The posting
ADVANCE YOUR CAREER. ADVANCE THE WORLD.
At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.
Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.
THE ROLE:
We are seeking a senior-level manufacturing technology expert to drive advanced SMT and board assembly process development for advanced computing platforms. This is a technology development role responsible for defining assembly strategies, influencing product design, and enabling manufacturability for high-complexity PCB assemblies—particularly large BGA packages with significant warpage and coplanarity challenges.
This role offers the opportunity to define manufacturing capability for future platforms, influence product architecture, and solve board-assembly problems that do not have textbook answers. Success is measured by enabling designs that others consider too complex to manufacture reliably.
THE PERSON:
You will work at the intersection of package engineering, PCB design, mechanical and thermal integration, reliability, and global manufacturing, setting standards and best practices deployed across multiple manufacturing partners worldwide.
What Success Looks Like
- Establishes robust, high-yield SMT assembly processes for thermally and mechanically demanding PCB assemblies
- Translates warpage, coplanarity, and thermal behavior into manufacturable design rules and process windows
- Develops scalable guidelines, BKMs, and training across internal teams and EMS partners
- Solves non-conventional assembly challenges that exceed standard SMT capability
KEY RESPONSIBILITIES:
Advanced SMT Process Development
- Lead end-to-end SMT process development, for Printing / stencil, Placement, Reflow, Post-reflow process
- Define robust process windows balancing yield, reliability, and scalability
- Drive structured experimentation (DOE) to resolve complex yield issues
- Develop and validate assembly flows for manufacturing readiness
Large BGA Assembly, Warpage and Coplanarity Mitigation
- Serve as technical owner for assembly of large, mechanically challenging BGA packages and complex board constructions.
- Develop measurement and correlation methodologies for warpage/coplanarity across room temperature, reflow, and post-assembly conditions.
- Translate empirical data into actionable controls: stencil strategy, placement approach, reflow profile optimization, and board support concepts.
- Define practical coplanarity and interface-gap limits based on real manufacturing capability.
Stencil, Paste Deposition, and Defect Reduction
- Define stencil design guidelines for mixed-technology assemblies (thickness selection, aperture optimization, via-in-pad approaches, paste volume control).
- Drive strategies to reduce defects including insufficient solder, head-in-pillow, bridging, and voiding.
- Collaborate with suppliers to evaluate solder paste materials, flux systems, and stencil fabrication technologies.
Placement Strategy and Equipment Capability
- Define placement process requirements for challenging components: placement force/speed, nozzle and vacuum strategy, and fixturing/support concepts.
- Develop fixture and board support concepts for large packages
- Work directly with equipment vendors and manufacturing partners to qualify placement capability and drive tool enhancements when required.
Reflow Technology and Thermal Profiling
- Drive reflow strategies for assemblies with high thermal mass and uneven heat distribution.
- Develop profiling methodologies to control thermal gradients across boards and complex component populations.
- Lead evaluation and deployment of advanced reflow technologies (e.g., vacuum and inert-atmosphere reflow) to improve solder joint integrity and void performance.
- Define requirements for custom or modified equipment when standard solutions are insufficient.
Thermal Mechanical Solution Robustness and Post-SMT Processes
- Define and qualify edge bonding and underfill strategies to improve mechanical shock, vibration, and board-level reliability.
- Develop manufacturable processes for mechanical and thermal hardware integration (heatsinks, clamping, thermal interface materials).
- Evaluate mechanical stress transfer to solder joints and ensure processes are repeatable and auditable.
BGA Rework and Repair Strategy
- Develop controlled rework methodologies for complex BGA assemblies, including safe removal/replacement processes.
- Ensure reworked assemblies meet full quality and reliability requirements through defined acceptance criteria and verification methods.
DFM Leadership and Assembly Guidelines
- Lead DFM reviews for advanced PCB designs: land patterns, via-in-pad structures, solder mask strategy, component keep-outs, and routing considerations.
- Provide clear, data-driven feedback to influence design decisions early in development.
- Author and maintain board-level assembly design guidelines for internal teams and external manufacturing partners.
Cross-Functional and Supplier Collaboration
- Act as a technical bridge across design engineering, reliability, mechanical/thermal, quality, and global manufacturing teams.
- Drive technical engagements with contract manufacturers, material suppliers, and equipment vendors.
- Drive root-cause analysis and corrective actions for complex yield and reliability issues using engineering rigor and data.
Assembly Technology Innovation
- Drive development of advanced solutions:
- Micro spring / spacer technologies
- Copper spacer block tolerancing
- Low-temperature solder (LTS) evaluation
- Vacuum reflow process integration
- Removable lid concepts for warpage mitigation
- Define and execute DOE frameworks for new technologies
PREFERRED EXPERIENCE:
- Extensive hands-on SMT process development experience for high-complexity PCB assemblies.
- Demonstrated ownership of large BGA assembly challenges, including warpage, coplanarity, thermal behavior during reflow, and post-assembly stability.
- Proven track record of developing processes that transition successfully from engineering builds to high-volume manufacturing.
- Experience working directly with global manufacturing partners and equipment vendors to qualify capability and drive improvements.
- Strong background in structured problem solving (DOE, statistics, root-cause analysis) for yield and reliability issues.
- Experience with advanced reflow capabilities (vacuum/inert atmosphere) and void reduction strategies.
- Experience developing board-level mechanical robustness processes (edge bond/underfill) for demanding environments.
- Experience defining and implementing rework strategies for complex assemblies while maintaining reliability requirements.
- Experience with large BGA (>70mm) and high warpage (>400–500 µm class)
- Experience or knowledge on Reliability Qualification (Board Level) for high-complexity PCB assemblies for temp cycling, random/sine vibration, mechanical shock and failure analysis.
Technical Expertise
- Deep knowledge of SMT processes: printing/stencil, placement, reflow, and post-reflow stabilization.
- Strong understanding of BGA solder joint formation, defect mechanisms, and reliability drivers.
- Practical experience with warpage measurement methods and thermal profiling approaches.
- Working familiarity with relevant industry standards (e.g., IPC and J-STD) and the ability to apply them pragmatically.
- Working knowledge of package and board warpage measurement using Shadow Morrie, DIC, inspection measurement system for X-ray, C-SAM, T-SAM etc
Leadership and Communication
- Ability to operate as a technical authority without direct people management and influence cross-functional decisions.
- Strong written and verbal communication skills, including authoring technical guidelines and presenting complex topics to diverse audiences.
- Comfortable challenging assumptions and driving alignment through data and engineering judgment.
Software/Tools Skills
- Statistical & DOE Tools: Minitab, JMP, or equivalent for Design of Experiments and statistical analysis.
- CAD Tools: Mentor Graphics, Cadence Allegro or Pentalogix for PCB DFM and layout review.
ACADEMIC CREDENTIALS:
- Bachelor’s or Master’s degree with experience in manufacture Engineering, Mechanical Engineering, Materials Science, or a related discipline.
LOCATION:
Singapore
#LI-CC6
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
THE ROLE:
We are seeking a senior-level manufacturing technology expert to drive advanced SMT and board assembly process development for advanced computing platforms. This is a technology development role responsible for defining assembly strategies, influencing product design, and enabling manufacturability for high-complexity PCB assemblies—particularly large BGA packages with significant warpage and coplanarity challenges.
This role offers the opportunity to define manufacturing capability for future platforms, influence product architecture, and solve board-assembly problems that do not have textbook answers. Success is measured by enabling designs that others consider too complex to manufacture reliably.
THE PERSON:
You will work at the intersection of package engineering, PCB design, mechanical and thermal integration, reliability, and global manufacturing, setting standards and best practices deployed across multiple manufacturing partners worldwide.
What Success Looks Like
- Establishes robust, high-yield SMT assembly processes for thermally and mechanically demanding PCB assemblies
- Translates warpage, coplanarity, and thermal behavior into manufacturable design rules and process windows
- Develops scalable guidelines, BKMs, and training across internal teams and EMS partners
- Solves non-conventional assembly challenges that exceed standard SMT capability
KEY RESPONSIBILITIES:
Advanced SMT Process Development
- Lead end-to-end SMT process development, for Printing / stencil, Placement, Reflow, Post-reflow process
- Define robust process windows balancing yield, reliability, and scalability
- Drive structured experimentation (DOE) to resolve complex yield issues
- Develop and validate assembly flows for manufacturing readiness
Large BGA Assembly, Warpage and Coplanarity Mitigation
- Serve as technical owner for assembly of large, mechanically challenging BGA packages and complex board constructions.
- Develop measurement and correlation methodologies for warpage/coplanarity across room temperature, reflow, and post-assembly conditions.
- Translate empirical data into actionable controls: stencil strategy, placement approach, reflow profile optimization, and board support concepts.
- Define practical coplanarity and interface-gap limits based on real manufacturing capability.
Stencil, Paste Deposition, and Defect Reduction
- Define stencil design guidelines for mixed-technology assemblies (thickness selection, aperture optimization, via-in-pad approaches, paste volume control).
- Drive strategies to reduce defects including insufficient solder, head-in-pillow, bridging, and voiding.
- Collaborate with suppliers to evaluate solder paste materials, flux systems, and stencil fabrication technologies.
Placement Strategy and Equipment Capability
- Define placement process requirements for challenging components: placement force/speed, nozzle and vacuum strategy, and fixturing/support concepts.
- Develop fixture and board support concepts for large packages
- Work directly with equipment vendors and manufacturing partners to qualify placement capability and drive tool enhancements when required.
Reflow Technology and Thermal Profiling
- Drive reflow strategies for assemblies with high thermal mass and uneven heat distribution.
- Develop profiling methodologies to control thermal gradients across boards and complex component populations.
- Lead evaluation and deployment of advanced reflow technologies (e.g., vacuum and inert-atmosphere reflow) to improve solder joint integrity and void performance.
- Define requirements for custom or modified equipment when standard solutions are insufficient.
Thermal Mechanical Solution Robustness and Post-SMT Processes
- Define and qualify edge bonding and underfill strategies to improve mechanical shock, vibration, and board-level reliability.
- Develop manufacturable processes for mechanical and thermal hardware integration (heatsinks, clamping, thermal interface materials).
- Evaluate mechanical stress transfer to solder joints and ensure processes are repeatable and auditable.
BGA Rework and Repair Strategy
- Develop controlled rework methodologies for complex BGA assemblies, including safe removal/replacement processes.
- Ensure reworked assemblies meet full quality and reliability requirements through defined acceptance criteria and verification methods.
DFM Leadership and Assembly Guidelines
- Lead DFM reviews for advanced PCB designs: land patterns, via-in-pad structures, solder mask strategy, component keep-outs, and routing considerations.
- Provide clear, data-driven feedback to influence design decisions early in development.
- Author and maintain board-level assembly design guidelines for internal teams and external manufacturing partners.
Cross-Functional and Supplier Collaboration
- Act as a technical bridge across design engineering, reliability, mechanical/thermal, quality, and global manufacturing teams.
- Drive technical engagements with contract manufacturers, material suppliers, and equipment vendors.
- Drive root-cause analysis and corrective actions for complex yield and reliability issues using engineering rigor and data.
Assembly Technology Innovation
- Drive development of advanced solutions:
- Micro spring / spacer technologies
- Copper spacer block tolerancing
- Low-temperature solder (LTS) evaluation
- Vacuum reflow process integration
- Removable lid concepts for warpage mitigation
- Define and execute DOE frameworks for new technologies
PREFERRED EXPERIENCE:
- Extensive hands-on SMT process development experience for high-complexity PCB assemblies.
- Demonstrated ownership of large BGA assembly challenges, including warpage, coplanarity, thermal behavior during reflow, and post-assembly stability.
- Proven track record of developing processes that transition successfully from engineering builds to high-volume manufacturing.
- Experience working directly with global manufacturing partners and equipment vendors to qualify capability and drive improvements.
- Strong background in structured problem solving (DOE, statistics, root-cause analysis) for yield and reliability issues.
- Experience with advanced reflow capabilities (vacuum/inert atmosphere) and void reduction strategies.
- Experience developing board-level mechanical robustness processes (edge bond/underfill) for demanding environments.
- Experience defining and implementing rework strategies for complex assemblies while maintaining reliability requirements.
- Experience with large BGA (>70mm) and high warpage (>400–500 µm class)
- Experience or knowledge on Reliability Qualification (Board Level) for high-complexity PCB assemblies for temp cycling, random/sine vibration, mechanical shock and failure analysis.
Technical Expertise
- Deep knowledge of SMT processes: printing/stencil, placement, reflow, and post-reflow stabilization.
- Strong understanding of BGA solder joint formation, defect mechanisms, and reliability drivers.
- Practical experience with warpage measurement methods and thermal profiling approaches.
- Working familiarity with relevant industry standards (e.g., IPC and J-STD) and the ability to apply them pragmatically.
- Working knowledge of package and board warpage measurement using Shadow Morrie, DIC, inspection measurement system for X-ray, C-SAM, T-SAM etc
Leadership and Communication
- Ability to operate as a technical authority without direct people management and influence cross-functional decisions.
- Strong written and verbal communication skills, including authoring technical guidelines and presenting complex topics to diverse audiences.
- Comfortable challenging assumptions and driving alignment through data and engineering judgment.
Software/Tools Skills
- Statistical & DOE Tools: Minitab, JMP, or equivalent for Design of Experiments and statistical analysis.
- CAD Tools: Mentor Graphics, Cadence Allegro or Pentalogix for PCB DFM and layout review.
ACADEMIC CREDENTIALS:
- Bachelor’s or Master’s degree with experience in manufacture Engineering, Mechanical Engineering, Materials Science, or a related discipline.
LOCATION:
Singapore
#LI-CC6
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
