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Open nowPosted 9 days ago

Mechanical Engineer

MyCareersFuture94,028 open roles

Pay
SGD 8,000 – SGD 12,000 a month
Where
Central, Singapore
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Your applicationOpen nowMechanical EngineerMyCareersFuture · Central, Singapore

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  4. 14.0%14 days
  5. 33.7%30 days
This job: posted 9 days ago

The posting

Job Responsibilities

Module Design & Development: Responsible for 3D design optimization, 2D engineering drawing generation, and BOM preparation for core mechanical modules of TCB equipment, including bond heads, thermal compression heads, precision linear motor stages, frame transfer systems, and inert gas environment control systems.

Simulation & Verification: Utilize CAE simulation tools(such as ANSYS Workbench) to conduct static, modal, thermal, and kinematic simulations of mechanical structures to validate design feasibility and provide optimization recommendations; participate in the selection and verification of key off-the-shelf components (such as servo motors, cylinders, vacuum components, and seals).

Prototype Trial Production & Commissioning: Oversee machining follow-up, assembly guidance, and performance testing of prototype modules; collaborate with the process team to optimize bonding equipment(including bonder heads, stages, temperature/power controls), analyze test results, and identify design improvement points.

DFMA & Mass Production Support: Implement Design for Manufacturability and Assembly (DFMA) principles, coordinate with manufacturing engineers to ensure safe and robust module assembly; support the transfer ofnew designs from R&D to production, including technical handover, assembly process documentation, and on-site issue resolution.

Documentation & Compliance: Prepare and maintain mechanical design technical documents (such as FMEA, error budget analysis, assembly guidelines), ensuring designs comply with environmental, health, safety, and contamination control standards for semiconductor equipment.

Qualifications

Education: Bachelor's degree or above in Mechanical Engineering, Mechanical Design & Manufacturing and Automation, Mechatronics, or related fields.

Industry Experience: 3-5 years of mechanical design and development experience, with a track record of independently completing the design and optimization of key functional modules for equipment; candidates with a background in the semiconductor packaging and testing industry, particularly in designing TCB (Thermal Compression Bonding), Die/Wire Bonder, Flip Chip, or AOI equipment, are preferred.

Professional Skills:

Proficient in 3D modeling using SolidWorks, Creo, or UG, and skilled in generating 2D drawings with AutoCAD;

Familiar with the selection and application of standard transmission off-the-shelf components; experience in designing precision motion platforms for TCB equipment is a strong advantage;

Capable of finite element analysis (such as structural/thermal simulation using ANSYS Workbench), with solid knowledge of tolerance fits, material mechanics, and machining processes.

General Competencies: Strong logical thinking, problem analysis, and problem-solving skills; familiarity with data analysis tools such as SPC and JMP, as well as FMEA methodology, is a plus; strong team spirit, with the ability to handle short-term business trips or on-site commission in gas required.

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