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Open nowPosted 16 days ago

Process Engineering (Diffusion Process) - GRIT Traineeship

MyCareersFuture94,028 open roles

Pay
SGD 2,000 a month
Where
East, Singapore
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Your applicationOpen nowProcess Engineering (Diffusion Process) - GRIT TraineeshipMyCareersFuture · East, Singapore
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This job: posted 16 days ago

The posting

The trainee will undergo a structured 6-month on-the-job training programme within the Diffusion Process Engineering team in a 300mm semiconductor wafer fabrication facility. The programme is designed for fresh Polytechnic graduates to develop foundational knowledge and practical skills in semiconductor manufacturing, diffusion process technology, statistical process control (SPC), data analysis, and process improvement. Under the guidance of experienced engineers, the trainee will gain hands-on experience supporting manufacturing operations while developing the competencies required for an Associate Engineer role.

1. Learn semiconductor manufacturing fundamentals and the role of Diffusion processes in wafer fabrication.

2. Support monitoring of daily Diffusion process performance, equipment status, and process indicators.

3. Assist in process data collection, analysis, and reporting using SPC and manufacturing systems.

4. Monitor process trends and participate in excursion investigations under engineer supervision.

5. Support process optimization and continuous improvement activities to improve quality, yield, and productivity.

6. Collaborate with Process, Equipment, Manufacturing, and Quality teams to understand fab operations and engineering practices.

7. Complete a structured process improvement project and present findings and recommendations at the end of the traineeship.

Requirement '- Fundamentals of semiconductor wafer fabrication.

- Understanding of Diffusion processes, including oxidation, annealing, and dopant activation.

- Statistical Process Control (SPC) and Process monitoring techniques.

- manufacturing data analysis and interpretation.

- Structured problem-solving and root cause analysis methodologies.

- Process stability, yield improvement, and continuous improvement principles.

- Technical reporting, presentation, and communication skills.

- teamwork and stakeholder collaboration in a semiconductor manufacturing environment.

- safety, quality, and cleanroom compliance awareness.

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