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Open nowPosted 209 days ago

Lead Application Engineer

Advantest278 open roles

Where
San Jose, CA, USA
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Your applicationOpen nowLead Application EngineerAdvantest · San Jose, CA, USA

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  6. 43.5%60 days
This job: posted 209 days ago

The posting

We are seeking a highly experienced Lead Application Engineer to join Advantest’s Research & Ventures (R&V) team, developing and delivering advanced semiconductor test solutions on the Advantest V93000 Test Platform, with a strong focus on wafer-level (die-level) testing, thermal management, and high-performance digital devices.

As part of the R&V team, you will have the opportunity to work on new and cutting-edge technologies and play a critical role in incubating, enabling, and bringing new products and capabilities to our customers. You will be a key technical contributor, working closely with R&D, cross-functional teams and customers to transform early concepts and advanced technologies into robust, scalable test solutions.

You will independently design, implement, debug, and optimize test programs for silicon devices at the wafer level, while managing the thermal and electrical challenges.

The ideal candidate is a self-starter with strong SmarTest8 expertise, hands-on experience with die-level probers, and a passion for innovation—capable of leading technical discussions, influencing research, and delivering end-to-end solutions that shape the future of semiconductor testing.

Responsibilities

  • Lead the design, development, execution, and debugging of test programs on the Advantest V93000 platform
  • Develop test programs, test methods, and reusable libraries using C++ and Java in SmarTest8
  • Own wafer-level (die-level) test program development, including silicon bring-up, characterization, and support using die-level probers
  • Manage and optimize thermal aspects of device testing, including temperature control strategies, thermal limitations, and correlation of electrical behavior across temperatures
  • Work with high-power devices and develop test programs that actively manage power dissipation and thermal constraints during testing, ensuring safe operation, test integrity, and repeatable results across operating conditions
  • Execute, debug, and resolve test program issues on both, offline and online systems
  • Provide end-to-end ownership of test solutions, spanning ATE hardware, probers, load boards, probe cards, and test software
  • Debug and resolve complex issues across hardware, software, silicon, and thermal domains
  • Act as the primary technical interface for cross-functional teams, leading technical discussions, design reviews, and root-cause analysis sessions
  • Support requirements analysis, benchmark testing, demonstrations, and training
  • Collaborate closely with R&D, COE, and global engineering teams to develop next-generation wafer-level and system-level test solutions
  • Partner with leading customers on next‑generation high‑power devices to co‑define advanced test requirements, exploring power delivery, thermal management, and wafer‑level test methodologies on the V93000 platform
  • Lead customer‑facing engagements—including technical discussions, deep‑dives, and pilot programs—to prototype and validate high‑power, thermally‑constrained test solutions, transforming early concepts into scalable test programs, methods, and reusable frameworks.

Minimum Qualifications

  • Bachelor’s degree (or higher) in Electrical Engineering, Computer Engineering, Computer Science, or a related field
  • 5–7 years of hands-on experience developing and debugging test programs, test methods, and libraries on V93000 using SmarTest8
  • Proficiency in Java for test program and test method development
  • Hands-on experience with wafer-level (die-level) testing, including working directly with silicon and dies using die-level probers
  • Proven experience managing thermal aspects of test devices, including temperature-dependent behavior and test execution across thermal conditions
  • Hands-on experience working with V93000 hardware, load boards, probe cards, and prober integration
  • Proven ability to debug and resolve issues end-to-end, spanning software, hardware, silicon, and thermal domains
  • Ability to lead technical discussions and influence technical decisions
  • Ability to work both independently and within a team in a fast-paced, changing environment
  • Self-motivated, proactive, and execution-focused

Preferred Skills

  • Experience developing test programs for digital and high-performance compute (HPC) devices
  • Deep understanding of V93000 system architecture, wafer-level test flows, and best practices
  • Strong understanding of high power devices and their thermal behavior at wafer level
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