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[0580] Application / Process Engineer – Semiconductor Die Bonding / Advanced Packaging | Up to $6k / 5 days / Woodlands

MyCareersFuture94,028 open roles

Pay
SGD 3,000 – SGD 6,000 a month
Where
Central, Singapore
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Your applicationOpen now[0580] Application / Process Engineer – Semiconductor Die Bonding / Advanced Packaging | Up to $6k / 5 days / WoodlandsMyCareersFuture · Central, Singapore

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7.9% of postings close within 7 days. Measured by our own scanner across the market.

Share of postings closed within
  1. 1.6%1 day
  2. 3.4%3 days
  3. 7.9%7 days
  4. 14.2%14 days
  5. 34.1%30 days
This job: posted today

The posting

  • Working Location: Woodlands North Coast
  • Working Days: Monday – Friday
  • Working Hours: 9:00am -6:00pm
  • Starting Salary: $3,000 to $6,000

Responsibilities

  • Lead the design, development, optimization, and validation of software and hardware applications for advanced die bonding processes.
  • Analyze customer requirements and translate them into customized semiconductor packaging solutions, focusing on process optimization and application performance.
  • Conduct troubleshooting and failure analysis of die attach tools, process issues, and software application anomalies; implement corrective actions to enhance tool stability and reliability.
  • Perform machine setup, calibration, and alignment to ensure optimal process performance, repeatability, and yield.
  • Develop test procedures, application recipes, and documentation for process qualification and validation; maintain detailed logs and technical reports.
  • Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams to address technical challenges and implement design or process improvements.
  • Provide on-site support for complex customer applications, including training and coaching for field application engineers and customers to ensure proper tool usage and maximize system capabilities.
  • Serve as a key interface between customers and the R&D team, delivering user feedback to guide tool enhancements and feature development.

Job Requirement

  • Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, or related field).
  • 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.
  • Strong knowledge of advanced packaging technologies, such as Flip-Chip, PoP, wafer-level, or panel-level bonding.
  • Experience with semiconductor equipment integration, motion control systems, and process development.
  • Hands-on troubleshooting and problem-solving skills in a high-tech manufacturing or lab environment.
  • Willingness to travel for customer support and on-site installations (as required).

The Supreme HR Advisory Pte. Ltd || 14C7279

Chua Jie Ying (Cai Jie Ying), Evelynn || EA Personnel License R24120580

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