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Open nowPosted 22 days ago

Mechanical Design Engineer ( Semiconductor Advanced Packaging Industry ) - YZ11

MyCareersFuture94,028 open roles

Pay
SGD 6,000 – SGD 9,000 a month
Where
Central, Singapore
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Your applicationOpen nowMechanical Design Engineer ( Semiconductor Advanced Packaging Industry ) - YZ11MyCareersFuture · Central, Singapore

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This job: posted 22 days ago

The posting

Position title : Semiconductor Advanced Packaging Mechanical Design Engineer

Location: Admirax St Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : SGD 6,000 – SGD 9,000/month (Based on experience and technical capability)

Responsibilities:

  • Design mechanical systems and modules for TCB, flip-chip, die-bonding, and advanced semiconductor packaging equipment.
  • Develop mechanical concepts, 3D models, detailed drawings, assembly drawings, BOMs, and technical documentation.
  • Design equipment modules such as:
  • - Wafer handling systems
  • - Substrate, strip, panel, or glass-panel handling systems
  • - Die ejection, die pickup, and die transfer mechanisms
  • - Precision XY, XYZ, XYZT, and multi-axis positioning stages
  • - Bondheads and thermal bondheads
  • - Micro-Z, force-control, compliance, and tip-tilt mechanisms
  • - Heating, cooling, vacuum, gas, and thermal isolation structures
  • - Conversion kits, change parts, fixtures, tooling, nests, and bond tools
  • Select suitable mechanical and motion components, including bearings, linear guides, motors, encoders, actuators, load cells, heaters, sensors, springs, and flexures.
  • Conduct tolerance stack-up and design reviews for critical precision assemblies.
  • Consider positioning accuracy, repeatability, structural stiffness, vibration, thermal expansion, force transmission, alignment, and serviceability in the design.
  • Work closely with process, electrical, software, vision, motion-control, manufacturing, procurement, and service teams.
  • Support machine assembly, alignment, integration, testing, troubleshooting, and customer qualification.
  • Investigate machine problems and implement practical design improvements.
  • Improve existing modules for better accuracy, reliability, cycle time, manufacturability, and cost.
  • Maintain proper engineering documentation and design-change records.

Requirements:

  • Diploma or bachelor’s degree in Mechanical Engineering, Mechatronics, Precision Engineering, Automation, or a related discipline.
  • Approximately 2 or more years of mechanical design experience in semiconductor equipment, precision automation, machine building, motion systems, or related industries.
  • Proficiency in 3D mechanical CAD software such as Creo, SolidWorks, Inventor, CATIA, NX, or equivalent.
  • Able to prepare detailed manufacturing and assembly drawings.
  • Good understanding of:
  • - Fits and tolerances
  • - GD&T
  • - Bearings and linear-motion components
  • - Machining and fabrication processes
  • - Material selection and surface treatment
  • - Mechanical assembly and alignment
  • Able to develop practical mechanism concepts rather than only produce drawings from instructions.
  • Willing to support machine assembly, debugging, testing, and continuous improvement.
  • Experience in semiconductor packaging or semiconductor automation equipment.
  • Experience designing precision, high-stiffness, or thermally stable machine modules.
  • Knowledge of thermal expansion, heater integration, thermal isolation, and temperature uniformity.
  • Experience with precision motion, force control, vacuum systems, pneumatics, or cleanroom-compatible equipment.
  • Experience with tolerance analysis, FEA, thermal simulation, or structural analysis.
  • Experience taking a module from concept through assembly, testing, and customer acceptance.
  • Familiarity with DFM, DFA, cost reduction, and engineering change control.
  • Experience with prototype, customised, or first-of-a-kind equipment development.

Tan Yen Zhen (Chen Yan Zhen) Reg No: R25138932

The SupremeHR Advisory Pte Ltd EA No: 14C7279

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