The posting
Key Responsibilities
- Process Setup: Program and optimize die-attach, eutectic, and thermo-compression bonding equipment.
- Application Engineering: Evaluate customer requirements, run feasibility studies, and manage sample fabrication for New Product Introduction (NPI).
- Quality & Inspection: Set up Automated Optical Inspection (AOI) programs and establish criteria to detect defects (voids, tilt, misalignment).
- Yield Improvement: Use DOE and SPC to resolve process variations, perform root-cause failure analysis, and write SOPs.
Required Qualifications
- Education: Degree in Mechanical, Electrical, Materials Engineering, or related fields.
- Experience: 2+ years in semiconductor packaging or microelectronics assembly.
- Technical Skills: Hands-on experience programming bonding equipment and automated vision/inspection systems.
- Tools: Familiarity with failure analysis (shear testing, X-ray) and statistical software (Minitab/JMP).



