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Open nowPosted 98 days ago

Process Integration Engineer

Absolics Inc17 open roles

Pay
$100,000 – $150,000 a year
Where
Covington, Georgia
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Your applicationOpen nowProcess Integration EngineerAbsolics Inc · Covington, Georgia

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The clock on this job

Early applications get read.

8.2% of postings close within 7 days. Measured by our own scanner across the market. Absolics Inc postings stay open a median of 19 days.

Share of postings closed within
  1. 1.8%1 day
  2. 3.6%3 days
  3. 8.2%7 days
  4. 15.2%14 days
  5. 34.0%30 days
This job: posted 98 days ago

Absolics Inc median: 19 days open

The posting

Job Title: R&D Engineer - Process Integration

Location: Covington, GA

Job Type: Full-Time

About Us: Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens of clients globally. By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.

Job Description:

We are seeking a highly skilled and experienced Process Integration Engineer to join our team. The successful candidate will be responsible for orchestrating and integrating critical process steps, such as:

  • dielectric materials selection and application
  • lithography
  • wet + dry clean/etch/develop processes
  • PVD and electroplating

into a coherent, manufacturable process flow for fine-pitch, next-generation packaging architectures. You will support finalizing various Process Integration Plans, defining design rules, managing process window tradeoffs across module boundaries, and be the primary technical decision-maker to help navigate constraints in the full process flow. You will work daily with the lithography, wet/dry process, dielectric, and plating engineers, translating their individual process capabilities into a working end-to-end flow, while also engaging with device/package design teams on architectures feasibility. In an early-stage environment, this role carries enormous influence on the finalized architecture and build-up decisions.

Key Responsibilities:

  • Oversee process integration, manage scheduling, and provide comprehensive progress reports to upper management.
  • Develop and implement process integration strategies to optimize production yield and efficiency.
  • Coordinate with cross-functional teams to ensure seamless integration of processes.
  • Monitor and analyze process performance, identifying areas for improvement.
  • Ensure compliance with industry standards and safety regulations.
  • Troubleshoot and resolve process-related issues in a timely manner.
  • Maintain detailed documentation of processes and procedures.
  • Generate innovative ideas for patent filings.

Required Skills:

  • Demonstrated experience integrating multi-step package build up process flows (SAP and/or damascene), from lithography through metallization and dielectric build-up
  • Strong working knowledge across the full unit-process stack: photolithography, wet/dry etch, PVD seed deposition, dielectric film processing, and electroplating, sufficient to identify cross-process interactions and failure handoffs
  • Experience authoring or owning Process Integration Plans, design rules (line/space, via CD, registration/overlay budgets, taper angle specs), and process flow documentation
  • Track record of root-causing yield or reliability excursions that span multiple process modules (e.g., seed undercut driving downstream plating defects, via CD variation driving lithography-etch mismatch)
  • Statistical process control and DOE methodology for multi-variable, multi-step process optimization
  • Strong cross-functional collaboration skills; ability to translate unit-process engineer findings into integration-level decisions and vice versa
  • Familiarity with metrology and failure analysis techniques across the flow (SEM, FIB cross-section, CD-SEM, overlay metrology, electrical test)
  • Understanding of registration, overlay, and CD budget allocation across sequential build-up layers
  • Fluent in English; proficiency in Korean is a plus.

Preferred Skills

  • Experience with glass core substrates
  • Direct experience scaling fine line/space RDL, including via CD control and multi-layer registration challenges
  • Experience with any next-gen architecture enablement: glass core/glass interposer integration, panel-level processing, co-packaged optics, hybrid bonding, or fan-out heterogeneous integration
  • Familiarity with bifurcated roadmap considerations (high-performance AI/HPC vs. cost-optimized mainstream paths) and how that shapes architecture and material tradeoffs
  • Experience building DFM (design-for-manufacturing) guidelines in collaboration with package design teams
  • Knowledge of reliability qualification frameworks (JEDEC, IPC) as they constrain integration choices
  • Familiarity with new equipment or process technology evaluation and incorporation into an existing flow (e.g., panel-level CMP, advanced laser/plasma drill, novel dielectric chemistries)
  • Experience presenting integration roadmaps or technical reviews to leadership or cross-functional stakeholders
  • Publication, patent, or conference presentation record (e.g., ECTC) in RDL/interconnect integration

Education

  • Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, or related field preferred
  • M.S. with 5+ years of relevant process integration or process engineering experience considered (integration roles typically warrant a higher experience bar than single-unit-process roles)

Benefits:

  • 401K 6% matching (NO vesting period)
  • Healthcare 100% support (Health, Dental, Vision)
  • Life, STD, LTD 100 % support
  • Cell phone allowance
  • PTO and self-development

SALARY:

  • $100,000 – $150,000
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