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Open nowPosted 10 days ago

MEMS Fab Process Development Engineer (Dry Etch)

MyCareersFuture94,028 open roles

Pay
SGD 4,000 – SGD 8,000 a month
Where
Central, Singapore
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Your applicationOpen nowMEMS Fab Process Development Engineer (Dry Etch)MyCareersFuture · Central, Singapore

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  2. 3.3%3 days
  3. 7.7%7 days
  4. 14.0%14 days
  5. 33.7%30 days
This job: posted 10 days ago

The posting

What a Dry Etch Process Engineer does in HP include:

  • Own and sustain dry etch processes for silicon and oxide etching modules to support high-volume manufacturing and new product introduction (NPI).
  • Drive process optimization, defect reduction, yield improvement, and process robustness through data analysis, DOE, and continuous improvement projects.
  • Investigate process excursions, yield loss, and defectivity issues using structured problem-solving methodologies, and implement effective corrective and preventive actions.
  • Develop and maintain process control plans, SPC monitoring, OCAPs, specifications, and process documentation.
  • Collaborate closely with equipment engineers to resolve process-related equipment issues and establish effective process monitoring strategies.
  • Lead process characterization, qualification, and release activities for new products, materials, consumables, and process changes.
  • Support process transfer, technology development, and process integration activities across engineering and manufacturing teams.
  • Analyze process performance data and drive improvements in critical process metrics, including yield, defectivity, process capability, and throughput.
  • Work closely with cross-functional teams including Process Integration, Manufacturing, Equipment Engineering, Quality, and Product Development to achieve business objectives.
  • Provide technical guidance and training to technicians and manufacturing personnel on process operation, troubleshooting, and best practices.
  • Support quality, and compliance audits to ensure process and documentation adherence to internal and external requirements.

Individuals who will do well in the role usually possess:

  • Bachelor's or Master's Degree in Chemical Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or related disciplines.
  • Minimum 2–5 years of hands-on semiconductor wafer fab experience in dry etch process engineering.
  • Strong knowledge of plasma etching fundamentals, particularly silicon etch, oxide etch, and profile control. Experience with process development, process characterization, DOE, SPC, and statistical data analysis.
  • Experience supporting high-volume manufacturing with demonstrated success in yield improvement and defect reduction projects.
  • Familiarity with semiconductor process integration and interactions between dry etch and upstream/downstream process modules.
  • Experience with process troubleshooting using engineering methodologies such as 8D, DMAIC, or root cause analysis techniques.
  • Knowledge of process control systems, FDC, APC, SPC, and process monitoring methodologies is advantageous.
  • Strong analytical and problem-solving skills with the ability to handle complex technical challenges independently.
  • Good communication, presentation, and technical documentation skills. Self-motivated, proactive, and able to work effectively in a fast-paced manufacturing environment.
  • Good team player with strong collaboration skills across global and cross-functional teams.
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