA

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The clock on this job

Early applications get read.

12.8% of postings close within 7 days. Measured by our own scanner across the market. Stellantis postings stay open a median of 5 days.

Share of postings closed within
  1. 2.2%1 day
  2. 4.5%3 days
  3. 12.8%7 days
  4. 20.6%14 days
  5. 35.6%30 days
  6. 58.4%60 days
This job: posted 6 hours ago

Stellantis median: 5 days open

The posting

Stellantis is seeking a Design for Manufacturing Engineer to shape the manufacturing readiness of next-generation automotive electronics, including High Performance Computers, domain controllers, zonal controllers and electronic control units.

In this role, you will connect Product Development with manufacturing partners to make product designs manufacturable, assemblable, testable, scalable and cost-effective. You will influence electrical, PCB, mechanical, thermal, assembly and production-test decisions from early concept through launch and stable mass production.

Responsibilities:

  • Lead DFM, DFA and DFT activities from architecture and concept through validation, industrialization, launch and continuous improvement.
  • Conduct manufacturing-feasibility reviews of schematics, PCB technologies and layouts, component selection, thermal interfaces, enclosures, connectors, fasteners, sealing concepts and tolerance schemes.
  • Define and maintain manufacturing design rules, checklists, review criteria, lessons learned and gate deliverables.
  • Evaluate PCB and PCBA manufacturability, including stack-ups, HDI/microvias, panelization, fine-pitch and BGA assembly, solder-paste printing, reflow, SPI, AOI, X-ray, selective soldering, press-fit, coating and rework.
  • Partner with Test Engineering to ensure access and coverage for ICT, flying probe, boundary scan/JTAG, programming/flashing, functional test and end-of-line test.
  • Ensure Built-to-Print production data packages are complete, consistent and configuration-controlled.
  • Assess EMS and manufacturing-partner technology, process maturity, equipment, capacity, automation, traceability, quality controls and launch readiness.
  • Lead manufacturing-risk tracking and drive findings to closure with owners, due dates and objective evidence.
  • Support prototype, pilot, validation, run-at-rate, safe-launch and production-ramp builds, including defect containment and root-cause resolution.
  • Analyze yield, defect, cycle-time, capability, scrap, rework and test data to drive design and process improvements.
  • Support APQP, PPAP, DFMEA/PFMEA, process-flow, Control Plan, MSA, SPC and change-control activities.
  • Collaborate with hardware, PCB, mechanical, thermal, software, test, validation, quality, sourcing, supply chain, program teams and global manufacturing partners.

Basic Qualifications:

  • Bachelor's degree in Electrical, Electronics, Mechanical, Manufacturing, Mechatronics, Industrial Engineering or a related technical discipline.
  • A minimum of 8 years of experience in automotive electronics development, manufacturing engineering, industrialization or supplier manufacturing engineering.
  • Experience launching complex electronic products through prototype, pilot, ramp-up and mass production.
  • Practical knowledge of PCB fabrication, SMT/PCBA manufacturing, ECU final assembly, production test and defect mechanisms.
  • Experience working with EMS or Tier-1 manufacturing partners in a Built-to-Print model.
  • Working knowledge of APQP, PPAP, DFMEA/PFMEA, Control Plans, MSA, SPC, capability studies, 8D and engineering change control.
  • Ability to read and challenge schematics, PCB data, Gerber/ODB++, BOMs, mechanical drawings, GD&T, tolerance analyses and manufacturing specifications.
  • Strong communication, organization, technical leadership and cross-functional problem-solving skills.

Preferred Qualifications:

  • Knowledge of IPC-A-610, IPC J-STD-001, IPC-2221/2222 and IPC-7351, and experience in IATF 16949 environments.
  • Experience with high-compute automotive electronics, large BGAs, high-speed interfaces, high-current power distribution, sealed assemblies and advanced thermal-management solutions.
  • Experience with manufacturing process audits, line trials, equipment-capability reviews and run-at-rate assessments.
  • Background in design-to-cost, should-cost, automation trade-offs, capital-equipment justification or production-data analytics.
  • Six Sigma, manufacturing, quality or reliability certification.
  • Familiarity with functional-safety and automotive cybersecurity development environments.
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