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Open nowPosted 12 days ago

Module Product Engineer

Renesas Electronics186 open roles

Where
Tempe, AZ, United States
Work mode
On site
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Your applicationOpen nowModule Product EngineerRenesas Electronics · Tempe, AZ, United States

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The clock on this job

Early applications get read.

7.4% of postings close within 7 days. Measured by our own scanner across the market. Renesas Electronics postings stay open a median of 1 days.

Share of postings closed within
  1. 1.5%1 day
  2. 3.5%3 days
  3. 7.4%7 days
  4. 13.2%14 days
  5. 34.6%30 days
This job: posted 12 days ago

Renesas Electronics median: 1 days open

The posting

Job Description

HYBRID

Applicants for this position must be currently authorized to work in the United States on a full-time basis. Renesas is unable to sponsor applicants for work visas for this position now or in the future.

Seeking an experienced Product Engineer (PE) to own the technical readiness, manufacturability, and lifecycle performance of advanced power modules from New Product Introduction (NPI) through high-volume production and sustaining. This role is accountable for end-to-end product execution across design, test, quality, assembly, and manufacturing to deliver performance, quality, cost, and schedule targets at scale.

Renesas Electronics, a leading global semiconductor company, is rapidly scaling its AI-focused power delivery business. Products include high-performance digital power VRMs, multiphase controllers, Smart Power Stages (SPS), Vertical Power Stages (SPS with integrated capacitors and multiple silicon die), Power Towers (power modules integrating multiple SPS-equivalents with capacitors and inductors), and power MOSFETs.

Key Responsibilities

  • Own product engineering execution for advanced power modules from NPI through high-volume production and sustaining
  • Own the manufacturability of advanced power modules, driving robust assembly processes across OSAT and internal manufacturing sites
  • Establish and enforce assembly workmanship standards, ensuring compliance with IPC-A-610 (Acceptability of Electronic Assemblies)
  • Drive cross-functional alignment across Design, Test, Quality, and Manufacturing to enable scalable, high-yield module production
  • Lead resolution of assembly-related excursions, including die attach, clip attach, solder integrity, and module-level defects
  • Lead product bring-up, characterization, and silicon readiness in partnership with Design, Test, and Applications teams
  • Define and maintain product specifications, limits, and guard-bands based on silicon behavior and manufacturing capability
  • Lead yield analysis, parametric trend monitoring, and root-cause investigations
  • Drive cost, yield, and cycle-time improvement through data-driven analysis
  • Own manufacturing release, qualification execution, and product change management (PCNs)
  • Serve as the technical escalation owner for production issues, customer returns, and corrective actions
  • Support critical customer engagements on product, quality, and manufacturing topics as needed

Qualifications

Education:

  • Bachelor’s degree required in Electrical Engineering, Computer Engineering, or a related field; master’s degree in a relevant engineering discipline preferred. Mechanical Engineering degree preferred, particularly for roles involving module packaging, thermomechanical behavior, and assembly optimization.

Experience & Skills:

  • Applicants for this position must be currently authorized to work in the United States on a full-time basis. Renesas is unable to sponsor applicants for work visas for this position now or in the future.
  • 8+ years of experience in semiconductor product engineering, manufacturing engineering, or test engineering, with demonstrated ownership from NPI through high-volume production
  • Strong technical depth in semiconductor power products and advanced power module manufacturing
  • Strong data analysis skills with the ability to interpret statistical results and drive decisions
  • Working knowledge of new product development, qualification, and high-volume manufacturing transfer
  • Strong written and verbal communication skills with customers and cross-functional teams
  • Proven ability to lead complex technical decisions, escalations, and execution across organizations

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

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