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Open nowPosted 29 days ago

5 days Application / Process Engineer (Die Bond Tools) up to $6000

MyCareersFuture94,028 open roles

Pay
SGD 3,000 – SGD 6,000 a month
Where
Central, Singapore
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Your applicationOpen now5 days Application / Process Engineer (Die Bond Tools) up to $6000MyCareersFuture · Central, Singapore

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Early applications get read.

7.7% of postings close within 7 days. Measured by our own scanner across the market.

Share of postings closed within
  1. 1.6%1 day
  2. 3.3%3 days
  3. 7.7%7 days
  4. 14.0%14 days
  5. 33.7%30 days
This job: posted 29 days ago

The posting

Application / Process Engineer (Die Bond Tools)

$3,000 – $6,000

Monday – Friday, 9:00am – 6:00pm

Woodlands

Benefit: AWS, Bonus, AL (14 - 21 days), Birthday Leave, Flexible Benefit

Job Responsibilities

  • Develop, optimize and validate die bonding processes, applications and equipment.
  • Set up, calibrate and qualify machines to achieve optimum performance and production yield.
  • Troubleshoot equipment and process issues, and implement corrective actions.
  • Develop process recipes, test procedures and technical documentation.
  • Work closely with R&D, Software, Mechanical, Electrical, Manufacturing and Quality teams to improve products and processes.
  • Provide technical support, equipment installation and application support at customer sites.
  • Conduct customer training and support Field Application Engineers on equipment operation.
  • Liaise with customers to understand application requirements and recommend suitable semiconductor packaging solutions.
  • Gather customer feedback and work with the R&D team on product improvements.

Requirements

  • Bachelor's or Master's Degree in Mechanical, Electrical, Materials Engineering or a related discipline.
  • Semiconductor manufacturing experience is required.
  • Minimum 3 years of experience in semiconductor packaging, die bonding equipment or advanced electronics manufacturing.
  • Good knowledge of advanced semiconductor packaging technologies (e.g. Flip Chip, PoP, WLP and PLP).
  • Experience with semiconductor equipment, motion control systems and process development is an advantage.
  • Hands-on troubleshooting and problem-solving experience in a manufacturing or laboratory environment.
  • Good communication skills and able to work independently as well as in a team.
  • Willing to travel for customer support, equipment installation and on-site technical assistance when required.

Company Name: Talent Recruitment Pte Ltd

EA License No: 24C2338

EA Personnel Name: Loke Sai Lye (Loke)

EA Personnel No: R24123366

Email: [email protected]

Contact Number: 81688648

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