The posting
ADVANCE YOUR CAREER. ADVANCE THE WORLD.
At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.
Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.
THE ROLE:
AMD is seeking an experienced Technical Program Manager to lead the delivery of thermal and mechanical development programs from requirements and concept through engineering builds, qualification, manufacturing release and production ramp. The role connects package development with board, cooling and chassis integration, ensuring that engineering and supplier deliverables support the overall product schedule.
The position involves supplier-site and engineering-build support, regional travel as program needs requires, and collaboration with global teams. You will have the opportunity to connect advanced engineering development with manufacturable products and influence delivery across AMD and its external partners.
THE ROLE:
You will work closely with thermal and mechanical engineers, silicon and package engineering, hardware and board teams, reliability, manufacturing, quality, supply chain and external partners. As an MTS individual contributor, you will establish integrated plans, resolve dependencies and drive decisions across global teams. Engineering leaders retain responsibility for technical design approval; you own program coordination, delivery visibility and escalation.
The role also provides program leadership for advanced SMT and board-assembly technology on complex, high-performance computing platforms, including large BGA packages and mechanically and thermally demanding PCB assemblies.
KEY RESPONSIBILITIES:
- Define program scope, deliverables, acceptance criteria, milestones and ownership. Build integrated schedules covering design, simulation, tooling, materials, prototypes, validation, qualification and release; identify critical paths and resource constraints.
- Coordinate package, board and chassis interfaces, including power and thermal requirements, mechanical envelopes, mounting constraints and assembly assumptions. Assess the downstream consequences of changes with silicon, hardware and engineering owners.
- Lead execution reviews with cooling suppliers, contract manufacturers, original design manufacturers and outsourced semiconductor assembly and test partners. Track specifications, sample commitments, tooling, capacity, quality and delivery recovery actions.
- Plan engineering and validation builds with clear material, drawing, fixture, test and staffing readiness. Drive issue closure and evidence-based entry and exit decisions for each development milestone.
- Coordinate design for manufacturing and assembly reviews. Align process development, assembly sequence, handling, inspection, rework and serviceability requirements with design intent and manufacturing capability.
- Coordinate end-to-end SMT process-development deliverables covering solder-paste printing and stencil optimization, component placement, reflow, inspection and post-reflow processes. Ensure process windows address yield, reliability, manufacturability, scalability, cost and equipment capability.
- Drive readiness for large BGA and other mechanically challenging assemblies by aligning package and board warpage, coplanarity, solder-joint formation, thermal gradients, fixturing and board-support requirements across engineering and manufacturing owners.
- Plan structured design-of-experiments and statistical-analysis activities for new materials, equipment, process technologies and assembly architectures; ensure results are converted into released assembly flows, best-known methods, process controls and acceptance criteria.
- Coordinate defect-reduction and process-improvement efforts for insufficient solder, head-in-pillow, bridging, voiding and related solder-joint issues, including evaluation of solder paste, flux, stencil fabrication, placement and reflow alternatives.
- Lead supplier and equipment-partner readiness for advanced placement and reflow capabilities, including vacuum or inert-atmosphere reflow, custom fixtures, modified equipment and enhanced board support when standard solutions are insufficient.
- Coordinate qualification of edge-bond, underfill, heatsink, clamp, socket, thermal-interface-material and other post-SMT integration processes, including controls for mechanical stress transferred into solder joints and board structures.
- Ensure controlled BGA rework and repair plans define removal, site preparation, replacement, acceptance criteria and verification methods while maintaining applicable quality and reliability requirements.
- Capture scalable assembly standards, design guidelines, manufacturing specifications, training content and audit-ready process documentation for deployment across manufacturing partners and sites.
- Manage program risks, issues, dependencies, engineering changes and deviations. Present technically informed recovery options, including schedule, cost, qualification and supply implications, to the appropriate decision-makers.
- Maintain resource commitments and forecasts for prototype, tooling, test and development expenditure. Partner with procurement and operations on supplier work scope, lead times and commercial dependencies.
- Provide concise status and decision requests to engineering and business leaders. Drive release documentation, manufacturing handover, ramp issue closure and lessons learned across subsequent programs.
PREFERRED EXPERIENCE:
- Relevant experience in hardware development, electronic packaging, thermal or mechanical engineering, manufacturing NPI, or technical program management, including leading complex cross-functional technical programs.
- Demonstrated delivery through engineering development, validation or qualification, and manufacturing release or ramp. Experience resolving a significant technical, supplier or production issue with measurable outcomes.
- Substantial experience in thermal or mechanical hardware, electronic packaging, or closely related electronics NPI, with demonstrated management of interfaces between design, assembly and manufacturing. Depth in one domain and working knowledge across the connected domains are expected.
- Demonstrated experience leading or coordinating advanced SMT process development for high-complexity PCB assemblies, with working knowledge of printing and stencil processes, placement, reflow, post-reflow stabilization, inspection and defect-reduction methods.
- Experience using design of experiments, statistical analysis, structured root-cause analysis and corrective-action methods to resolve complex process, yield or reliability issues.
- Experience translating assembly processes from engineering development and prototype builds through qualification, production ramp and, where applicable, high-volume manufacturing.
- Direct experience managing deliverables with cooling or mechanical component suppliers, contract manufacturers, original design manufacturers, or semiconductor assembly and test providers.
- Strong professional English, clear technical writing and executive communication. Ability to influence without direct authority, negotiate commitments and work effectively across countries and time zones.
- Thermal engineering: Working understanding of the package-to-system heat path, thermal resistance and temperature limits, power and boundary conditions, thermal interface materials, contact quality and bond-line thickness. Ability to discuss cooling performance, design margin and test evidence with specialists.
- Mechanical integration: Ability to interpret engineering drawings, geometric tolerances and stack-ups; understand the program implications of flatness, warpage, retention and mounting loads, contact pressure, thermal expansion, shock and vibration, and board or package stress.
- Packaging and assembly: Working knowledge of relevant package structures, lids and stiffeners, TIM application or attach processes, board assembly and reflow dependencies, tooling and fixtures, material traceability, inspection and rework. Coordinate detailed process decisions with the responsible engineers.
- Advanced SMT and large BGA assembly: Working knowledge of solder-paste deposition, stencil thickness and aperture optimization, placement parameters, reflow-profile development, thermal-gradient control, inspection and post-reflow stabilization. Ability to recognize process limits that require new materials, equipment, fixtures or assembly architectures.
- Warpage, coplanarity and solder-joint integrity: Ability to interpret package and board warpage and coplanarity data at room temperature, through reflow and after assembly; connect the results to paste volume, placement strategy, board support, fixturing, interface gaps and solder-joint reliability.
- Board-level robustness and rework: Working knowledge of edge bond, underfill, heatsink and clamp integration, controlled BGA rework, site preparation, replacement, inspection and verification requirements.
- Validation and reliability: Ability to review test plans, model-to-test correlation, qualification status and failure-analysis conclusions. Coordinate thermal and mechanical testing, reliability evidence and closure of nonconformances against agreed release criteria.
- Manufacturing readiness: Understand design for manufacturing and assembly, process capability, yield, quality trends, capacity and cycle-time constraints. Use structured root cause and corrective action methods with supplier quality and manufacturing teams.
- The role requires the ability to interpret CAD, computational fluid dynamics and finite element analysis outputs and ask technically sound questions. Detailed model creation and specialist design approval remain with the engineering owners.
- Apply hardware phase-gate planning, schedule baselines, critical-path analysis and recovery scenarios. Maintain traceability between product requirements, engineering deliverables and release criteria.
- Maintain risk, assumption, issue and dependency registers, a responsibility matrix, action and decision logs, and concise dashboards showing readiness and decisions required.
- Turn design, build and supplier reviews into decisions, owners, dates and verified completion. Negotiate staffing, laboratory and factory access; track approved expenditure.
- Control bill of materials, drawings, specifications, engineering changes and deviations across concurrent workstreams. Use data to identify risks and escalate actionable alternatives.
- Ensure PCB design-for-manufacturing reviews address land patterns, via-in-pad structures, solder-mask strategy, component keep-outs, routing constraints and assembly access early enough to influence product and board design decisions.
- Establish traceable assembly process windows, best-known methods, supplier requirements, qualification evidence, manufacturing controls and training materials across global manufacturing partners.
- Experience spanning package, board and chassis development; high-performance computing, GPU or accelerator, server, networking or other demanding electronics programs.
- Experience with air or liquid cooling products, cold plates, heat sinks, heat pipes or vapor chambers; advanced packaging, package warpage, thermal interfaces or high-power assembly challenges.
- Regional supplier and factory execution experience in Malaysia, Singapore or the broader Asia-Pacific manufacturing ecosystem.
- Master’s degree, PMP or equivalent program-management training; practical experience with FMEA, 8D, design of experiments, statistical process control or applicable electronics qualification frameworks.
- Power BI, Tableau, SQL or Python for reporting and analysis; familiarity with enterprise resource planning or manufacturing execution systems.
- Experience with large BGA packages greater than 70 mm, including high-warpage applications in the approximately 400-500 micrometer class.
- Working knowledge of IPC and J-STD requirements and practical application of industry standards to advanced assemblies.
- Experience with board-level reliability qualification, including temperature cycling, random and sine vibration, mechanical shock and failure analysis.
- Experience with advanced assembly solutions such as micro-spring or spacer technologies, copper spacer-block tolerancing, low-temperature solder, vacuum reflow integration or removable-lid concepts for warpage mitigation.
ACADEMIC CREDENTIALS:
- Bachelor’s degree in Mechanical Engineering, Materials Science, Manufacturing Engineering, Electrical or Electronics Engineering, or a related technical discipline; equivalent substantial and directly relevant industry experience may be considered.
LOCATION:
Singapore
#LI-CC6
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
THE ROLE:
AMD is seeking an experienced Technical Program Manager to lead the delivery of thermal and mechanical development programs from requirements and concept through engineering builds, qualification, manufacturing release and production ramp. The role connects package development with board, cooling and chassis integration, ensuring that engineering and supplier deliverables support the overall product schedule.
The position involves supplier-site and engineering-build support, regional travel as program needs requires, and collaboration with global teams. You will have the opportunity to connect advanced engineering development with manufacturable products and influence delivery across AMD and its external partners.
THE ROLE:
You will work closely with thermal and mechanical engineers, silicon and package engineering, hardware and board teams, reliability, manufacturing, quality, supply chain and external partners. As an MTS individual contributor, you will establish integrated plans, resolve dependencies and drive decisions across global teams. Engineering leaders retain responsibility for technical design approval; you own program coordination, delivery visibility and escalation.
The role also provides program leadership for advanced SMT and board-assembly technology on complex, high-performance computing platforms, including large BGA packages and mechanically and thermally demanding PCB assemblies.
KEY RESPONSIBILITIES:
- Define program scope, deliverables, acceptance criteria, milestones and ownership. Build integrated schedules covering design, simulation, tooling, materials, prototypes, validation, qualification and release; identify critical paths and resource constraints.
- Coordinate package, board and chassis interfaces, including power and thermal requirements, mechanical envelopes, mounting constraints and assembly assumptions. Assess the downstream consequences of changes with silicon, hardware and engineering owners.
- Lead execution reviews with cooling suppliers, contract manufacturers, original design manufacturers and outsourced semiconductor assembly and test partners. Track specifications, sample commitments, tooling, capacity, quality and delivery recovery actions.
- Plan engineering and validation builds with clear material, drawing, fixture, test and staffing readiness. Drive issue closure and evidence-based entry and exit decisions for each development milestone.
- Coordinate design for manufacturing and assembly reviews. Align process development, assembly sequence, handling, inspection, rework and serviceability requirements with design intent and manufacturing capability.
- Coordinate end-to-end SMT process-development deliverables covering solder-paste printing and stencil optimization, component placement, reflow, inspection and post-reflow processes. Ensure process windows address yield, reliability, manufacturability, scalability, cost and equipment capability.
- Drive readiness for large BGA and other mechanically challenging assemblies by aligning package and board warpage, coplanarity, solder-joint formation, thermal gradients, fixturing and board-support requirements across engineering and manufacturing owners.
- Plan structured design-of-experiments and statistical-analysis activities for new materials, equipment, process technologies and assembly architectures; ensure results are converted into released assembly flows, best-known methods, process controls and acceptance criteria.
- Coordinate defect-reduction and process-improvement efforts for insufficient solder, head-in-pillow, bridging, voiding and related solder-joint issues, including evaluation of solder paste, flux, stencil fabrication, placement and reflow alternatives.
- Lead supplier and equipment-partner readiness for advanced placement and reflow capabilities, including vacuum or inert-atmosphere reflow, custom fixtures, modified equipment and enhanced board support when standard solutions are insufficient.
- Coordinate qualification of edge-bond, underfill, heatsink, clamp, socket, thermal-interface-material and other post-SMT integration processes, including controls for mechanical stress transferred into solder joints and board structures.
- Ensure controlled BGA rework and repair plans define removal, site preparation, replacement, acceptance criteria and verification methods while maintaining applicable quality and reliability requirements.
- Capture scalable assembly standards, design guidelines, manufacturing specifications, training content and audit-ready process documentation for deployment across manufacturing partners and sites.
- Manage program risks, issues, dependencies, engineering changes and deviations. Present technically informed recovery options, including schedule, cost, qualification and supply implications, to the appropriate decision-makers.
- Maintain resource commitments and forecasts for prototype, tooling, test and development expenditure. Partner with procurement and operations on supplier work scope, lead times and commercial dependencies.
- Provide concise status and decision requests to engineering and business leaders. Drive release documentation, manufacturing handover, ramp issue closure and lessons learned across subsequent programs.
PREFERRED EXPERIENCE:
- Relevant experience in hardware development, electronic packaging, thermal or mechanical engineering, manufacturing NPI, or technical program management, including leading complex cross-functional technical programs.
- Demonstrated delivery through engineering development, validation or qualification, and manufacturing release or ramp. Experience resolving a significant technical, supplier or production issue with measurable outcomes.
- Substantial experience in thermal or mechanical hardware, electronic packaging, or closely related electronics NPI, with demonstrated management of interfaces between design, assembly and manufacturing. Depth in one domain and working knowledge across the connected domains are expected.
- Demonstrated experience leading or coordinating advanced SMT process development for high-complexity PCB assemblies, with working knowledge of printing and stencil processes, placement, reflow, post-reflow stabilization, inspection and defect-reduction methods.
- Experience using design of experiments, statistical analysis, structured root-cause analysis and corrective-action methods to resolve complex process, yield or reliability issues.
- Experience translating assembly processes from engineering development and prototype builds through qualification, production ramp and, where applicable, high-volume manufacturing.
- Direct experience managing deliverables with cooling or mechanical component suppliers, contract manufacturers, original design manufacturers, or semiconductor assembly and test providers.
- Strong professional English, clear technical writing and executive communication. Ability to influence without direct authority, negotiate commitments and work effectively across countries and time zones.
- Thermal engineering: Working understanding of the package-to-system heat path, thermal resistance and temperature limits, power and boundary conditions, thermal interface materials, contact quality and bond-line thickness. Ability to discuss cooling performance, design margin and test evidence with specialists.
- Mechanical integration: Ability to interpret engineering drawings, geometric tolerances and stack-ups; understand the program implications of flatness, warpage, retention and mounting loads, contact pressure, thermal expansion, shock and vibration, and board or package stress.
- Packaging and assembly: Working knowledge of relevant package structures, lids and stiffeners, TIM application or attach processes, board assembly and reflow dependencies, tooling and fixtures, material traceability, inspection and rework. Coordinate detailed process decisions with the responsible engineers.
- Advanced SMT and large BGA assembly: Working knowledge of solder-paste deposition, stencil thickness and aperture optimization, placement parameters, reflow-profile development, thermal-gradient control, inspection and post-reflow stabilization. Ability to recognize process limits that require new materials, equipment, fixtures or assembly architectures.
- Warpage, coplanarity and solder-joint integrity: Ability to interpret package and board warpage and coplanarity data at room temperature, through reflow and after assembly; connect the results to paste volume, placement strategy, board support, fixturing, interface gaps and solder-joint reliability.
- Board-level robustness and rework: Working knowledge of edge bond, underfill, heatsink and clamp integration, controlled BGA rework, site preparation, replacement, inspection and verification requirements.
- Validation and reliability: Ability to review test plans, model-to-test correlation, qualification status and failure-analysis conclusions. Coordinate thermal and mechanical testing, reliability evidence and closure of nonconformances against agreed release criteria.
- Manufacturing readiness: Understand design for manufacturing and assembly, process capability, yield, quality trends, capacity and cycle-time constraints. Use structured root cause and corrective action methods with supplier quality and manufacturing teams.
- The role requires the ability to interpret CAD, computational fluid dynamics and finite element analysis outputs and ask technically sound questions. Detailed model creation and specialist design approval remain with the engineering owners.
- Apply hardware phase-gate planning, schedule baselines, critical-path analysis and recovery scenarios. Maintain traceability between product requirements, engineering deliverables and release criteria.
- Maintain risk, assumption, issue and dependency registers, a responsibility matrix, action and decision logs, and concise dashboards showing readiness and decisions required.
- Turn design, build and supplier reviews into decisions, owners, dates and verified completion. Negotiate staffing, laboratory and factory access; track approved expenditure.
- Control bill of materials, drawings, specifications, engineering changes and deviations across concurrent workstreams. Use data to identify risks and escalate actionable alternatives.
- Ensure PCB design-for-manufacturing reviews address land patterns, via-in-pad structures, solder-mask strategy, component keep-outs, routing constraints and assembly access early enough to influence product and board design decisions.
- Establish traceable assembly process windows, best-known methods, supplier requirements, qualification evidence, manufacturing controls and training materials across global manufacturing partners.
- Experience spanning package, board and chassis development; high-performance computing, GPU or accelerator, server, networking or other demanding electronics programs.
- Experience with air or liquid cooling products, cold plates, heat sinks, heat pipes or vapor chambers; advanced packaging, package warpage, thermal interfaces or high-power assembly challenges.
- Regional supplier and factory execution experience in Malaysia, Singapore or the broader Asia-Pacific manufacturing ecosystem.
- Master’s degree, PMP or equivalent program-management training; practical experience with FMEA, 8D, design of experiments, statistical process control or applicable electronics qualification frameworks.
- Power BI, Tableau, SQL or Python for reporting and analysis; familiarity with enterprise resource planning or manufacturing execution systems.
- Experience with large BGA packages greater than 70 mm, including high-warpage applications in the approximately 400-500 micrometer class.
- Working knowledge of IPC and J-STD requirements and practical application of industry standards to advanced assemblies.
- Experience with board-level reliability qualification, including temperature cycling, random and sine vibration, mechanical shock and failure analysis.
- Experience with advanced assembly solutions such as micro-spring or spacer technologies, copper spacer-block tolerancing, low-temperature solder, vacuum reflow integration or removable-lid concepts for warpage mitigation.
ACADEMIC CREDENTIALS:
- Bachelor’s degree in Mechanical Engineering, Materials Science, Manufacturing Engineering, Electrical or Electronics Engineering, or a related technical discipline; equivalent substantial and directly relevant industry experience may be considered.
LOCATION:
Singapore
#LI-CC6
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
