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Open nowPosted 86 days ago

Principal Optical Engine (OE) / Link Architect

Xscape Photonics Inc13 open roles

Where
Santa Clara
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Your applicationOpen nowPrincipal Optical Engine (OE) / Link ArchitectXscape Photonics Inc · Santa Clara

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The clock on this job

Early applications get read.

12.1% of postings close within 7 days. Measured by our own scanner across the market. Xscape Photonics Inc postings stay open a median of 46 days.

Share of postings closed within
  1. 2.1%1 day
  2. 4.5%3 days
  3. 12.1%7 days
  4. 19.1%14 days
  5. 35.6%30 days
  6. 52.7%60 days
This job: posted 86 days ago

Xscape Photonics Inc median: 46 days open

The posting

Job Title: Principal Optical Engine (OE) / Link Architect

About the Role

We are seeking a highly experienced and visionary Principal Optical Engine (OE) Architect to lead the technical definition and architectural of Optical link design of our next-generation optical products. In this critical role, you will be responsible for defining an OCI-MSA (Optical Compute Interconnect - Multi-Source Agreement) ready Optical Engine

Working in lockstep with Product Management, you will take the Market Requirements Document (MRD) and translate those market needs into a highly detailed, actionable Product Requirements Document (PRD). You will leverage your deep expertise in end-to-end optical link architecture, Photonic Integrated Circuits (PIC), and Electronic Integrated Circuits (EIC) to architect solutions that push the boundaries of high-speed optical interconnects.

Key Responsibilities

  • PRD Generation & Ownership: Collaborate directly with Product Management (who drives the MRD) to develop, refine, and own the comprehensive Product Requirements Document (PRD) for our next-generation Optical Engines.
  • Transceiver System Architecture: Architect complete optical transceiver sub-systems. Balance optical, electrical, thermal, and mechanical parameters to meet stringent power, performance, and cost targets for OCI-MSA compliance.
  • End-to-End Link Architecture: Define and manage the end-to-end optical link budget. Model optical impairments (e.g., dispersion, noise, crosstalk, penalties), define Forward Error Correction (FEC) requirements, and ensure robust signal integrity across the link.
  • PIC & EIC Integration: Lead the system-level architecture bridging Photonic Integrated Circuits (PIC) and Electronic Integrated Circuits (EIC), heavily optimizing the interaction between DSPs, TIAs, Modulator Drivers, and optical components.
  • Modulation & Signal Integrity: Drive architectural decisions regarding high-speed modulation formats (e.g., PAM4, Coherent) and collaborate with SI/PI teams to ensure the electrical interfaces meet high-speed compliance standards.
  • Standards & Ecosystem Leadership: Ensure product alignment with current and emerging OCI and MSA standards. Act as a technical representative for the company within relevant industry consortia.
  • Trade-off Analysis: Conduct rigorous technical and cost trade-off analyses for different OE architectures, packaging technologies, component selections, and link budget allocations.

Required Qualifications & Experience

  • Experience: 10+ years of proven industry experience functioning as a Transceiver Architect, Link Architect, or Principal Optical System Architect.
  • Industry Pedigree: Previous experience at tier-1 semiconductor or optical networking companies is highly preferred (e.g., Intel, Broadcom, Marvell, Cisco, or similar industry leaders).
  • Core Domain Expertise: Deep, hands-on architectural knowledge of both PIC (Photonic Integrated Circuits) and EIC (Electronic Integrated Circuits).
  • Proven track record in optical transceiver design (e.g., OSFP, QSFP-DD, or Co-Packaged Optics).
  • Mastery of link budgeting, optical penalty modeling, and FEC trade-offs for high-speed datacom/telecom links.
  • Standards Knowledge: Familiarity with the Optical Compute Interconnect (OCI) ecosystem and experience developing products aligned with Multi-Source Agreements (MSAs).
  • Product Definition Skills: Demonstrated capability to write highly detailed PRDs and translate high-level market requirements (MRDs) into strict, actionable technical specifications for engineering teams.
  • Education: MS or Ph.D. in Electrical Engineering, Photonics, Physics, or a related field.

Preferred Skills

  • Experience with advanced 2.5D/3D packaging technologies (e.g., TSV, micro-bumping, flip-chip) relevant to modern Optical Engines.
  • Strong understanding of thermal challenges in high-density, co-packaged, or pluggable optical interconnects.
  • Excellent communication skills with the ability to articulate complex link-level technical concepts to cross-functional engineering teams and business stakeholders.
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