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Open nowPosted today

Silicon Photonics Engineer

U3 INFOTECH PTE. LTD.

Pay
SGD 6,000 – SGD 7,500 a month
Where
Singapore
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Your applicationOpen nowSilicon Photonics EngineerU3 INFOTECH PTE. LTD. · Singapore
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  6. 58.6%60 days
This job: posted today

The posting

  • Develop, integrate, and optimize 300mm Silicon Photonics (SiPh) technology platforms for pluggable optical modules, co-packaged optics (CPO), and photonic interposer applications.
  • Collaborate with R&D, process integration, and module engineering teams to define, develop, and execute SiPh process flows.
  • Translate customer requirements into device specifications, process requirements, and technical solutions through discussions and in-depth technical reviews.
  • Coordinate with external OSATs (Outsourced Semiconductor Assembly and Test providers) and technology partners for Photonic Integrated Circuit (PIC) and Electronic Integrated Circuit (EIC) characterization and packaging integration.
  • Support optical device design, process integration, characterization, and performance optimization.
  • Apply Design of Experiments (DOE), Failure Mode and Effects Analysis (FMEA), and control plan methodologies to improve process robustness, product quality, and manufacturing readiness.
  • Perform data-driven analysis, identify process deviations, investigate root causes, and implement corrective and preventive actions.
  • Assess technical risks and drive continuous improvement throughout technology development, validation, and qualification.
  • Work closely with cross-functional teams and external stakeholders to ensure successful technology development and integration.

Required Qualifications and Skills

  • Bachelor’s degree in Electronics, Electrical Engineering, Physics, Materials Engineering, or a related technical field.
  • Minimum 3 years of hands-on experience in Silicon Photonics (SiPh) R&D, process development, process integration, or a closely related field.
  • Strong technical background in one or more of the following: Silicon Photonics process development and integration. Photonic Integrated Circuit (PIC) design, fabrication, or characterization. Optical device design and performance characterization. Photonic packaging and integration. Semiconductor foundry process development and module-level engineering.
  • Familiarity with semiconductor foundry environments and technology development workflows.
  • Working knowledge of DOE, FMEA, control plans, and structured problem-solving methodologies.
  • Strong analytical, troubleshooting, and data interpretation skills.
  • Excellent communication and collaboration skills, with the ability to engage internal engineering teams, customers, OSATs, and external partners.
  • Self-motivated, curious, and committed to innovation, quality, and continuous improvement.

Preferred Qualifications

  • Experience with 300mm semiconductor wafer processing and technology development.
  • Exposure to silicon photonics applications in high-speed optical communications, data centers, or advanced packaging.
  • Knowledge of co-packaged optics (CPO), pluggable optical transceivers, photonic interposers, and PIC/EIC integration.
  • Experience supporting process qualification, technology transfer, yield improvement, or manufacturing ramp-up.

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