Skip to content
CV Rocket
Get started
How it worksThe enginePricingBlogContactSign in

Open nowFirst seen 7 hours ago

Silicon Packaging Engineer

Meta1,234 open roles

Where
Sunnyvale, CA; Austin, TX
Get the CV for this job

From $25 per CV, paid once. No subscription.

Your applicationOpen nowSilicon Packaging EngineerMeta · Sunnyvale, CA; Austin, TX

  1. YouYes, apply to this one.

  2. CV RocketCV written for this posting.

  3. 25 readersRecruiter, hiring manager, skeptic. Round after round.

  4. CV RocketApplied on Meta's own form.

The reply lands in your private mailbox

3×more interviews than doing it yourself with ChatGPT.

The clock on this job

Early applications get read.

12.3% of postings close within 7 days. Measured by our own scanner across the market. Meta postings stay open a median of 35 days.

Share of postings closed within
  1. 2.1%1 day
  2. 4.5%3 days
  3. 12.3%7 days
  4. 19.7%14 days
  5. 35.6%30 days
  6. 58.0%60 days
This job: first seen 7 hours ago

Meta median: 35 days open

The posting

Meta is looking for an experienced Silicon Packaging Engineer for its Ecosystem and Technical Operation team. The ideal candidate will be able to prioritize competing workstreams across a cross-functional engineering environment based on impact, deadlines, and stakeholder needs. They will have experience with hardware development and integration of machine learning clusters, both server and fabric. They will be very familiar with AI/HPC hardware development, and will be data-driven and focused on the impact they can create as part of a engineering team.

The Meta Infrastructure team designs, builds, brings-up, tests and integrates hardware systems that power Meta’s platforms, deployed in data centers worldwide, from silicon to sheet metal. Designs are published through the Open Compute Project Foundation. This is an opportunity to join our team and help us build some of the world’s most open and efficient machine learning platforms.

We are building a competency in packaging design and technology to support the development of custom silicons for Infrastructure hardware as well as to develop packaging solutions that are optimal for our AI/ML products and system level performance.

Responsibilities

  • Perform package design for AI/ML and networking applications custom Si with single-chip/multi-chip and SiP/module packaging, design feasibility studies and analyses to ensure good manufacturing at ODM
  • Lead development of next-generation advanced packaging technologies from concept to product, including test vehicle definition and building with ecosystem partners
  • Work with internal Si, architecture and system teams, and externally with engaged partners, ODM, design houses and OSAT companies
  • Perform design analysis and what-if scenarios for novel packaging schemes such as 2.5D/3D and heterogeneous integration to improve package form factor for next-generation versions of current products
  • Influence ASIC vendors, foundry, ODM and OSAT partners' roadmaps and align with Meta ASIC roadmaps for the development of advanced packaging technologies (SMT, solder ball attach, and other assembly process)
  • Participate early in Si/package/PCB/system co-design and ODM SMT manufacturing work in product development design reviews, providing feedback on manufacturability and helping incorporate the latest technology advancements and design rules
  • Create, conduct and analyze Design of Experiments (DOE) for development and sustaining activities
  • Work cross-functionally with design, NPI, quality and reliability, and manufacturing teams, and support new technology integration into products
  • Support selection and qualification of external partners (ODM, OEM, OSAT)
  • Collaborate with internal and external stakeholders to ensure seamless integration of packaging technology into product development cycles
  • Stay abreast of the latest advancements in advanced packaging technologies and market trends
  • Identify and evaluate emerging technologies with potential for future applications
  • Ability to travel internationally, typically once per quarter

Minimum Qualifications

  • Bachelor's degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience
  • Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field, or equivalent practical experience
  • 8+ years of experience in semiconductor packaging with direct ownership of advanced packaging development and assembly process and manufacturing
  • In-depth knowledge of flip chip, 2.5D and 3D packaging technologies
  • Experience taking products from concept to production, including development of manufacturing specifications, vendor qualifications, and improvement of manufacturing efficiencies and costs
  • Experience communicating technical packaging decisions in writing and in reviews to cross-functional engineering and manufacturing stakeholders
  • Experience working effectively with cross-functional teams
  • Willingness to travel internationally, typically once per quarter

Preferred Qualifications

  • Experience working with ODM, assembly packaging, OSAT, and foundry partners
  • Knowledge of packaging and assembly industry standards
  • Proven understanding of fanout advanced packaging technologies
  • Hands-on experience in interposer or fanout package design for both organic and inorganic interposer with or without bridges such as CoWoS-L, CoWoS-R, EMIB, embedded fanout bridge from OSAT
  • Proven technical understanding of the full range of semiconductor packaging design, SMT processes, PCB design and layout tools, failure mechanisms and analytical techniques
  • In-depth knowledge of 2.5D and 3D packaging technologies, including silicon interposers, TSVs, and microbumps and advanced packages interaction with board-assembly constraints
  • Master's degree or PhD in Materials Science, Mechanical Engineering, or a related discipline

US: $146,000/year to $209,000/year + bonus + equity

From $25, paid onceGet the CV for this job

What happens when you press

One press. We do the rest.

  1. A CV for this posting

    Written against Meta's own wording, from every piece of relevant proof in your profile.

  2. 25 readers review it

    Recruiter, hiring manager, skeptic and more read every draft, round after round. You get the best round.

    The review screen in CV Rocket: how each CV was read, round by round.

  3. We apply on Meta's form

    Our application engine gets through the hardest forms there are. Where a question needs you, AI suggests the best answer. Don't want us applying from our IP addresses? Use our Chrome extension: we apply straight from your own browser.

    An application in CV Rocket: every answer filled in on the employer's form.

  4. Every reply, sorted

    Meta's answer lands in your private mailbox, and we classify it on arrival: interview, question, rejection.

    The CV Rocket inbox: each employer reply classified as an interview, an action or a rejection.

  5. Reply with AI

    AI helps you write the email, checks it and sends it. We show you whether the recruiter read it.

  6. The interview in your calendar

    Full integration with your calendar. The invitation goes straight in.

    An interview invitation in the CV Rocket inbox, added to the candidate's calendar.
Get the CV for this job

From $25 per CV, paid once. No subscription.

Why it works

3×

more interviews than doing it yourself with ChatGPT.

ChatGPT writes a CV and never learns what happened to it. We see every reply. For each CV we know:

  • How it was written, and how the review scored it
  • When we applied, and how long after the posting went up
  • Which posting, which company, which city
  • Who got the interview, and who heard nothing

That is how we know which CVs get called.

Get the CV for this job

From $25 per CV, paid once. No subscription.

The numbers game

More applications. More interviews.

Every application goes out with its own CV, written for that posting and paid once. Send enough of them and the law of large numbers finds you the job.

Get the CV for this job
By hand5–10
With CV Rocket100
applications a day

Nearby

Live postings like this one

Same employer first, then the same role elsewhere.

Before you press

Straight answers

Get the CV for this job

From $25 per CV, paid once. No subscription.

What if my background isn't good enough?

We make the most of the background you have. The CV uses every piece of relevant proof your profile holds, and one of the 25 readers reads your whole profile and flags what the CV left out.

Do you really apply for me?

Yes, on the employer's own form, the hardest ones included. Where a question needs you, you answer it right there and AI suggests the best answer. Don't want us applying from our IP addresses? Use our Chrome extension: we apply straight from your own browser.

Is it a subscription?

No. You pay once per CV, from $25. Every application goes out with its own CV, written for that posting.

One job. One CV.
Paid once.

Pick the posting you want. We write for it, apply for you and catch the reply.

Get the CV for this job

From $25 per CV, paid once. No subscription.