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Open nowPosted 13 hours ago

Thermal Mechanical Engineer (Datacenter Platform)

AMD1,273 open roles

Where
Taipei, Taiwan
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Your applicationOpen nowThermal Mechanical Engineer (Datacenter Platform)AMD · Taipei, Taiwan

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The clock on this job

Early applications get read.

12.8% of postings close within 7 days. Measured by our own scanner across the market. AMD postings stay open a median of 43 days.

Share of postings closed within
  1. 2.2%1 day
  2. 4.5%3 days
  3. 12.8%7 days
  4. 20.6%14 days
  5. 35.6%30 days
  6. 58.4%60 days
This job: posted 13 hours ago

AMD median: 43 days open

The posting

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.

THERMAL MECHANICAL ENGINEER

THE ROLE:

As a Thermal/Mechanical Engineer in the ODM Enablement, Data Center Platform Engineering (DPEG), you will be responsible to work with ODM/OEM/Customer for the thermal Mechanical System readiness, development and validation for the AMD Data Center products in this expanding and strategic market. To accomplish this, you will need to interact with other key engineering teams such as silicon design, Platform development, board designer, validation, and manufacturing within AMD.

THE PERSON:

  • Team player, and self-starter, who possesses critical problem solving and troubleshooting skills.
  • Excellent communication skills, planning skills, and technical expertise.
  • Market savvy and comfortable in a fast-paced, multi-tasking environment.

KEY RESPONSIBILITIES:

Thermal Mechanical Engineer will be responsible to work with ODM/OEM/Customer for the end-to-end development, readiness and delivery of thermal and/or mechanical solutions for Data Center Server/Rack level with associated platforms. The successful candidate will have a thermal and mechanical development background with system level experience in Data Center. They will integrate and deploy into a customer global development team in delivering commercially viable products to the marketplace in a timely manner.

Some of the key responsibilities will include

  • Partner with ODM/OEM/Customer on Thermal design of thermal-mechanical hardware readiness and transfer to customer solution and system design so support timely launch
  • Contribute to the overall product cycle readiness towards supporting ODM/customer from conceptualization through mass production
  • Work in a dynamic and fast-paced product development environment and transfer the working solution for ODM/customer implementation.
  • Enable ODM/Customer and execute test plans for heat sinks, cold plates, and server-level cooling solutions.
  • Perform air / liquid flow and pressure drop measurements, temperature mapping, and thermal stress tests.
  • Drive process improvements together with ODM/Customer while executing fast time-to-market on products launch.
  • Analyze test results to identify thermal bottlenecks and propose design optimizations for customer implementation and improvement.
  • Generate detailed reports and present findings together with ODM/customer solutions.
  • Expected to have leadership skills in driving complex issues/problems and provide insight into not only designs but debug of complex system level problems.

REQUIREMENTS:

The selected candidate will use his/her proven technical skills to ensure the engineering team continuously innovates, uses ‘best practices’, and adds value for its customers. Key qualifications required include:

  • Strong background in heat transfer and fluid dynamics with emphasis on electronics thermal management.
  • Datacenter server and rack level thermal test experience is preferred
  • Experience with validation of liquid cooled systems including component and system level test.
  • Understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan.
  • CFD - Experience with CFD for liquid cooled systems with Icepak , Flotherm etc is desired.
  • CAD - Experience with SolidWorks and/or Creo is required. Ability to implement liquid cooling designs in Creo or SolidWorks for CFD analysis is a plus.
  • Lab Skills - Experience with Design of Experiments, instrumentation, data acquisition and data analysis is required.
  • Ability to write scripts in programming languages (i.e. Python, LabView etc.) for data analysis & tool development
  • Excellent verbal and written communication skills.

ACADEMIC CREDENTIALS:

Bachelors degree in Mechanical Engineering, Master's preferred

#LI-VJ1

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

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