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Open nowPosted 9 days ago

Engineer - Test Process (WLCSP)

MyCareersFuture94,028 open roles

Pay
SGD 3,500 – SGD 5,000 a month
Where
North, Singapore
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Your applicationOpen nowEngineer - Test Process (WLCSP)MyCareersFuture · North, Singapore

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The clock on this job

Early applications get read.

7.7% of postings close within 7 days. Measured by our own scanner across the market.

Share of postings closed within
  1. 1.6%1 day
  2. 3.3%3 days
  3. 7.7%7 days
  4. 14.0%14 days
  5. 33.7%30 days
This job: posted 9 days ago

The posting

Responsibilities

  • Support production operations across Taping, Backgrind (BG), Wafer Mounting, Laser Marking, Laser Grooving, and Dicing to ensure stable manufacturing output.
  • Lead new device introductions by driving recipe qualifications, data collection, and recipe optimization.
  • Troubleshoot process issues and manage machine setups to minimize downtime and reduce cycle times.
  • Conduct risk assessments to proactively identify and mitigate potential manufacturing hazards and defects.
  • Author and maintain critical engineering documentation, including SOPs, Work Instruction Procedures, and Out-of-Control Action Plans (OCAPs).
  • Generate technical reports and preserve accurate engineering data for audit readiness.
  • Collaborate with cross-functional teams to enforce strict SOP compliance and robust production line controls.
  • Drive continuous improvement by executing CIPs focused on quality enhancement, yield optimization, and cost reduction.
  • Enforce workplace standards, ensuring strict compliance with company policies, safety protocols, and 5S housekeeping.

Requirements

  • Bachelor's Degree in Engineering or a related technical discipline.
  • 3+ years of experience within a semiconductor manufacturing environment.
  • Hands-on expertise operating Taping, Backgrind, Lasermark, Wafer Mount, Laser Groove, Dicing, and PSI machinery.
  • Strong command of core quality tools, including 8D problem-solving, FMEA, Control Plans, and SPC.
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