The posting
Our client is a leading global semiconductor manufacturing company specializing in advanced semiconductor technologies. They are expanding their operations and are looking for motivated individuals to join their growing team.
Position: Associate Engineer – Wire Bond Equipment Location: North Region Working Hours: 12-hour rotating shift (Day & Night Shift) Employment Type: Permanent Role
Job Responsibilities
- Perform equipment setup, qualification, and conversion for Wire Bond machines.
- Troubleshoot and repair equipment-related issues to minimize production downtime.
- Conduct preventive and corrective maintenance to ensure equipment reliability.
- Monitor equipment performance and implement improvement actions.
- Support production during machine breakdowns and urgent technical issues.
- Perform root cause analysis, implement corrective actions, and maintain equipment and spare parts records.
Job Requirements
- Minimum Diploma in Electrical, Electronics, Mechanical, Mechatronics Engineering, or related discipline.
- Minimum 2 years of hands-on experience in Wire Bond equipment maintenance and troubleshooting.
- Experience with KNS Maxum, iConn, or Rapid Bonder machines is preferred.
- Strong equipment troubleshooting, maintenance, and problem-solving skills.
- Knowledge of semiconductor backend assembly processes is an advantage.
- Willing to work 12-hour rotating shifts, including day and night shifts.



