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Open nowPosted 3 days ago

PCB Manufacturing Process Engineer - Mechanical & Laser Drilling

Advantest295 open roles

Where
South Plainfield, NJ, USA
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Your applicationOpen nowPCB Manufacturing Process Engineer - Mechanical & Laser DrillingAdvantest · South Plainfield, NJ, USA

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The clock on this job

Early applications get read.

13.4% of postings close within 7 days. Measured by our own scanner across the market. Advantest postings stay open a median of 6 days.

Share of postings closed within
  1. 2.2%1 day
  2. 4.6%3 days
  3. 13.4%7 days
  4. 21.6%14 days
  5. 36.2%30 days
  6. 59.0%60 days
This job: posted 3 days ago

Advantest median: 6 days open

The posting

Position Summary

The PCB Manufacturing Process Engineer (Mechanical & Laser Drilling) is responsible for developing, optimizing, and sustaining drilling processes used in Advanced printed circuit board (PCB) manufacturing. This role supports both mechanical and laser drilling operations to ensure production efficiency, product quality, capacity and capability improvements. The engineer will work closely with Front End Engineering, Quality, CAM, Maintenance, and Production teams to maintain robust process capability for Advanced ATE (Automated Test Equipment) PCBs (Load Boards, Probe Cards, Interposers, and others) used in semiconductor testing.

Key Responsibilities

Mechanical Drilling Process Engineering

• Develop, optimize, and control mechanical drilling processes for PCB fabrication.

• Establish drilling parameters including spindle speeds, feed rates, stack heights, entry/backup materials, and tool selection.

• Monitor drilling performance and implement continuous improvement initiatives to enhance hole quality and productivity.

• Troubleshoot issues related to:

  • Hole location accuracy
  • Burr formation
  • Nail-heading
  • Smear
  • Breakout
  • Drill breakage
  • Hole wall quality

• Support new product introductions (NPI) by establishing drilling process requirements and capabilities.

Laser Drilling Process Engineering

• Develop and optimize UV and CO₂ laser drilling processes for HDI microvia applications.

• Monitor microvia quality and yields.

• Conduct and document process capability for a given material and via geometry.

Process Improvement & Quality

• Utilize SPC, DOE, Lean Manufacturing, and Six Sigma methodologies to improve process capability.

• Develop and maintain process documentation, specifications, and control plans.

• Lead root cause investigations using structured problem-solving tools:

  • 8D
  • Fishbone Analysis
  • 5 Why
  • FMEA

• Support internal and external audits related to manufacturing processes.

• Analyze process data and drive yield, quality, and productivity improvements.

• Establish KPIs and process monitoring systems for drilling operations.

Equipment & Maintenance Support

• Collaborate with maintenance teams to maximize equipment uptime and performance.

• Support installation, qualification, and acceptance of new drilling and laser equipment.

• Develop preventive maintenance and calibration requirements.

• Participate in equipment capability assessments and technology evaluations.

Cross-Functional Collaboration

• Work closely with CAM, Lamination, Plating, Quality, and Production departments.

• Support design reviews and manufacturing feasibility assessments.

• Provide technical guidance and training to operators, technicians, and manufacturing personnel.

Required Qualifications

Education

• Bachelor's degree in:

  • Mechanical Engineering
  • Manufacturing Engineering
  • Materials Science
  • Industrial Engineering
  • Related technical discipline

Experience

• 3+ years of PCB manufacturing experience preferred, but not mandatory.

• Experience with mechanical drilling and/or laser drilling processes in PCB fabrication is a plus.

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