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Open nowPosted yesterday

Hardware Developer Engineer Intern (Mechanical) 2027 - San Jose, CA

IBM2,479 open roles

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San Jose, US
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Your applicationOpen nowHardware Developer Engineer Intern (Mechanical) 2027 - San Jose, CAIBM · San Jose, US
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The clock on this job

Early applications get read.

10.5% of postings close within 7 days. Measured by our own scanner across the market. IBM postings stay open a median of 9 days.

Share of postings closed within
  1. 2.1%1 day
  2. 4.3%3 days
  3. 10.5%7 days
  4. 15.9%14 days
  5. 34.1%30 days
This job: posted yesterday

IBM median: 9 days open

The posting

At IBM, work is more than a job it's a calling: To build. To design. To code. To consult. To think along with clients and sell. To make markets. To invent. To collaborate. Not just to do something better, but to attempt things you've never thought possible. Are you ready to lead in this new era of technology and solve some of the world's most challenging problems? If so, lets talk.

As a Mechanical Engineer at IBM, you will help design and build the hardware platforms that power the AI era, advanced computing, and the quantum revolution. You’ll work alongside a multidisciplinary team developing the mechanical systems, structures, and technologies that enable IBM’s industry leading infrastructure including IBM zSystems, IBM Power Systems, IBM Storage, and IBM Quantum.

Our Mechanical Engineers transform ideas into robust, manufacturable, high‑performance hardware. You’ll use your creativity, analytical skills, and engineering judgment to bring next‑generation products from concept through validation and into customer environments. Typical responsibilities include:

* Mechanical design and development of components, assemblies, and system‑level structures

* Thermal design, analysis, and testing, including heat transfer modeling, airflow optimization, and cooling solutions

* Structural and vibration analysis, materials selection, and reliability engineering

* Finite element modeling (FEM/FEA) for mechanical, thermal, or multiphysics simulations

* Microelectronics and system‑level packaging, including integration of processors, memory, power delivery, and high‑density interconnects

* Technology integration across electrical, thermal, mechanical, and manufacturing domains

* System and component characterization, test planning, and validation

* Manufacturability and assembly optimization, including tolerance analysis and DFMA principles

* Cross‑functional collaboration with electrical, firmware, and product engineering teams

* Field and customer engineering support, including root cause analysis of mechanical or environmental issues

* Product quality, reliability, and specification development

You will contribute to every stage of the hardware lifecycle concept development, modeling, prototype evaluation, environmental testing, reliability assessment, and product release.

* Pursuing a Bachelor's Degree in: Mechanical Engineering or related majors.

* Prior (project or internship) experience in computer hardware or testing.

* Strong verbal and written communication skills.

* Passion for technology and engineering.

* Growth minded, trusted, team focused, courageous, resourceful, and outcome focused.

Preferred candidates with a Master’s Degree and/or at least three months of computer or electrical engineering experience in cable assemblies, harnesses, and interconnectivity are preferred.

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