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Open nowPosted 16 days agoWe saw it 112 min after it went up

Staff Engineer - Advanced Packaging Multiphysics Physics Modeling

Absolics Inc17 open roles

Pay
$90,000 – $150,000 a year
Where
Covington, Georgia
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Your applicationOpen nowStaff Engineer - Advanced Packaging Multiphysics Physics ModelingAbsolics Inc · Covington, Georgia

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The clock on this job

Early applications get read.

8.2% of postings close within 7 days. Measured by our own scanner across the market. Absolics Inc postings stay open a median of 19 days.

Share of postings closed within
  1. 1.8%1 day
  2. 3.6%3 days
  3. 8.2%7 days
  4. 15.2%14 days
  5. 34.0%30 days
This job: posted 16 days ago

Absolics Inc median: 19 days open

The posting

Role Title: Staff Engineer - Advanced Packaging Multiphysics Physics Modeling (Mechanical- Electrical Co-Simulation)

Job Title: Staff Engineer - Advanced Packaging Multiphysics Physics Modeling

Location: Covington, GA

Job Type: Full-Time

Job Description:

This role owns the simulation, modeling and interpretation of Multiphysics behavior across advanced packaging architectures from die level interconnects through buildup layers to system-level integration. The engineer will build and validate predictive models for mechanical (stress, warpage, fatigue, delamination, cracking, SeWaRe) and electrical (signal/power integrity, thermal-electrical coupling) performance, translating simulation output into design rules and go/no-go decisions for process and product teams. Core work spans finite element analysis (FEA) of interlayer/interface stresses, material characterization and constitutive modeling, failure mode prediction (crack initiation, delamination, via cracking, SeWaRe type reliability failures), and RDL/buildup layer mechanical-electrical co-optimization, closing the loop between simulation predictions and physical failure analysis/reliability test data.

Required Skills:

  • FEA modeling (ANSYS, Abaqus, or COMSOL) for stress/strain, thermos-mechanical and fracture mechanics analysis in multilayer stacks
  • Interface/interlayer stress and delamination modeling (cohesive zone modeling, VCCT, traction-separation laws)
  • Material property characterization, and modeling for polymers (dielectrics, mold compounds) metals, (Cu, Ti seed), and glass/ceramic substrates – CTE mismatch, viscoelasticity, plasticity
  • Working knowledge of RDL buildup layer, and interposer architectures (organic, glass core) and their process induced stress states
  • Failure mode analysis tied to package reliability (thermal cycling, SeWaRe, drop/shock, warpage) with ability to correlate simulation to physical failure analysis (SEM, CSAM, cross-section)
  • Electrical performance simulation basics – signal/power integrity or coupled electro-thermal-mechanical modeling
  • Strong grasp of semiconductor packaging unit processes (lithography, plating, etch) and how they introduce residual stress
  • Scripting/automation for parametric studies (Python, MATLAB, or APDL/Abaqus scripting)
  • Ability to translate simulation results into actionable design rules for process/product engineering teams

Preferred Skills

  • Experience with panel level packaging reliability prediction
  • Exposure to system-level (board + package + die) co-simulation
  • DOE/Statistical methods for correlating simulation with experimental reliability data
  • Familiarity with glass core interposer or 2.5D/3D heterogenous integration mechanics
  • Experience with machine learning assisted surrogate modeling for faster design space exploration

Education:

  • PhD or equivalent industry experience in mechanical engineering materials science, or semiconductor device physics

Benefits:

  • 401K 6% matching (NO vesting period)
  • Healthcare 100% support (Health, Dental, Vision)
  • Life, STD, LTD 100 % support
  • Cell phone allowance
  • PTO and self-development

SALARY:

  • $90,000 – $150,000
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