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Packaging Module Equipment Development Engineer

Intel691 open roles

Where
US, Arizona, Phoenix
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Your applicationOpen nowPackaging Module Equipment Development EngineerIntel · US, Arizona, Phoenix

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The clock on this job

Early applications get read.

12.3% of postings close within 7 days. Measured by our own scanner across the market. Intel postings stay open a median of 24 days.

Share of postings closed within
  1. 2.1%1 day
  2. 4.5%3 days
  3. 12.3%7 days
  4. 19.7%14 days
  5. 35.6%30 days
  6. 58.0%60 days
This job: posted today

Intel median: 24 days open

The posting

Job Details:

Job Description:

At Intel, we create world-changing technology that improves the life of every person on the planet. This position is part of Intel's Advanced Packaging Technology Manufacturing (APTM) organization, which is dedicated to advancing and scaling innovative semiconductor packaging solutions. APTM's mission is to deliver state-of-the-art technologies that empower mobile, edge, and high-performance computing applications, while supporting Intel's broader goals of technological leadership and global customer success.

We are seeking a Senior Packaging Module Development Engineer to join our team in Chandler, Arizona. In this role, you will play a critical part in developing and optimizing the semiconductor packaging processes and equipment that drive Intel's next-generation roadmap. You will develop advanced assembly processes, design rigorous reliability testing simulations, and drive standardized manufacturing configurations across global Intel factories. This role requires regular onsite presence to collaborate hands-on with cutting-edge equipment, materials, and development tools in our state-of-the-art labs.

Key Responsibilities:

  • Process & Equipment Qualification: Develop, optimize, and qualify advanced packaging assembly processes, materials, and hardware configurations to meet yield, reliability, and cost requirements.
  • Equipment Integration: Manage first-time process integration and equipment selection, with a focus on dispense, mold, and/or cure technologies.
  • Reliability Simulation & Testing: Develop and maintain systems to evaluate silicon and packaging technologies under simulated field-use conditions, such as heat, humidity, temperature cycling, and dynamic forces.
  • Statistical Process Control: Lead efforts to design experiments (DOE), apply statistical methods (SPC), and analyze manufacturing data to define process windows and continuously optimize productivity.
  • Supplier & Vendor Management: Establish raw material and tooling specifications, and partner with contract assemblers, material vendors, procurement, and supplier quality teams to ensure vendor performance.
  • Data-Driven Problem Solving: Create new techniques, quality screens, and acceleration methods to ensure the early identification of quality and reliability risks based on failure mechanisms.
  • Factory Standardization: Drive global standardization of product qualifications, manufacturing quality systems, equipment configurations, and process flows across multiple Intel manufacturing sites.
  • Technical Documentation: Author detailed technical reports, process specifications, qualification logs, and technical white papers to support technology transfers.

As a Successful Candidate, You Will Bring:

  • Structured Technical Leadership: Strong leadership skills to guide cross-functional teams, influence design partners, and manage complex, time-sensitive technical projects.
  • Strong Strategic Influencing: Exceptional communication and interpersonal skills to consult on packaging improvements and collaborate across diverse matrixed organizations.
  • Analytical Problem Solving: Deep analytical mindset with a passion for diagnosing complex hardware and process-related challenges.
  • Action-Oriented Decision Making: Driven self-starter focused on achieving results, with the agility to adapt to new methods, tools, and fields of study.

Apply today to join Intel Arizona's Advanced Packaging team. Take ownership of cutting-edge manufacturing processes, partner with world-class engineers, and build a rewarding technical career.

Qualifications:

This is an entry level position and will be compensated accordingly. You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience.

Minimum Qualifications:

An applicant must meet one of the following educational and experience criteria:

  • A Bachelor’s degree in Mechanical, Electrical, Material Science or Chemical Engineering, or a related STEM field with 4+ years of relevant semiconductor industry experience.
  • OR a Master’s degree in a matching STEM discipline with 3+ years of relevant semiconductor industry experience.
  • OR a PhD in a matching STEM discipline with 6+ months of relevant semiconductor industry experience.
  • Required Experience Parameters:Utilizing Statistical Process Control (SPC) or Design of Experiments (DOE) principles within a high-tech manufacturing environment. Managing technical change control, equipment sustaining, or quality data systems. Structured problem solving, development of sound hypothesis and data-driven validation plans.

Preferred Qualifications:

  • 2+ years of experience:Hands-on semiconductor packaging process development or equipment engineering experience. Managing first-time process integration, tooling selection, or equipment qualifications—specifically with dispense, mold, or cure hardware. Managing complex, time-critical technical projects from development through manufacturing transfer.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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