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Open nowPosted 14 days ago

Product Integration Lead, HIG High Bandwidth Memory

MyCareersFuture94,028 open roles

Pay
SGD 9,000 – SGD 15,900 a month
Where
North, Singapore
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Your applicationOpen nowProduct Integration Lead, HIG High Bandwidth MemoryMyCareersFuture · North, Singapore

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This job: posted 14 days ago

The posting

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Product Integration Lead in the HIG HBM Product Development Team at Micron Technology, you will be responsible for integrating Micron's leading edge HBM products into end-system requirements. You will be the key representative driving HBM development swimlane requirements (SCD) to meet end-systems needs. With a deep understanding of both HBM and System capabilities, you will set Product Development priorities and manage new change initiative requests to meet rapidly evolving customer demands with agility. You will drive resolution of technical challenges in the development cycle, identifying opportunities to ensure HBM solutions are executed within the boundary of development schedule, risks and incremental development costs.

Key Responsibilities include, but are not limited to:

  • Manage technical inputs and drive silicon-system alignment on requirements and commitments using the Success Criteria Document (SCD).
  • Collaborate with HBM Architecture, Product and Systems Engineering, Business Unit, Technology Development, Packaging and Global Quality Teams to achieve competitive systems and resolve any gaps between HBM commit and system requirements.
  • Understand sample usage and any gaps in capability to system requirements, managing HBM sample delivery in sync with system development needs and timelines. Assist with risk assessment of identified issues.
  • Lead Triage Team for any System or Chip Feature Interaction requiring clarity of failure ownership domain. Coordinate mitigations with key stakeholders.
  • Manage Qualification Definition and Changes, driving the Change Control Board for Late/Post Qual Changes.
  • Communicate proper priorities within HBM Development team to maintain focus on achieving system specs and address concerns with Component and System teams.
  • Using, applying and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision making across projects and teams.​

Key Requirements:

  • Bachelor’s Degree or Master’s Degree in Electrical or Computer Engineering.
  • 8+ years of demonstrated ability in Product, Design, Process, Yield Enhancement, or related engineering fields.
  • Experience with product development projects is preferred.
  • Programming skills in python/ java/ C/ VB.
  • Tableau and PowerBI development experience is plus.
  • Proven capability to lead technical issues to closure with creative, effective solutions through a highly collaborative approach.
  • Desire to develop knowledge and expertise in overall HBM to System development. Knowledge of DRAM/HBM device/design and system management is beneficial.
  • Excellent interpersonal, communication and presentation skills to gather technical information from engineering key stakeholders and drive technical issue resolution/mitigation.
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