The posting
HyperLight is at the forefront of the commercialization of thin-film lithium niobate (TFLN) integrated photonics - a material and process technology that is enabling high-performance, scalable optical components across AI/datacom infrastructure, hyperscale computing, quantum computing, sensing, and beyond. Founded in 2018 and backed by leading venture capital, we’ve built a team and a platform focused on real-world mass deployment of TFLN photonics technology.
At the core of our work is the TFLN Chiplet™ platform — a modular, integrated architecture designed for scalability, manufacturability, and seamless integration into complex systems. It offers a rare combination of extraordinary performance and industrial readiness, enabling system developers across applications to deploy the technology fast and ready. We partner with our customers and suppliers from conceptualization, design, and prototyping phases, all the way through mass production to ensure smooth and rapid deployment of TFLN photonic technology.
We believe our platform is the key, in the golden age of integrated photonics, to empower humanity to the next level. We assembled a world class team covering engineering, business, and operations. We believe in the power of integrity, innovation, collaboration, and pragmatic solutions. Our diverse team thrives on challenges and is united by a shared commitment to excellence. We take pride in tackling complex challenges with curiosity, humility, and a deep sense of care for one another.
Our growing team is looking for an OSAT Operation Manager to lead backend operations at our manufacturing partner sites in Taiwan. In this role, you will manage a team that works closely with foundries and OSAT vendors to build and maintain robust, scalable backend operations across multiple platforms and manufacturing partners.
Key Responsibilities:
Site & Partner Management
- Serve as Hyperlight's site manager for all test and OSAT activities in Taiwan.
- Lead and manage a team that acts as Hyperlight's primary on-site interface with external manufacturing partners, including foundry test teams and OSAT vendors, to ensure seamless production execution.
- Work with manufacturing partners and equipment vendors to debug test-related hardware and software issues, minimizing downtime and disruption to production.
Production Execution
- Own and drive wafer-level backend execution across foundry and OSAT partners — including dicing/singulation, bumping, and assembly — covering prioritization, scheduling, vendor readiness, and day-to-day execution to meet production timelines and delivery commitments.
- Partner with operations teams to optimize wafer flow from foundry to OSAT, ensuring smooth logistics and minimal delays.
- Ensure the integrity, accuracy, and organization of data received from foundries and OSATs to support effective analysis and decision-making.
Yield, Quality & Test Optimization
- Collaborate with test engineering, process engineering, operations, and quality teams to troubleshoot backend process yield and test-related issues.
- Work with Hyperlight test engineering teams to reduce production test time while maintaining coverage and product quality.
- Coordinate with internal stakeholders and external partners to identify root causes and drive timely resolution of yield excursions and test anomalies.
- Oversee implementation of corrective actions at foundry test and OSAT sites, and track effectiveness through yield and test metrics.
Requirements
Education
- Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, Materials Science, Photonics, or a related technical discipline.
Experience
- 10+ years of experience in semiconductor test, product engineering, or manufacturing operations, including at least 2 years in a management role, with direct engagement with foundries and OSAT partners.
- Proven track record managing OSAT operations end-to-end — production scheduling, execution, yield tracking, and vendor performance management.
- Demonstrated impact reducing cost-of-test and optimizing test time, with measurable improvements in production efficiency.
Continuous Improvement & Communication
- Drive continuous improvement initiatives for production workflows, focusing on efficiency, quality, and cycle time reduction.
- Establish and maintain clear communication and reporting formats on production status, issues, and improvement initiatives for internal and external stakeholders.
- Experience leading root cause analysis and driving corrective actions to closure across external partners, using a data-driven approach.
- Experience leading cross-functional initiatives across test engineering, process, operations, and external vendors, with the ability to influence without direct authority.
Technical Expertise: Deep knowledge of semiconductor backend (post-fab) manufacturing, including:
- Wafer sort / probe (wafer test)
- Wafer-level dicing/singulation — street layout awareness, saw/laser process fundamentals, tape/film selection, kerf/edge quality control, and dicing-to-pick handling
- Wafer bumping (e.g., Cu pillar / solder bump) — process flow (UBM/metallization, plating, reflow), bump metrology, reliability risks, and supplier control plans
- Die/chiplet assembly and packaging — die attach, pick-and-place/flip-chip, underfill/encapsulation, substrate/interposer considerations, and in-process quality checks through final test readiness
- Expertise in optical testing — characterization, validation, and troubleshooting of photonic or optical devices — is a plus
Skills & Attributes
- Excellent communication and stakeholder management skills, with experience presenting data, issues, and recommendations to both technical and executive audiences.
- Proficiency in written and spoken English and Chinese.
- Self-directed and results-oriented, with strong ownership and accountability in a fast-paced, high-ambiguity environment.
Benefits
- Competitive market-based compensation and benefits
- Professional growth and mentorship opportunities
