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Open nowPosted 49 days ago

Lead Engineer, Packaging Project

Allegro MicroSystems67 open roles

Where
Paranaque City, National Capital Region (Manila), Philippines
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Your applicationOpen nowLead Engineer, Packaging ProjectAllegro MicroSystems · Paranaque City, National Capital Region (Manila), Philippines

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The clock on this job

Early applications get read.

11.5% of postings close within 7 days. Measured by our own scanner across the market. Allegro MicroSystems postings stay open a median of 41 days.

Share of postings closed within
  1. 2.0%1 day
  2. 4.3%3 days
  3. 11.5%7 days
  4. 18.1%14 days
  5. 35.6%30 days
  6. 44.6%60 days
This job: posted 49 days ago

Allegro MicroSystems median: 41 days open

The posting

The Allegro team is united by a clear purpose—advancing technologies that make the world safer, more efficient, and more sustainable. With over 30 years of experience in semiconductor innovation, we bring that purpose to life across every part of the business—from breakthrough product development and customer success to how we show up for each other and the communities we serve.

The Opportunity

This role requires the ability to make critical decisions regarding package design, lead assembly process engineering efforts, and drive problem-solving and optimization. The Senior Project Engineer will ensure projects adhere to scope, schedule, budget, and quality requirements, collaborate effectively with cross-functional teams, proactively manage risks, and ensure all deliverables meet Allegro's internal procedures and stringent quality standards. This level also contributes to the management and updating of package design rules.

What You Will Do

  • Independently manage and execute assigned packaging projects, ensuring completion on time, within budget, and within scope.
  • Serve as a packaging and assembly expert, making informed decisions on package design and actively contributing to assembly process engineering activities, including problem identification and resolution.
  • Create and refine bonding diagrams, ensuring adherence to and contributing to the evolution of Allegro's design rules.
  • Lead bill of material selection, optimizing for performance, cost, and manufacturability.
  • Develop, execute, and oversee comprehensive qualification planning and execution.
  • Perform in-depth assembly data review and qualification data review, driving corrective actions and continuous improvement.
  • Proactively track critical tasks and milestones, identifying potential delays or issues and implementing corrective actions.
  • Identify, document, and escalate project risks and resource conflicts to the Technical Project Manager, proposing solutions.
  • Collaborate extensively with cross-functional teams, including design, product lines, manufacturing, and quality, to drive seamless project execution and achieve project goals.
  • Ensure all project deliverables adhere to Advanced Quality Planning (AQP) requirements and internal documentation procedures, maintaining thorough project records.
  • Lead or actively participate in problem-solving activities, such as Ishikawa (Fishbone) or 8D analyses, when project issues or quality deviations arise.
  • Demonstrate strong proficiency in utilizing quality tools such as DFMEA, PFMEA, Ishikawa, DRBFM, Design for Manufacturability, Design for Quality, and Design for Cost.
  • Contribute to the management and updating of Allegro's package design rules.
  • Maintain comprehensive project documentation, including detailed schedules, budget tracking, and technical specifications.
  • Interface with Business Units and product lines for project updates and strategic alignment on project progress and resource needs.
  • May mentor junior engineers, providing technical guidance and support.

What You Will Bring

  • Bachelor's degree (BS) in an engineering field such as Mechanical Engineering, Chemical Engineering, or Electrical Engineering.
  • Minimum of three (3) to five (5) years of experience in semiconductor packaging and assembly engineering, with a proven track record of technical project management and decision-making.
  • Demonstrated expertise in semiconductor packaging and assembly processes, with the ability to make design and process engineering decisions.
  • Strong understanding and practical application of project management principles, with an emphasis on technical leadership.
  • Proven proficiency in utilizing quality tools such as DFMEA, PFMEA, Ishikawa, DRBFM, Design for Manufacturability, Design for Quality, and Design for Cost.
  • Highly organized with exceptional attention to detail and strong problem-solving skills.
  • Excellent written and spoken English language fluency, with strong communication and interpersonal skills.
  • Proficiency in Microsoft Excel and Microsoft PowerPoint.

Why Allegro?

Join Allegro and become part of a team where your contributions truly matter.

We foster a culture of Real Innovation, empowering you to push boundaries, develop cutting-edge solutions, and drive continuous improvement. Your work will create a Real Impact by solving complex real-world challenges that fuel our success and shape the future of technology. You’ll experience Real Connection, collaborating with talented colleagues around the globe in an environment built on trust, respect, and a shared purpose. Join us—and help build what’s next.

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