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Open nowPosted 16 days ago

Package Design Engineer

MyCareersFuture94,028 open roles

Pay
SGD 9,000 – SGD 16,000 a month
Where
North, Singapore
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Your applicationOpen nowPackage Design EngineerMyCareersFuture · North, Singapore

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This job: posted 16 days ago

The posting

Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters (ADC & DAC). You will be part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 200G and higher, RF/Microwave ADC/DAC, DDR, HBM, and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design.

RESPONSIBILITIES:

  • Overall design responsibility for ASIC package designs (layout/routing), including aspects of impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
  • Package Design of critical high frequency/datarate structures for SerDes, ADC/DAC, DDR, HBM, etc.
  • Schedule, prioritize, & track your work across multiple projects simultaneously
  • General flip-chip BGA package design & engineering

EDUCATION/EXPERIENCE & REQUIREMENTS:

  • B.Eng (EE/EEE) or similar field and 5+ years’ experience in flip-chip-BGA package design, including high-speed SerDes
  • M.Eng (EE/EEE) or similar field and 3+ years’ experience in flip-chip-BGA package design, including high-speed SerDes
  • Knowledge of package-level signal integrity and power integrity, to apply to package designs
  • Cadence APD (allegro package designer) experience is preferred. Equivalent tools will also be considered.
  • Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers.
  • Good organizational and task management skills to manage multiple package design projects.

PREFERRED EDUCATION/EXPERIENCE & REQUIREMENTS:

  • B.Eng (EE/EEE) or similar field and 8+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred.
  • M.Eng (EE/EEE) or similar field and 6+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred.
  • Experience with 2.5D and 3DIC packages is highly advantageous.
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